| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/05/2002 | US20020179198 Alloy lmainated to polyimide |
| 12/05/2002 | DE10220924A1 Sensorschaltungsmodul und elektronische Vorrichtung unter Verwendung desselben The same sensor circuit module and electronic device using |
| 12/05/2002 | DE10218078A1 Flexible Leiterplatte und Verfahren zu deren Herstellung Flexible printed circuit board and process for their preparation |
| 12/05/2002 | DE10126655A1 Circuit board for electronic equipment, has electronic component on first surface with first and second contact surfaces connected by solder or adhesive to first and second contact points with access to track |
| 12/05/2002 | DE10126149A1 Gedeckt eingefärbte, hydrolysebeständige, biaxial orientierte Folie aus einem kristallisierbaren Thermoplasten und Verfahren zu ihrer Herstellung Opaque tinted, hydrolysis, biaxially oriented film of a crystallizable thermoplastic and process for their preparation |
| 12/05/2002 | DE10125745A1 Verfahren zur Abschirmung einer auf einer Leiterplatte realisierten elektrischen Schaltung und eine entsprechende Kombination einer Leiterplatte mit einer Abschirmung Method for shielding a realized on a circuit board electrical circuit and an appropriate combination of a circuit board with a shield |
| 12/05/2002 | DE10125744A1 Verfahren zur Abschirmung einer auf einer Leiterplatte realisierten elektrischen Schaltung und eine entsprechende Kombination einer Leiterplatte mit einer Abschirmung Method for shielding a realized on a circuit board electrical circuit and an appropriate combination of a circuit board with a shield |
| 12/05/2002 | DE10125696A1 Power semiconductor module for making an external electrical connection has active semiconductor components and external electrical connections. |
| 12/04/2002 | EP1263270A2 A method of packaging electronic components without creating unnecessary solder balls |
| 12/04/2002 | EP1263269A1 Foil conductor, such as foil conductor cable or foil circuit board |
| 12/04/2002 | EP1263136A2 Filter structures for integrated circuit interfaces |
| 12/04/2002 | EP1263038A2 Electronic component and mobile communication device using such electronic component |
| 12/04/2002 | EP1263002A2 Resistors |
| 12/04/2002 | EP1263000A1 Flat cable |
| 12/04/2002 | EP1262782A2 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 12/04/2002 | EP1262511A2 Opaquely pigmented, hydrolysis-resistant, biaxially oriented film made from a crystallizable thermoplastic, and a process for its production |
| 12/04/2002 | EP1262509A1 Imide-benzoxazole polycondensate and process for producing the same |
| 12/04/2002 | EP1261999A2 Method and apparatus for delivering power to high performance electronic assemblies |
| 12/04/2002 | EP1062289B1 Luminescent electroconductive adhesive |
| 12/04/2002 | CN2524381Y Printing antenna |
| 12/04/2002 | CN1383707A Method for mfg. printed-circuit board |
| 12/04/2002 | CN1383706A Carrier-foiled composite copper foil, method for mfg. printed circuit board with resistance circuit, and printed circuit board having resistance circuit |
| 12/04/2002 | CN1383705A Carrier-field copper foil circuit, printed circuit board mfg. method using circuit, and printed circuit board |
| 12/04/2002 | CN1383446A Resin compsn. for electric and electronic appliances |
| 12/04/2002 | CN1383436A Epoxy resin compsn. and laminate using same |
| 12/04/2002 | CN1383355A Technology for making strengthened glass circuit board and its product and application |
| 12/04/2002 | CN1383354A Electronic device contg. multi-layer printed circuit board |
| 12/04/2002 | CN1383353A Wiring substrate |
| 12/04/2002 | CN1383264A Electronic packaged assembly and prodn. method of substrate electrode |
| 12/04/2002 | CN1383233A Connecting structure of printed circuit board |
| 12/04/2002 | CN1383221A Light source |
| 12/04/2002 | CN1382745A Thermoset resin compsns. and its mfg. method |
| 12/04/2002 | CN1095583C Actuator having MR element protecting means |
| 12/03/2002 | US6490173 Method and apparatus for providing electromagnetic shielding |
| 12/03/2002 | US6490172 Circuit board retainer |
| 12/03/2002 | US6490170 Package substrate |
| 12/03/2002 | US6490169 Conductive circuit structure having an electrically conductive surface fixed by collar walls |
| 12/03/2002 | US6490168 Interconnection of circuit substrates on different planes in electronic module |
| 12/03/2002 | US6490165 Deformation-resistant mounting structure of portable device |
| 12/03/2002 | US6490164 Attachment structure of electronic component to circuit board and clip used in attachment of the electronic component |
| 12/03/2002 | US6490161 Peripheral land grid array package with improved thermal performance |
| 12/03/2002 | US6490160 Vapor chamber with integrated pin array |
| 12/03/2002 | US6490159 Electrical circuit board and method for making the same |
| 12/03/2002 | US6489880 Mounting structure for thermistor with positive resistance-to-temperature characteristic |
| 12/03/2002 | US6489876 Method and apparatus for forming a magnetic component on a printed circuit board |
| 12/03/2002 | US6489686 Multi-cavity substrate structure for discrete devices |
| 12/03/2002 | US6489685 Component built-in module and method of manufacturing the same |
| 12/03/2002 | US6489681 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components |
| 12/03/2002 | US6489680 Semiconductor device |
| 12/03/2002 | US6489670 Sealed symmetric multilayered microelectronic device package with integral windows |
| 12/03/2002 | US6489586 Method and apparatus for verification of assembled printed circuit boards |
| 12/03/2002 | US6489574 Printed-wiring board |
| 12/03/2002 | US6489570 Multi-layer circuit board |
| 12/03/2002 | US6489436 Polyimide copolymer and metal laminate using the same |
| 12/03/2002 | US6489035 Printed circuit boards; copper surface stabilization with layer of zinc oxide, chromium oxide or nickel oxide; vapor deposition metal, alloy, nitride, silicide or oxide electrical resistance material |
| 12/03/2002 | US6489013 Polyamideimide with siloxane bonds, high molecular weight acrylic polymer, thermoset resin and solvent; low thermal stress and modulus of elasticity; heat resistance |
| 12/03/2002 | US6488869 Conductive paste, its manufacturing method, and printed wiring board using the same |
| 12/03/2002 | US6488795 Multilayered ceramic substrate and method of producing the same |
| 12/03/2002 | US6488631 Ultrasonic endoscope |
| 12/03/2002 | US6488199 Method for improving the manufacturing safety of weld joints |
| 12/03/2002 | CA2233695C Strong, air permeable membranes of polytetrafluoroethylene |
| 11/28/2002 | WO2002096177A2 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield |
| 11/28/2002 | WO2002096176A2 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield |
| 11/28/2002 | WO2002096172A1 Method for manufacturing ceramic multilayered board |
| 11/28/2002 | WO2002096168A2 Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit |
| 11/28/2002 | WO2002096166A1 Radio frequency microelectromechanical systems (mems) devices on low-temperature co-fired ceramic (ltcc) substrates |
| 11/28/2002 | WO2002096165A1 Conductive foil, such as a conductive foil cable or a conductive foil plate |
| 11/28/2002 | WO2002096164A2 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield |
| 11/28/2002 | WO2002096124A2 Telecommunications chassis and card |
| 11/28/2002 | WO2002096048A1 Circuit board capacitor structure for forming a high voltage isolation barrier |
| 11/28/2002 | WO2002095992A1 Data processing terminal, parent substrate, child substrate, terminal design apparatus and method, computer program, and information storage medium |
| 11/28/2002 | WO2002095969A1 Millimeter wave transceiver module |
| 11/28/2002 | WO2002095801A2 Improved connection assembly for integrated circuit sensors |
| 11/28/2002 | WO2002094728A1 Reinforcing glass yarns with low dielectric constants |
| 11/28/2002 | WO2002078159A3 Power regulation system, apparatus, and method for providing regulated power to a microelectronic device |
| 11/28/2002 | US20020178429 Wiring board design aiding apparatus, design aiding method, storage medium, and computer program |
| 11/28/2002 | US20020177683 Highly purified epoxy resin |
| 11/28/2002 | US20020177518 (a) volume resistivity of 103-1011 Ohm- cm; (b) flexural strength of at least 500 MPa; and (c) voltage decay time of less than 500 ms. |
| 11/28/2002 | US20020177335 Card-type portable device |
| 11/28/2002 | US20020177333 Electrically connecting integrated circuits and transducers |
| 11/28/2002 | US20020177317 Immediate improvement of dewatering on paper machine; does not negatively affect web formation |
| 11/28/2002 | US20020177291 Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers |
| 11/28/2002 | US20020177255 Process for manufacturing ic card |
| 11/28/2002 | US20020177006 Structure having flush circuitry features and method of making |
| 11/28/2002 | US20020177000 Treating a polyimide film having a biphenyltetracarboxylic acid unit with a solution containing a sodium and/or potassium permanganate and potassium and/or sodium hydroxide and treating surface with acid; peel strength |
| 11/28/2002 | US20020176989 Dielectric laminate for a capacitor |
| 11/28/2002 | US20020176793 For computerized production of three dimensional sintered bodies by solid freeform fabrication, including binding agent charged with metal powder |
| 11/28/2002 | US20020176240 Printed circuit interface to an I/O connector |
| 11/28/2002 | US20020176237 Capacitor for Dram Connector |
| 11/28/2002 | US20020176236 Printed wiring board |
| 11/28/2002 | US20020176233 Stackable module |
| 11/28/2002 | US20020176230 Vertical surface mount apparatus with thermal carrier |
| 11/28/2002 | US20020176229 Separable power delivery connector |
| 11/28/2002 | US20020175797 Current mode coupler having a unitary casing |
| 11/28/2002 | US20020175780 Directional coupler |
| 11/28/2002 | US20020175748 Filter circuit and electronic device using the same |
| 11/28/2002 | US20020175701 Signal transmitting device suited to fast signal transmission |
| 11/28/2002 | US20020175669 Film-based microwave and millimeter-wave circuits and sensors |
| 11/28/2002 | US20020175423 High performance silicon contact for flip chip |
| 11/28/2002 | US20020175410 BGA substrate via structure |