| Patents for H05K 1 - Printed circuits (98,583) |
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| 01/07/2003 | US6502298 Method of electroforming a slip ring |
| 01/05/2003 | CA2391223A1 Circuit board, method for manufacturing same, and high-output module |
| 01/05/2003 | CA2391218A1 Cicuit board, method for manufacturing same, and high-output module |
| 01/03/2003 | WO2003001862A1 Circuit carrier with a fiducial, method for the production thereof and quality inspection method |
| 01/03/2003 | WO2003001859A1 Method and device for testing electronic devices |
| 01/03/2003 | WO2003001596A1 Electronic device and method for manufacturing the same |
| 01/03/2003 | WO2003001594A2 High-voltage module and method for producing the same |
| 01/03/2003 | WO2003001299A1 Material having a conductive pattern; and a material and method for making a conductive pattern |
| 01/03/2003 | WO2003001254A2 Apparatus for holding an optical element |
| 01/03/2003 | WO2003000619A1 Ceramic component and production method therefor |
| 01/03/2003 | WO2002089257A3 Connection housing for an electronic component |
| 01/03/2003 | WO2002080640A3 Shunt power connection for an integrated circuit package |
| 01/03/2003 | WO2002054414A3 Fat conductor |
| 01/02/2003 | US20030005397 Method and apparatus for PCB array with compensated signal propagation |
| 01/02/2003 | US20030004218 Porous materials |
| 01/02/2003 | US20030003862 Electronic component and mobile communication device using the electronic component |
| 01/02/2003 | US20030003809 Disc drive circuit board edge connector |
| 01/02/2003 | US20030003803 Electrical connector |
| 01/02/2003 | US20030003800 Terminating floating signals on a bga module to a ground plane on a ball grid array (bga) circuit board site |
| 01/02/2003 | US20030003799 Double-deck electrical connector with cross-talk compensation |
| 01/02/2003 | US20030003780 Integrated ball grid array-pin grid array-flex laminate assembly |
| 01/02/2003 | US20030003779 Flexible compliant interconnect assembly |
| 01/02/2003 | US20030003778 Backplane structure capable of being mounted with two interface cards |
| 01/02/2003 | US20030003740 Contact structure production method |
| 01/02/2003 | US20030003706 Substrate with top-flattened solder bumps and method for manufacturing the same |
| 01/02/2003 | US20030003705 Vertical electronic circuit package and method of fabrication therefor |
| 01/02/2003 | US20030003629 Hybrid integrated circuit device and manufacturing method thereof |
| 01/02/2003 | US20030003305 Polytriazine product of cyanate ester monomer or prepolymer and a bismaleimide, and a flame inhibitor of a polyepoxide reacted with an organic phosphorus compound |
| 01/02/2003 | US20030003287 Heat conductive resin substrate and semiconductor package |
| 01/02/2003 | US20030002872 Camera with electronic flash device |
| 01/02/2003 | US20030002770 Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board |
| 01/02/2003 | US20030002656 Splitter assembly with high density backplane board |
| 01/02/2003 | US20030002641 Splitter assembly with inverted pots and line connectors |
| 01/02/2003 | US20030002541 Mid-connect architecture with point-to-point connections for high speed data transfer |
| 01/02/2003 | US20030002282 Modular mounting arrangement and method for light emitting diodes |
| 01/02/2003 | US20030002268 Ultra-low impedance power interconnection system for electronic packages |
| 01/02/2003 | US20030002264 Manufacturing method for a flexible PCB |
| 01/02/2003 | US20030002263 HDI circuit board and method of production of an HDI circuit board |
| 01/02/2003 | US20030002262 Electronic printed circuit board having a plurality of identically designed, housing-encapsulated semiconductor memories |
| 01/02/2003 | US20030002260 Electronic apparatus |
| 01/02/2003 | US20030002213 Glass epoxy board and magnetic head device |
| 01/02/2003 | US20030002205 Flexible disk drive with a heat release structure for releasing self heat generated from an electronic component mounted thereto |
| 01/02/2003 | US20030002003 Display module |
| 01/02/2003 | US20030001932 Ink jet charge plate with integrated flexible lead connector structure |
| 01/02/2003 | US20030001783 Antenna base |
| 01/02/2003 | US20030001719 Resistors |
| 01/02/2003 | US20030001698 Transmission structure with an air dielectric |
| 01/02/2003 | US20030001687 Single to differential interfacing |
| 01/02/2003 | US20030001288 Ball grid array chip packages having improved testing and stacking characteristics |
| 01/02/2003 | US20030001287 Flexible tape electronics packaging |
| 01/02/2003 | US20030001256 Wiring substrate having position information |
| 01/02/2003 | US20030001251 Wafer level interconnection |
| 01/02/2003 | US20030001237 Flexible polyimide circuits having predetermined via angles |
| 01/02/2003 | US20030001139 Liquid crystal polyester resin composition |
| 01/02/2003 | US20030000916 Method and apparatus for structuring printed circuit borads |
| 01/02/2003 | US20030000739 Circuit housing clamp and method of manufacture therefor |
| 01/02/2003 | US20030000738 Solder resist opening to define a combination pin one indicator and fiducial |
| 01/02/2003 | US20030000735 Multilayered printed circuit board |
| 01/02/2003 | US20030000734 Printed-wiring board, method for identifying same, and method for manufacturing same |
| 01/02/2003 | US20030000723 Method for making a circuit assembly having an integal frame |
| 01/02/2003 | US20030000081 Method for reducing coefficient of thermal expansion in chip attach packages |
| 01/02/2003 | US20030000079 Method for manufacturing multilayer ceramic substrates |
| 01/02/2003 | EP1272022A2 Multilayer wiring board and method of manufacturing the same |
| 01/02/2003 | EP1272020A1 Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body |
| 01/02/2003 | EP1272019A1 Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof |
| 01/02/2003 | EP1272018A2 Method of mounting electronic parts with Sn-Zn solder free of Pb |
| 01/02/2003 | EP1272017A1 Copper-clad laminated sheet |
| 01/02/2003 | EP1272016A2 Resin-molded board |
| 01/02/2003 | EP1271719A2 Method and device for folding flat ribbon cables |
| 01/02/2003 | EP1271698A1 Module connector device for avionics industry |
| 01/02/2003 | EP1271649A2 Multi-die module and method thereof |
| 01/02/2003 | EP1271644A1 Wiring board, semiconductor device, and method of manufacturing wiring board |
| 01/02/2003 | EP1271578A2 Thermosetting composite dielectric film and method of manufacturing the same |
| 01/02/2003 | EP1271323A2 Redundant backplane interconnect for electronic devices |
| 01/02/2003 | EP1270644A1 Active energy ray-curable polyimide resin composition |
| 01/02/2003 | EP1270632A1 Phosphorus-containing epoxy resin, flame-retardant highly heat-resistant epoxy resin composition containing the resin, and laminate |
| 01/02/2003 | EP1270167A1 Method for producing an apparatus housing |
| 01/02/2003 | EP1269808A1 Method for fabricating electrical connecting elements, and connecting element |
| 01/02/2003 | EP1269807A1 Method for fabricating electrical connecting element, and electrical connecting element |
| 01/02/2003 | EP1269806A2 Electronic printed-circuit board for electronic devices, especially communications terminals |
| 01/02/2003 | EP1269805A1 Electrical circuit and substrate therefor |
| 01/02/2003 | EP1269804A1 Electrical connecting element and method of fabricating the same |
| 01/02/2003 | EP1269584A1 Channel-shaped connection device for electrical lines of internal combustion engines |
| 01/02/2003 | EP1269505A1 Inverted board mounted electromechanical device |
| 01/02/2003 | EP1269496A1 Method for producing a tag or a chip card, device for implementing said method and tag or chip card produced according to said method |
| 01/02/2003 | EP1268665A1 Flame retardant phosphorus element-containing epoxy resin compositions |
| 01/02/2003 | EP1268643A1 Screen printable flame retardant coating |
| 01/02/2003 | EP1268054A1 Electrocatalyst powders, methods for producing powders and devices fabricated from same |
| 01/02/2003 | EP1127479B1 An electrical component and an electrical circuit module having connected ground planes |
| 01/02/2003 | EP1023575B1 Position sensor |
| 01/02/2003 | EP0890268B1 Protective module for a telecommunication system distributor |
| 01/02/2003 | EP0855090B1 Multichip module |
| 01/01/2003 | CN1389089A High capacity memory module with higher density and improved manufacturability |
| 01/01/2003 | CN1389005A High reliability interposer of low-cost and high reliability application |
| 01/01/2003 | CN1388975A 层压体及其用途 Laminate and its use |
| 01/01/2003 | CN1388973A Low profile, high density memory system |
| 01/01/2003 | CN1388841A Laser hole drilling copper foil |
| 01/01/2003 | CN1388777A Copper-clad laminate |
| 01/01/2003 | CN1388737A Circuit board capable of inhibiting electromagnetic interference and its inhibition method |
| 01/01/2003 | CN1388578A Staircase shape pattern for semiconductor chip welding |