H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
10/2002
10/22/2002	US6468102 Method of manufacturing wiring board, and electric connection box
10/22/2002	US6468090 Low inductance power connector and method of reducing inductance in an electrical connector
10/22/2002	US6467692 Modular data medium
10/22/2002	US6467666 Method of producing a semiconductor device
10/22/2002	US6467414 Ignitor with printed electrostatic discharge spark gap
10/22/2002	US6467383 Machine for punching panels
10/22/2002	US6467163 Universal component mounting structure for surface mountable electronic devices
10/22/2002	US6467162 Method for mounting devices on a printed circuit board despite misalignment of resist
10/17/2002	WO2002082877A2 Telecommunications chassis and card
10/17/2002	WO2002082577A1 Microwave circuit
10/17/2002	WO2002082541A1 Power semiconductor device
10/17/2002	WO2002082472A2 The use of conductor compositions in electronic circuits
10/17/2002	WO2002082467A1 Conductor compositions and the use thereof
10/17/2002	WO2002082466A1 Conductive paste, article produced therewith with a conductive coating on glass, ceramics or enameled steel and method for the production thereof
10/17/2002	WO2002082465A2 The use of conductor compositions in electronic circuits
10/17/2002	WO2002081402A2 Esd dissipative ceramics
10/17/2002	WO2002081141A1 Carbon dioxide gas laser machining method of multilayer material
10/17/2002	WO2002063261A3 Electronic pressure sensitive transducer apparatus and method for manufacturing same
10/17/2002	US20020151439 Forming a dielectric layer by thermal decomposition of a metallo-organic material
10/17/2002	US20020151234 Water-soluble polyimide precursor, aqueous polyimide precursor solution, polyimide, impregnated material with polyimide binder, and laminate
10/17/2002	US20020151210 Continuous conductor connector system for printed circuit boards
10/17/2002	US20020151200 Device for protecting an electric and/or electronic component arranged on a carrier substrate against electrostatic discharges
10/17/2002	US20020151197 Junction box and wire harness connection method
10/17/2002	US20020151196 Electrical connecting element and method of producing the same
10/17/2002	US20020151195 Power interconnect method utilizing a flexible circuit between a voltage regulation module and an integrated circuit substrate
10/17/2002	US20020151193 Solder-down printed circuit board connection structure
10/17/2002	US20020151161 Method for forming conductive film pattern, and electro-optical device and electronic apparatus
10/17/2002	US20020150743 Method for manufacturing ceramic substrate and non-fired ceramic substrate
10/17/2002	US20020150339 Optical interconnect for mezzanine circuit boards
10/17/2002	US20020149933 Flexible circuit board with LED lighting
10/17/2002	US20020149921 Construction and method for interconnecting flexible printed circuit and wiring board, liquid crystal display device, and method for manufacturing the same
10/17/2002	US20020149914 Flexible board and information processor
10/17/2002	US20020149899 Surge protection device including a thermal fuse spring, a fuse trace and a voltage clamping device
10/17/2002	US20020149888 Method for manufacturing a circuit board capable of protecting an MR magnetic head therein against electrostatic breakdown and a method for manufacturing a magnetic head using the same
10/17/2002	US20020149825 Open air optical channel
10/17/2002	US20020149494 LED symbol signal
10/17/2002	US20020149461 Apparatus and method for PCB winding planar magnetic devices
10/17/2002	US20020149119 Semiconductor device
10/17/2002	US20020149101 Wiring board and method of manufacturing same
10/17/2002	US20020149098 Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate
10/17/2002	US20020149074 Electro-optical device, method of manufacturing electro-optical device, liquid crystal device, method of manufacturing liquid crystal device and electronic apparatus
10/17/2002	US20020149039 Integrated microwave module and corresponding method for manufacturing it
10/17/2002	US20020149005 Irregular shaped copper particles and methods of use
10/17/2002	US20020148946 Stacked structure of an image sensor and method for manufacturing the same
10/17/2002	US20020148733 Wiring layer is formed through the degenerated layer including the amide group formed on the resin substrate surface and various layers including a metallic oxide layer
10/17/2002	US20020148640 Methods of manufacture of electric circuit substrates and components having multiple electric characteristics and substrates and components so manufactured
10/17/2002	US20020148639 Multi-layer substrates and fabrication processes
10/17/2002	US20020148637 High performance dense wire for printed circuit board
10/17/2002	US20020148636 Circuit assembly and a method for making the same
10/17/2002	US20020148631 Controller for a motor vehicle
10/17/2002	DE10205408A1 Semiconductor module comprises a housing closed on one side by a metallic heat conducting base which is connected to a metallic coated, electrically insulating heat conducting ceramic layer via a solder layer
10/17/2002	DE10118487A1 Plastic component with electrical functions, e.g. a chip card, contains functional elements, e.g. an antenna, made of electrically conducting plastic
10/17/2002	DE10116406A1 Device for manufacturing and testing electronic units, has bearer plate with externally contactable central electrical contact area for connecting voltage, load or signals to electronic units
10/16/2002	EP1250033A2 Printed circuit board and electronic component
10/16/2002	EP1250031A2 Wiring board and method of manufacturing same
10/16/2002	EP1249870A2 Semiconductor device
10/16/2002	EP1249869A2 Arrangement for cooling a power semiconductor device
10/16/2002	EP1249057A2 Flexible compliant interconnect assembly
10/16/2002	EP0729652B1 Method for fabricating a contact structure for interconnections, interposer, semiconductor assembly
10/16/2002	EP0477291B1 Liquid crystal polymer film
10/16/2002	CN1374980A Improved PCT formulations containing halogenated imides, sodium antimonate and reinforcing fibers
10/16/2002	CN1374825A Digital signal distributor of 3D structure
10/16/2002	CN1374668A Rough ceramic sheet method for producing multilayer ceramic electronic elements and carrier sheet of rough ceramic sheet
10/16/2002	CN1374666A Formation of embedded capacitor polar plate sing thin dielectric
10/16/2002	CN1374639A Suspension holder for HDD and its producing method
10/16/2002	CN1374272A Low temperature sintered ceramic and electronic parts
10/16/2002	CN1374190A Polyester film and its producing method
10/16/2002	CN1374189A Process for producing polyester film
10/16/2002	CN1092835C Ceramic electronic parts
10/16/2002	CN1092690C Heat resistant resin composition and adhesive sheet using the same composition
10/16/2002	CN1092614C Low-permittivity glass fibers
10/16/2002	CA2381749A1 Surge protection device including a thermal fuse spring, a fuse trace and a voltage clamping device
10/15/2002	USRE37882 Semiconductor device manufacturing method
10/15/2002	US6466454 Component transformer
10/15/2002	US6466451 Electric connection box
10/15/2002	US6466447 Electronic control unit having flexible wires connecting connector to circuit board
10/15/2002	US6466413 Magnetic head with flexure system for reduced stress concentration
10/15/2002	US6466282 Structure of liquid crystal display device for easy assembly and disassembly
10/15/2002	US6466124 Thin film resistor and method for forming the same
10/15/2002	US6466113 Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices
10/15/2002	US6466112 Coaxial type signal line and manufacturing method thereof
10/15/2002	US6466008 Method for matching the lengths of signal traces
10/15/2002	US6465905 Controller integrated with engine and circuit boards package used in controller
10/15/2002	US6465880 IC card indicating state of usage and system therefor
10/15/2002	US6465748 Wiring unit
10/15/2002	US6465747 Microelectronic assemblies having solder-wettable pads and conductive elements
10/15/2002	US6465746 Oscillator attachment structure preventing interference by beat signal
10/15/2002	US6465738 Grounding terminal and mounting structure of the same on a printed circuit board
10/15/2002	US6465733 Electronic package structure utilizing aluminum nitride/aluminum composite material
10/15/2002	US6465732 Laser formation of a metal capacitor and integrated coaxial line
10/15/2002	US6465085 Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same
10/15/2002	US6465083 Dissolving polyphenylene ethers in solvents, heating then reacting an oxy nitrile and alcohol in the presence of polymerization catalyst to form polycyanurate interpenetrating polymer networks having heat resistance and workability
10/15/2002	US6465082 Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
10/15/2002	US6464528 Cap and low insertion force connector for printed circuit board
10/15/2002	US6464121 Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards
10/15/2002	US6463653 Component alignment apparatuses
10/10/2002	WO2002080640A2 Shunt power connection for an integrated circuit package
10/10/2002	WO2002080637A1 Circuit elements having an embedded conductive trace and methods of manufacture
10/10/2002	WO2002080634A1 High-frequency module
10/10/2002	WO2002080633A1 Flexible circuit with electrostatic damage limiting feature and method of manufacture

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