| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 02/04/2003 | US6513959 Vehicle ceiling-mounting electric equipment assembly |
| 01/30/2003 | WO2003009660A1 Method and material for manufacturing circuit-formed substrate |
| 01/30/2003 | WO2003009658A1 Method for singulating flexible circuit |
| 01/30/2003 | WO2003009657A1 Circuit board, circuit board-use member and production method therefor and method of laminating fexible film |
| 01/30/2003 | WO2003009656A1 Circuit-formed substrate and method of manufacturing circuit-formed substrate |
| 01/30/2003 | WO2003009655A1 Film for circuit board |
| 01/30/2003 | WO2003009426A1 Low-profile connector |
| 01/30/2003 | WO2003009414A1 Inverted coplanar waveguide coupler with integral microstrip connection ports |
| 01/30/2003 | WO2003009308A2 Electrical line |
| 01/30/2003 | WO2003008858A1 Lighting apparatus |
| 01/30/2003 | WO2003008671A1 Composite foil and its manufacturing process |
| 01/30/2003 | WO2003008514A1 Polysilazane-modified polyamine hardeners for epoxy resins |
| 01/30/2003 | WO2003008502A1 Water-dispersible resin composition for use in boring hole in printed wiring board, sheet comprising the composition, and method for boring hole in printed wiring board using the sheet |
| 01/30/2003 | WO2003008483A1 Aromatic fluoropolymer and use thereof |
| 01/30/2003 | WO2002096166A9 Radio frequency microelectromechanical systems (mems) devices on low-temperature co-fired ceramic (ltcc) substrates |
| 01/30/2003 | WO2002055431A3 Wafer level interconnection |
| 01/30/2003 | US20030022958 Resist ink composition |
| 01/30/2003 | US20030022953 Antireflective porogens |
| 01/30/2003 | US20030022558 Electronic device, method of manufacturing the same and method of designing the same, and circuit board and electronic instrument |
| 01/30/2003 | US20030022492 Metal film and manufacturing method therefor, and laminated ceramic electronic component and manufacturing method therefor |
| 01/30/2003 | US20030022477 Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints |
| 01/30/2003 | US20030022462 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures |
| 01/30/2003 | US20030022419 Method of fabricating vias in solder pads of a ball grid array (BGA) substrate |
| 01/30/2003 | US20030021968 X-ray printing personalization technique |
| 01/30/2003 | US20030021886 Method of printing and printing machine |
| 01/30/2003 | US20030021496 Image reading apparatus |
| 01/30/2003 | US20030021097 Printed-circuit board, coaxial cable, and electronic device |
| 01/30/2003 | US20030020844 Microencapsulated electrophoretic display with integrated driver |
| 01/30/2003 | US20030020627 Multi color and omni directional warning lamp |
| 01/30/2003 | US20030020590 Protection of electrical devices with voltage variable materials |
| 01/30/2003 | US20030020511 Information processing apparatus having a reduced signal distortion between a module and a memory |
| 01/30/2003 | US20030020173 Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates |
| 01/30/2003 | US20030020156 Electronic package with optimized lamination process |
| 01/30/2003 | US20030020150 Compliant layer for encapsulated columns |
| 01/30/2003 | US20030020149 Laser-working dielectric substrate and method for working same and semiconductor package and method for manufacturing same |
| 01/30/2003 | US20030019934 Optical reader aiming assembly comprising aperture |
| 01/30/2003 | US20030019735 Bonding electrical components to substrates |
| 01/30/2003 | US20030019664 Electrically conducting bonding connection |
| 01/30/2003 | US20030019663 Multi-layer wiring substrate and manufacturing method thereof |
| 01/30/2003 | US20030019662 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
| 01/30/2003 | US20030019659 Bending-resistant flexible flat cable and production process thereof |
| 01/30/2003 | US20030019658 Flat flexible cable |
| 01/30/2003 | US20030019573 Method for bonding an integrated circuit device to a glass substrate |
| 01/30/2003 | US20030019562 Adhesive bonding of printed circuit boards to heat sinks |
| 01/30/2003 | DE20114939U1 Circuit arrangement e.g. for detecting position of elevator doors, comprises modules mounted in a ball grid array housing on a circuit board |
| 01/30/2003 | CA2454377A1 Composite foil and its manufacturing process |
| 01/30/2003 | CA2454131A1 Inverted coplanar waveguide coupler with integral microstrip connection ports |
| 01/29/2003 | EP1280394A1 Apparatus comprising contacts made from carbon tracks and process for manufacturing the same |
| 01/29/2003 | EP1280393A2 Multilayer circuit board and method for manufacturing multilayer circuit board |
| 01/29/2003 | EP1280392A1 Printed circuit board and relevant manufacturing method for the installation of microwave chips up to 80 Ghz |
| 01/29/2003 | EP1280390A2 Electronic key for vehicle |
| 01/29/2003 | EP1280223A1 Dielectric filter and method of making same |
| 01/29/2003 | EP1280213A2 Layered wiring line of silver or silver alloy and method for forming the same and display panel substrate using the same |
| 01/29/2003 | EP1280204A2 Wiring substrate having position problem |
| 01/29/2003 | EP1279242A1 Rugged shock-resistant backplane for embedded systems |
| 01/29/2003 | EP1279195A1 Electronic component with flexible contact points and method for the production thereof |
| 01/29/2003 | EP1278806A1 Adhesive bonding laminates |
| 01/29/2003 | EP0983616B1 Method and device for connecting two millimetric elements |
| 01/29/2003 | CN1394465A Circuit forming board producing method, circuit foaming board, material for circuit forming board |
| 01/29/2003 | CN1394391A High-frequency switch module |
| 01/29/2003 | CN1394113A Method for mfg. glass ceramic multi-substrate and glass ceramic multi-substrate |
| 01/29/2003 | CN1393653A Device and method for modularization mounting of LED |
| 01/29/2003 | CN1100474C Electronic package and its mfg. method |
| 01/29/2003 | CN1100473C Structure reinforced spherical grid array semiconductor package and system |
| 01/29/2003 | CN1100350C Conductor for forming conductive path on integrated circuit and method thereof |
| 01/29/2003 | CN1100347C Method for producing semiconductor device |
| 01/29/2003 | CN1100325C Flexible electric cable and its application |
| 01/29/2003 | CN1100280C Liquid crystal display device and data processor |
| 01/29/2003 | CN1100268C Method for testing printed circuit card |
| 01/28/2003 | US6512861 Packaging and assembly method for optical coupling |
| 01/28/2003 | US6512680 Semiconductor package |
| 01/28/2003 | US6512678 Distributed load board stiffener |
| 01/28/2003 | US6512676 Printed circuit board stiffener |
| 01/28/2003 | US6512673 Low profile equipment housing with angular fan |
| 01/28/2003 | US6512664 Static dissipative shunt housing |
| 01/28/2003 | US6512423 Printed board, method for producing the same, and electronic device having the same |
| 01/28/2003 | US6512303 Flip chip adaptor package for bare die |
| 01/28/2003 | US6512300 Water level interconnection |
| 01/28/2003 | US6512293 Mechanically interlocking ball grid array packages and method of making |
| 01/28/2003 | US6512288 Circuit board semiconductor package |
| 01/28/2003 | US6512187 Lattice-shaped circuit board |
| 01/28/2003 | US6512182 Wiring circuit board and method for producing same |
| 01/28/2003 | US6512181 Multilayer type printed-wiring board and method of measuring impedance of multilayer type printed-wiring board |
| 01/28/2003 | US6512180 Printed-wiring board, method for identifying same, and method for manufacturing same |
| 01/28/2003 | US6512075 High Tg brominated epoxy resin for glass fiber laminate |
| 01/28/2003 | US6511614 Raw material for producing powder of indium-tin oxide aciculae and method of producing the raw material, powder of indium-tin oxide aciculae and method of producing the powder, electroconductive paste and light-transmitting electroconductive film |
| 01/28/2003 | US6511564 Method for producing ceramic slurry, ceramic green sheet, and fabricating monolithic ceramic electronic component |
| 01/28/2003 | US6511349 Connection-retaining unit |
| 01/28/2003 | US6511347 Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board site |
| 01/28/2003 | US6511344 Double-deck electrical connector with cross-talk compensation |
| 01/28/2003 | US6511332 Lock arm board-connecting connector |
| 01/28/2003 | US6511234 Signal transmission method and motherboard structure |
| 01/28/2003 | US6510724 Method and system for selective soldering process characterization |
| 01/23/2003 | WO2003007672A1 Electromagnetic filter for display screens |
| 01/23/2003 | WO2003007670A1 Method for manufacturing ceramic multilayer circuit board |
| 01/23/2003 | WO2003007452A1 Electrostatic discharge apparatus for network devices |
| 01/23/2003 | WO2003007379A1 Electronic circuit component |
| 01/23/2003 | WO2003007376A1 Power module and air conditioner |
| 01/23/2003 | WO2003007375A2 Single package containing multiple integrated circuit devices |
| 01/23/2003 | WO2003007370A1 Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor |