| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/23/2003 | WO2003007369A1 Semiconductor connection substrate |
| 01/23/2003 | WO2003007338A2 Method for attaching an electronic component to a substrate |
| 01/23/2003 | WO2003007320A1 Thin film capacitor, and electronic circuit component |
| 01/23/2003 | WO2003007319A2 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes |
| 01/23/2003 | WO2003007078A2 Photocurable resist inks |
| 01/23/2003 | WO2003006553A1 Resin composition |
| 01/23/2003 | WO2003006542A1 Process for producing porous polyimide resin and porous polyimide resin |
| 01/23/2003 | WO2003006396A1 Bonding method and product |
| 01/23/2003 | WO2003006163A1 Analysis device |
| 01/23/2003 | WO2002057928A3 Signaling on an electromagnetically-coupled bus |
| 01/23/2003 | WO2002054121A3 Layered circuit boards and methods of production thereof |
| 01/23/2003 | WO2002037909A3 Method and apparatus for distributing power to integrated circuits |
| 01/23/2003 | WO2002011202A3 Method and device for producing connection substrates for electronic components |
| 01/23/2003 | US20030018940 Systems with modules sharing terminations |
| 01/23/2003 | US20030018243 Selectively plated sensor |
| 01/23/2003 | US20030018204 Halogen-containing aromatic acid dianhydride, halogen-containing aromatic tetranitrile compound, haltogen-containing aromatic tetracarbonxylic acid and halogen containing m-phenylenediamine compound |
| 01/23/2003 | US20030017687 Method for filling a wafer through-VIA with a conductive material |
| 01/23/2003 | US20030017653 Semiconductor package insulation film and manufacturing method thereof |
| 01/23/2003 | US20030017645 Method for manufacturing circuit device |
| 01/23/2003 | US20030017351 Thermosetting epoxy resin containing dielectric ceramics with high dielectric constant |
| 01/23/2003 | US20030016549 Systems with modules and clocking therefore |
| 01/23/2003 | US20030016517 Systems having modules with on die terminations |
| 01/23/2003 | US20030016516 Termination cards and systems therefore |
| 01/23/2003 | US20030016514 Systems having modules sharing on module terminations |
| 01/23/2003 | US20030016513 Systems having modules with buffer chips |
| 01/23/2003 | US20030016512 Systems having modules with selectable on die terminations |
| 01/23/2003 | US20030016509 Flat circuit device and method of manufacturing |
| 01/23/2003 | US20030016508 Capacitor sheet, electro-optical device with capacitor, flexible substrate, composite build-up substrate, and electronic apparatus |
| 01/23/2003 | US20030016490 Integrated circuit device/circuit board connection apparatus |
| 01/23/2003 | US20030016484 Method of producing ceramic laminates, laminated electronic parts and method of producing the same |
| 01/23/2003 | US20030016118 Resistors |
| 01/23/2003 | US20030016117 Resistors |
| 01/23/2003 | US20030016095 Inverted coplanar waveguide coupler with integral microstrip connection ports |
| 01/23/2003 | US20030016050 Signal transmitting device suited to fast signal transmission |
| 01/23/2003 | US20030016040 Motherboard memory slot ribbon cable and methods, apparatus and systems employing same |
| 01/23/2003 | US20030016025 Method and device for testing electronic devices |
| 01/23/2003 | US20030015996 Power regulation system, apparatus, and method for providing regulated power to a microelectronic device |
| 01/23/2003 | US20030015791 Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment |
| 01/23/2003 | US20030015778 Semiconductor device |
| 01/23/2003 | US20030015777 Connection of packaged integrated memory chips to a printed circuit board |
| 01/23/2003 | US20030015574 Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate |
| 01/23/2003 | US20030015349 Printed wiring board having wiring patterns and connection terminals |
| 01/23/2003 | US20030015348 Printed circuit board with a heat dissipation element, mehtod for manufacturing the printed circuit board, and package comprising the printed circuit board |
| 01/23/2003 | US20030015346 Modules having paths of different impedances |
| 01/23/2003 | US20030015345 Laminated base sheet for flexible printed circuit board |
| 01/23/2003 | US20030015344 Printed circuit board employing lossy power distribution network to reduce power plane resonances |
| 01/23/2003 | US20030015342 Multilayer printed wiring board and method for producing multilayer printed wiring board |
| 01/23/2003 | US20030015277 Process for the manufacture of multilayer ceramic substrates |
| 01/23/2003 | DE20218201U1 Circuit board module for rotary operating switch e.g. for cooker time switch, comprises conductive tracks on first circuit board coupled to contact faces on second circuit board |
| 01/23/2003 | CA2453107A1 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes |
| 01/22/2003 | EP1278407A1 Laminate with inside layer circuit used for multilayer printed circuit board for high frequency circuit, and method and device for measuring circuit impedance of the laminate with inside layer circuit |
| 01/22/2003 | EP1278405A1 Circuit board producing method and circuit board producing device |
| 01/22/2003 | EP1278404A1 Circuit board and production method thereof |
| 01/22/2003 | EP1278215A2 Resistive materials |
| 01/22/2003 | EP1278214A1 Composition for forming low dielectric constant insulating film, method of forming insulting film using the insulating film produced thereby |
| 01/22/2003 | EP1278211A1 Conductive composition |
| 01/22/2003 | EP1277712A2 Zero thermal expansion material and practical component parts making use of the same |
| 01/22/2003 | EP1277696A2 Spring with conductive coating |
| 01/22/2003 | EP1277278A1 Isolating energy conditioning shield assembly |
| 01/22/2003 | CN2532580Y Substrate for making electronic component |
| 01/22/2003 | CN1393119A Power module for high intensity discharge lamp |
| 01/22/2003 | CN1393035A Electronic equipment |
| 01/22/2003 | CN1393007A 显示模块 Display Module |
| 01/22/2003 | CN1392912A Nonwoven fabric for electrical insulation, prepreg, and laminate |
| 01/22/2003 | CN1392883A Phosphorus-containing epoxy resin, flame-retardant highly heat-resistant epoxy resin composition containing resin, and laminate |
| 01/22/2003 | CN1392829A Circuit board production method and circuit board production data |
| 01/22/2003 | CN1392766A Foldable electronic device and its flexible printed circuit board |
| 01/22/2003 | CN1392763A Multi layer connection board and its producing method |
| 01/22/2003 | CN1392760A Electronic element assembling method without producing unnecessary welding balls |
| 01/22/2003 | CN1392757A Printed radio frequency induction card and its preparing method |
| 01/22/2003 | CN1392756A Flexible conductive foil with electronic circuit |
| 01/22/2003 | CN1392755A High frequency circuit base board and its producing method |
| 01/22/2003 | CN1099826C Arrangement for installation of unit members on printed circuit board |
| 01/22/2003 | CN1099726C 电连接器盒 The electrical connector box |
| 01/21/2003 | US6510545 Automated shielding algorithm for dynamic circuits |
| 01/21/2003 | US6510328 Radio telephone with a combined battery and support structure |
| 01/21/2003 | US6510058 Printed circuit board configuration having reduced EMC/EMI interference in electromechanical relay circuits |
| 01/21/2003 | US6510053 Circuit board cooling system |
| 01/21/2003 | US6510034 Spark gap device having multiple nodes |
| 01/21/2003 | US6509807 Energy conditioning circuit assembly |
| 01/21/2003 | US6509714 Secondary battery with terminals and capacitor with terminals |
| 01/21/2003 | US6509646 Plurality of inside-connected capacitors are fixed on said contact layer, and a conductive glue is used to electrically connect the capacitors to the power plane and ground plane to reduce the electrical noise between the power plane and ground |
| 01/21/2003 | US6509637 Low profile mounting of thick integrated circuit packages within low-profile circuit modules |
| 01/21/2003 | US6509630 Flexible interconnecting substrate, film, carrier, tape-shaped semiconductor device, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
| 01/21/2003 | US6509629 Power module |
| 01/21/2003 | US6509546 Laser excision of laminate chip carriers |
| 01/21/2003 | US6509531 Monolithic ceramic electronic component, method for manufacturing the same, and electronic device |
| 01/21/2003 | US6509530 Via intersect pad for electronic components and methods of manufacture |
| 01/21/2003 | US6509529 Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch |
| 01/21/2003 | US6509528 Printed circuit board and manufacturing process thereof |
| 01/21/2003 | US6509414 To produce laminates and printed wiring boards |
| 01/21/2003 | US6509063 Preparation of polyindanebisphenols and polymers derived therefrom |
| 01/21/2003 | US6508664 Connectors for circuit boards configured with foil on both sides |
| 01/21/2003 | US6508663 Arrangement and method for forming an electrical contact in an electronic device |
| 01/21/2003 | US6508584 Method and apparatus for testing a temperature sensor |
| 01/21/2003 | US6507993 Polymer thick-film resistor printed on planar circuit board surface |
| 01/21/2003 | US6507984 Cutters having frame supports, rotation tables and pivots for semiconductor machining |
| 01/16/2003 | WO2003005792A1 Optimizing selection of reference markings used in estimating the position of an imaging device |
| 01/16/2003 | WO2003005790A1 Stacked backplane assembly |
| 01/16/2003 | WO2003005788A1 Multilayer flexible wiring circuit board and its manufacturing method |