| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/11/2002 | EP1116159B1 Electrical connector for the simultaneous connection of two electronic-memory cards |
| 12/11/2002 | CN1384700A Manufacture of multi-layered ceramic substrate |
| 12/11/2002 | CN1384698A Method and apparatus for producing single ceramic electronic element |
| 12/11/2002 | CN1384697A Wire circuit board |
| 12/11/2002 | CN1384590A Power sourc system for microprocessor |
| 12/11/2002 | CN1384512A Laminated dielectrical sheet for capacity and its production process |
| 12/11/2002 | CN1384138A Photosensitive insulated glue composition and photosensitive film of the glue |
| 12/11/2002 | CN1384123A Synthesis of polymer and film of the polymer |
| 12/11/2002 | CN1096222C Printed circuit multilayer assembly and method of manufacture therefor |
| 12/11/2002 | CN1096221C Cleaning device for contact surface on PCB |
| 12/11/2002 | CN1096220C Press type circuit board auxiliary locator |
| 12/10/2002 | US6493861 Interconnected series of plated through hole vias and method of fabrication therefor |
| 12/10/2002 | US6493511 FPC (flexible printed circuit) board arrangement structure for zoom lens barrels |
| 12/10/2002 | US6493240 Interposer for connecting two substrates and resulting assembly |
| 12/10/2002 | US6493228 Heat radiation packaging structure for an electric part and packaging method thereof |
| 12/10/2002 | US6493198 Electrostatic discharge protection device for a high density printed circuit board |
| 12/10/2002 | US6493064 Method and apparatus for registration control in production by imaging |
| 12/10/2002 | US6492948 Antenna base |
| 12/10/2002 | US6492881 Single to differential logic level interface for computer systems |
| 12/10/2002 | US6492773 Self-ballasted fluorescent lamp |
| 12/10/2002 | US6492714 Semiconductor device and semiconductor module |
| 12/10/2002 | US6492713 Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components |
| 12/10/2002 | US6492698 Flexible circuit with two stiffeners for optical module packaging |
| 12/10/2002 | US6492620 Equipotential fault tolerant integrated circuit heater |
| 12/10/2002 | US6492616 Processes for laser beam machining of resin film for wiring boards and manufacture of wiring boards |
| 12/10/2002 | US6492600 Laminate having plated microvia interconnects and method for forming the same |
| 12/10/2002 | US6492599 Multilayer wiring board, manufacturing method thereof, and wafer block contact board |
| 12/10/2002 | US6492597 Wiring substrate, multi-layered wiring substrate and method of fabricating those |
| 12/10/2002 | US6492443 Norbornene polymer composition |
| 12/10/2002 | US6492253 Method for programming a substrate for array-type packages |
| 12/10/2002 | US6492201 Forming microelectronic connection components by electrophoretic deposition |
| 12/10/2002 | US6492030 Siloxane denatured polyimide, di- or triallyl compound and dimaleimide compound; adheres to metals with low dielectric constant and dissipation factor; faster signal processing; high frequency electronics with miniaturized circuits |
| 12/10/2002 | US6492009 Manufacture and method for obtaining accurately dimensioned features from a metal-containing web processed with a continuous etch process |
| 12/10/2002 | US6492008 Multilayer printed wiring board and electronic equipment |
| 12/10/2002 | US6491529 Molded and plated electrical interface component |
| 12/10/2002 | US6491528 Method and apparatus for vibration and temperature isolation |
| 12/10/2002 | US6491526 Riser card assembly and method for its installation |
| 12/10/2002 | US6490926 Acceleration sensor module |
| 12/10/2002 | US6490786 Circuit assembly and a method for making the same |
| 12/06/2002 | CA2383320A1 Printed circuit board |
| 12/05/2002 | WO2002098194A1 Copper plated circuit layer-carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer-carrying copper clad laminated sheet |
| 12/05/2002 | WO2002098193A1 A method for applying thick copper on substrates |
| 12/05/2002 | WO2002097724A1 Multi-feature-size electronic structures |
| 12/05/2002 | WO2002097534A2 Apparatus and method for aligning an article with a reference object |
| 12/05/2002 | WO2002097366A1 Observation device using light and x-ray, exposure system and exposure method |
| 12/05/2002 | WO2002096987A1 Copper foil with resin and printed wiring boards made by using the same |
| 12/05/2002 | WO2002096969A1 Light- and heat-curing resin composition |
| 12/05/2002 | WO2002096640A1 Recessed patterns in a multilayered ceramic package |
| 12/05/2002 | WO2002074025A3 Multilayer printed circuit board |
| 12/05/2002 | WO2001069458A3 Optimized structure for the fanout of smd components during the routing of printed-circuit boards |
| 12/05/2002 | US20020184426 Method of terminating bus, bus termination resistor, and wiring substrate having terminated buses and method of its manufacture |
| 12/05/2002 | US20020182958 Multilayer printed wiring board |
| 12/05/2002 | US20020182929 Battery pack circuit board with a position-variable connector |
| 12/05/2002 | US20020182911 Voltage isolator connector device for printed circuit board assembly |
| 12/05/2002 | US20020182903 Printed wiring board and manufacturing method therefor |
| 12/05/2002 | US20020182899 Fragmented backplane system for I/O applications |
| 12/05/2002 | US20020182817 Resist mask for measuring the accuracy of overlaid layers |
| 12/05/2002 | US20020182804 Capacitor sheet, method for producing the same, board with built-in capacitors, and semiconductor device |
| 12/05/2002 | US20020182540 For forming an electrode arrangement for a plasma display panel device |
| 12/05/2002 | US20020182536 Polyimides and polyamic acids |
| 12/05/2002 | US20020182434 Copper clad laminate with copper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with copper-plated circuit layer |
| 12/05/2002 | US20020182398 Rigid-printed wiring board and production method of the rigid-printed wiring board |
| 12/05/2002 | US20020182374 Lamination method of embedding passive components in an organic circuit board |
| 12/05/2002 | US20020182025 Detailing tool for substrates having a self-alignment feature |
| 12/05/2002 | US20020181231 Diode lighting system |
| 12/05/2002 | US20020181217 Midplane for data processing apparatus |
| 12/05/2002 | US20020181216 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 12/05/2002 | US20020181215 Midplane circuit board assembly |
| 12/05/2002 | US20020181214 Module having integrated circuit packages coupled to multiple sides with package types selected based on inductance of leads to couple the module to another component |
| 12/05/2002 | US20020181211 Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| 12/05/2002 | US20020181210 Flexible printed circuit board |
| 12/05/2002 | US20020181208 Multi-feature-size electronic structures |
| 12/05/2002 | US20020181185 Multi-layer wiring board |
| 12/05/2002 | US20020181183 Sole structure for electrostatic dissipative footwear and method of making same |
| 12/05/2002 | US20020181155 Head suspension for disk drive and method of manufacturing head suspension |
| 12/05/2002 | US20020180923 Liquid crystal display device |
| 12/05/2002 | US20020180686 Liquid crystal display device having a drive IC mounted on a flexible board directly connected to a liquid crystal panel |
| 12/05/2002 | US20020180645 Low-loss printed circuit board antenna structure and method of manufacture thereof |
| 12/05/2002 | US20020180567 Microwave circuit |
| 12/05/2002 | US20020180557 Suspended transmission line with embedded signal channeling device |
| 12/05/2002 | US20020180517 Signal buffers for printed circuit boards |
| 12/05/2002 | US20020180465 Wideband bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure |
| 12/05/2002 | US20020180430 Fixture for plate type magnetic resistance sensor chip element |
| 12/05/2002 | US20020180259 High integration electronic assembly and method |
| 12/05/2002 | US20020180063 Semiconductor module |
| 12/05/2002 | US20020180027 Semiconductor module and method of making the device |
| 12/05/2002 | US20020180015 Semiconductor module |
| 12/05/2002 | US20020180004 Circuitized substrate for high-frequency applications |
| 12/05/2002 | US20020179332 Wiring board and a method for manufacturing the wiring board |
| 12/05/2002 | US20020179329 Method for fabricating wiring board provided wiht passive element, and wiring board provided with passive element |
| 12/05/2002 | US20020179328 Method of mounting electronic parts with Sn-Zn solder free of Pb without reduction in bonding strength |
| 12/05/2002 | US20020179327 Semiconductor chip soldering land pattern |
| 12/05/2002 | US20020179325 Electrical connection with inwardly deformable contact |
| 12/05/2002 | US20020179324 Method and structure for repairing or modifying surface connections on circuit boards |
| 12/05/2002 | US20020179322 Method of packaging electronic components without creating unnecessary solder balls |
| 12/05/2002 | US20020179321 Liquid dielectrick tuning of an integrated circuit |
| 12/05/2002 | US20020179320 Flexible conductive sheet |
| 12/05/2002 | US20020179319 ESD safe wireless type of component |
| 12/05/2002 | US20020179313 Cable connection structure and electronic apparatus having the same |
| 12/05/2002 | US20020179289 Power module and method of manufacturing the same |