| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/25/2003 | US6523257 Method for forming fine through hole conduction portion of circuit board |
| 02/25/2003 | US6523253 Z-axis processor power delivery system |
| 02/25/2003 | US6523252 Coaxial cable, method for manufacturing a coaxial cable, and wireless communication device |
| 02/25/2003 | US6523251 Method for removing insulation from a flat cable |
| 02/25/2003 | US6523250 Method of attaching a slider with head transducer to a suspension |
| 02/20/2003 | WO2003015490A2 Method for fabricating large area flexible electronics |
| 02/20/2003 | WO2003015484A1 Card manufacturing technique and resulting card |
| 02/20/2003 | WO2003015482A2 A system and method for unveiling targets embedded in a multi-layered electrical circuit |
| 02/20/2003 | WO2003015395A1 Image sensing apparatus including a microcontroller |
| 02/20/2003 | WO2003014438A1 Yarn of ethylene/tetrafluoroethylene copolymer |
| 02/20/2003 | WO2003014425A1 Copper on invar composite and method of making |
| 02/20/2003 | WO2003014177A1 Resin composition, composition for solder resist, and cured article obtained therefrom |
| 02/20/2003 | WO2002096176A3 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield |
| 02/20/2003 | WO2002063686A3 High performance silicon contact for flip chip |
| 02/20/2003 | WO2002035897A9 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production |
| 02/20/2003 | WO2001073883A3 Low-temperature fabrication of thin-film energy-storage devices |
| 02/20/2003 | US20030036269 Method of removing smear from via holes |
| 02/20/2003 | US20030036020 Photosensitive conductive paste, method for forming conductive pattern using the same, and method for manufacturing ceramic multilayer element |
| 02/20/2003 | US20030035951 Multi-component fibers having enhanced reversible thermal properties and methods of manufacturing thereof |
| 02/20/2003 | US20030035280 Daughter-card structural support |
| 02/20/2003 | US20030035277 Reducing inductance of a capacitor |
| 02/20/2003 | US20030035275 Device and method for interstitial components in a printed circuit board |
| 02/20/2003 | US20030035252 Circuit board capable of preventing electrostatic breakdown and magnetic head using the same |
| 02/20/2003 | US20030035033 Asymmetrical tape automated bonding device for a printhead cartridge |
| 02/20/2003 | US20030035028 Ink jet recording apparatus utilizing printhead cartridges with asymmetrical contacts |
| 02/20/2003 | US20030035024 Printhead cartridge with asymmetrical contacts |
| 02/20/2003 | US20030034868 Coupling adjusting structure for double-tuned circuit |
| 02/20/2003 | US20030034855 Printed circuit suppression of high-frequency spurious signals |
| 02/20/2003 | US20030034854 Differential transmission line for high bandwidth signals |
| 02/20/2003 | US20030034832 Routing technique to adjust clock skew |
| 02/20/2003 | US20030034566 Reduction of chip carrier flexing during thermal cycling |
| 02/20/2003 | US20030034565 Flip chip substrate with metal columns |
| 02/20/2003 | US20030034557 Chip carrier for a semiconductor chip module |
| 02/20/2003 | US20030034554 Composite ceramic board, method of producing the same, optical/electronic-mounted circuit substrate using said board, and mounted board equipped with said circuit substrate |
| 02/20/2003 | US20030034441 Sub chip on board for optical mouse |
| 02/20/2003 | US20030034394 Optical reader comprising finely adjustable lens assembly |
| 02/20/2003 | US20030034381 Packaging method using lead-free solder |
| 02/20/2003 | US20030034173 Bump-attached wiring circuit board and method for manufacturing same |
| 02/20/2003 | US20030034127 Mixture of anisotropic conductive paste and polymer |
| 02/20/2003 | US20030034122 Unfired-ceramic-body procesing method |
| 02/20/2003 | CA2456652A1 Image sensing apparatus including a microcontroller |
| 02/20/2003 | CA2451917A1 Yarn of ethylene/tetrafluoroethylene copolymer |
| 02/19/2003 | EP1284590A1 Device for connecting connection lines with a resilient layered connecting element |
| 02/19/2003 | EP1284523A2 Discrete solder ball contact and circuit board assembly utilizing same |
| 02/19/2003 | EP1284502A1 Device having resin package and method of producing the same |
| 02/19/2003 | EP1284501A1 Device having resin package and method of producing the same |
| 02/19/2003 | EP1284094A2 Electrically connecting integrated circuits and transducers |
| 02/19/2003 | EP0770260B1 Variable voltage protection structures and methods for making same |
| 02/19/2003 | CN2537198Y Copper foil coated composite dielectric substrate |
| 02/19/2003 | CN1398506A Appts. for coupling power to electronics module |
| 02/19/2003 | CN1398448A Contact structure and prodn. method thereof and probe contact assembly using same |
| 02/19/2003 | CN1398154A 印刷电路板 A printed circuit board |
| 02/19/2003 | CN1398153A Mfg. method of circuit device |
| 02/19/2003 | CN1398150A 布线电路板 Wiring circuit board |
| 02/19/2003 | CN1398149A Printed circuit board with radiating element, its mfg. method and device contg. it |
| 02/19/2003 | CN1398148A 柔性电路板 The flexible circuit board |
| 02/19/2003 | CN1398050A R-T unit |
| 02/19/2003 | CN1397657A Copper alloy foil for laminated board |
| 02/19/2003 | CN1397595A Low permittivity insulating film compsn., insulating film forming process and electronic parts |
| 02/19/2003 | CN1397583A Okumura acid, polyimide and optical material |
| 02/19/2003 | CN1397426A Resin coated metal foil and multilayer printed circuit board |
| 02/18/2003 | US6522828 Electrical power distribution system |
| 02/18/2003 | US6522555 Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein |
| 02/18/2003 | US6522378 Liquid crystal display and manufacture therefore |
| 02/18/2003 | US6522308 Variable capacitance coupling antenna |
| 02/18/2003 | US6522222 Electromagnetic delay line with improved impedance conductor configuration |
| 02/18/2003 | US6522214 Electrical transmission line arrangement with a cross-over |
| 02/18/2003 | US6522173 Electronic device |
| 02/18/2003 | US6522128 Position sensor having compact arrangement of coils |
| 02/18/2003 | US6522073 Plasma display panel with an auxiliary bonding pad |
| 02/18/2003 | US6522019 Ball grid array chip packages having improved testing and stacking characteristics |
| 02/18/2003 | US6522018 Ball grid array chip packages having improved testing and stacking characteristics |
| 02/18/2003 | US6522017 Wiring board and semiconductor device |
| 02/18/2003 | US6522011 Low capacitance wiring layout and method for making same |
| 02/18/2003 | US6521993 Semiconductor memory module having double-sided stacked memory chip layout |
| 02/18/2003 | US6521990 Ball grid array package comprising a heat sink |
| 02/18/2003 | US6521984 Semiconductor module with semiconductor devices attached to upper and lower surface of a semiconductor substrate |
| 02/18/2003 | US6521881 Stacked structure of an image sensor and method for manufacturing the same |
| 02/18/2003 | US6521846 Method for assigning power and ground pins in array packages to enhance next level routing |
| 02/18/2003 | US6521845 Thermal spreading enhancements for motherboards using PBGAs |
| 02/18/2003 | US6521844 Through hole in a photoimageable dielectric structure with wired and uncured dielectric |
| 02/18/2003 | US6521843 Multilayer printed circuit board having signal, power and ground through holes |
| 02/18/2003 | US6521842 Hybrid surface mount and pin thru hole circuit board |
| 02/18/2003 | US6521841 Test coupon in printed wiring board |
| 02/18/2003 | US6521838 Heat-resistant, flex-resistant flexible flat cable and process for producing the same |
| 02/18/2003 | US6521830 Housing for electrical or electronic devices with integrated conductor tracks |
| 02/18/2003 | US6521530 Composite interposer and method for producing a composite interposer |
| 02/18/2003 | US6521480 Method for making a semiconductor chip package |
| 02/18/2003 | US6521355 Fluorescent dye, electronic component |
| 02/18/2003 | US6521153 Method for in-situ green sheet slitting |
| 02/18/2003 | US6521069 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board |
| 02/18/2003 | US6520805 Memory module with offset notches for improved insertion and stability and memory module connector |
| 02/18/2003 | US6520780 Power relay module |
| 02/18/2003 | US6520779 Circuit member connection structure |
| 02/18/2003 | US6520109 Heat insulation arrangement of indicating instrument |
| 02/18/2003 | US6519843 Method of forming a chip carrier by joining a laminate layer and stiffener |
| 02/18/2003 | US6519842 Method for mounting semiconductor device |
| 02/13/2003 | WO2003013205A1 Portable apparatus |
| 02/13/2003 | WO2003013201A1 Method for forming device-landing pad of multi-layered printed circuit board |
| 02/13/2003 | WO2003013200A1 Circuit module |