Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
03/2003
03/04/2003US6528866 High-frequency module
03/04/2003US6528769 Connection of a junction to an electrical conductor track on a plate
03/04/2003US6528742 Switch unit with membrane type, flexible printed circuitry
03/04/2003US6528737 Midplane configuration featuring surface contact connectors
03/04/2003US6528735 Substrate design of a chip using a generic substrate design
03/04/2003US6528734 Semiconductor device and process for fabricating the same
03/04/2003US6528733 Multi-layer circuit board and method of manufacturing same
03/04/2003US6528732 Circuit device board, semiconductor component, and method of making the same
03/04/2003US6528407 Process for producing electrical-connections on a semiconductor package, and semiconductor package
03/04/2003US6528236 Photosensitive resin composition, multilayer printed wiring board and process for production thereof
03/04/2003US6528231 Photosensitive resin composition can form a resin layer having excellent heat resistance
03/04/2003US6528218 Method of fabricating circuitized structures
03/04/2003US6528179 Reduction of chip carrier flexing during thermal cycling
03/04/2003US6528166 Nickel composite particle and production process therefor
03/04/2003US6528145 Polymer and ceramic composite electronic substrates
03/04/2003US6527890 Multilayered ceramic micro-gas chromatograph and method for making the same
03/04/2003US6527563 Grid interposer
03/04/2003US6527159 Surface mounting to an irregular surface
03/04/2003US6526827 Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor
03/04/2003US6526654 Method of producing double-sided circuit board
02/2003
02/27/2003WO2003017739A1 Printed board unit and linked printed board using it, led display unit
02/27/2003WO2003017435A1 Adapter for power transfer
02/27/2003WO2003017367A1 Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same
02/27/2003WO2003017290A1 Production method for conductive paste and production method for printed circuit board
02/27/2003WO2003016237A1 Microwave dielectric composite composition .
02/27/2003WO2003016236A1 Microwave dielectric composition and method for producing the same
02/27/2003WO2003016063A1 Printhead cartridge with asymmetrical contacts
02/27/2003WO2002100135A3 Flexible polyimide circuitsubstrates having predeterminded slopedvias
02/27/2003WO2002093990A3 Polyimide adhesion enhancement to polyimide film
02/27/2003WO2002064301A3 Laser micromachining and electrical structures
02/27/2003WO2002057075A3 Multi-level web structure in use for thin sheet processing
02/27/2003WO2002055977A3 Air data sensor
02/27/2003WO2002018495A1 Resin composition, molded object thereof, and use thereof
02/27/2003WO2002018285A1 Glass ceramic mass and use thereof
02/27/2003US20030040781 Implantable medical device employing integral housing for a formable flat battery
02/27/2003US20030040563 Can be shaped into a variety of articles such as packaging materials for semiconductor devices
02/27/2003US20030040166 Apparatus and method for stacking integrated circuits
02/27/2003US20030040138 Method of manufacturing circuit device
02/27/2003US20030039901 Precision fiducial
02/27/2003US20030039841 Enhanced ceramic layers for laminated ceramic devices and method
02/27/2003US20030039812 Ion exchanging clay; dimensional stability, waterproofing
02/27/2003US20030039811 Circuit board and production method thereof
02/27/2003US20030039107 Operating mechanism
02/27/2003US20030039106 Double-sided wiring board and its manufacture method
02/27/2003US20030039105 System board
02/27/2003US20030039101 Module component, core substrate element assembly, multi-layer substrate, method of manufacturing core substrate element assembly, method of manufacturing multi-layer substrate, and method of manufacturing module component
02/27/2003US20030039060 Spindle motor structure and thin type flexible disk drive having the same
02/27/2003US20030038780 Joystick
02/27/2003US20030038705 Mounting structure for thermistor with positive resistance-to-temperature characteristic
02/27/2003US20030038698 Card-type apparatus and method for generating zero magnetic field
02/27/2003US20030038686 Electromagnetic emission reduction technique for shielded connectors
02/27/2003US20030038647 Probe card for probing wafers with raised contact elements
02/27/2003US20030038639 Data processing systems having mismatched impedance components
02/27/2003US20030038379 Laminate film for mounting electronic devices and film carrier tape for mounting electronic devices
02/27/2003US20030038373 Spacer - connector stud for stacked surface laminated multichip modules and methods of manufacture
02/27/2003US20030038372 Electronic component and production method thereof
02/27/2003US20030038366 Three-dimensional semiconductor device having plural active semiconductor components
02/27/2003US20030038344 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
02/27/2003US20030038280 For connecting throughhole-type conductive bumps between printed circuit layers
02/27/2003US20030038096 Printed circuit board stiffener
02/27/2003US20030037961 E-Z circut board
02/27/2003US20030037960 Layered circuit boards and methods of production thereof
02/27/2003US20030037702 Electronically addressable microencapsulated ink and display thereof
02/27/2003US20030037435 Methods for trimming electrical parameters in an electrical circuit
02/27/2003US20030037434 Method of manufacturing a metal-ceramic circuit board
02/27/2003CA2420843A1 Resin composition, molded object thereof, and use thereof
02/26/2003EP1286579A1 Multilayer printed wiring board
02/26/2003EP1286575A2 Module component, core substrate element assembly, multi-layer substrate, method of manufacturing core substrate element assembly, method of manufacturing multi-layer substrate, and method of manufacturing module component
02/26/2003EP1286464A1 Coupling adjusting structure for double-tuned circuit
02/26/2003EP1285895A1 Chopped strand for glass paper
02/26/2003EP1285462A2 Semiconductor component comprising a surface metallization
02/26/2003EP1190608B1 Porous power and ground planes for reduced pcb delamination and better reliability
02/26/2003EP0956564B1 Polymeric compositions having a temperature-stable dielectric constant
02/26/2003CN2538116Y Connection structurefor master and slave circuit board
02/26/2003CN1399768A 存储卡 Memory Card
02/26/2003CN1399507A Circuit board making process
02/26/2003CN1102329C Method of attaching flexible circuit to substrate
02/25/2003US6526519 Method and apparatus for reducing signal timing skew on a printed circuit board
02/25/2003US6526465 PCI and compactpci integration
02/25/2003US6525945 Method and system for wide band decoupling of integrated circuits
02/25/2003US6525944 Windowed package for electronic circuitry
02/25/2003US6525921 Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
02/25/2003US6525718 Flexible circuit board and liquid crystal display device incorporating the same
02/25/2003US6525631 System and method for improved microstrip termination
02/25/2003US6525623 Multi-layer microwave circuits and methods of manufacture
02/25/2003US6525622 Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conducts of an electrical power distribution structure
02/25/2003US6525429 Methods of making microelectronic assemblies including compliant interfaces
02/25/2003US6525414 Semiconductor device including a wiring board and semiconductor elements mounted thereon
02/25/2003US6525275 High densification of solder pads; reduced wiring layers; mounting of flip chips
02/25/2003US6525009 Such as sodium polyacrylate in excess alkali; removal of conductive paste residue from screening masks used in ceramic semiconductor substrate manufacture
02/25/2003US6524892 Method of fabricating multilayer flexible wiring boards
02/25/2003US6524770 Hexaaryl biimidazole compounds as photoinitiators, photosensitive composition and method of manufacturing patterns using the compounds
02/25/2003US6524758 Method of manufacture of printed wiring boards and flexible circuitry
02/25/2003US6524717 A resin impregnated into a substrate, 25% of an inorganic filler and a silicone polymer
02/25/2003US6524711 Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition
02/25/2003US6524709 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board
02/25/2003US6524645 Process for the electroless deposition of metal on a substrate
02/25/2003US6524352 Printed circuit boards
02/25/2003US6524122 Retractable connector for use with electronic devices
02/25/2003US6524114 Board connecting terminal and connector using the terminal
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