Patents for H05K 1 - Printed circuits (98,583)
01/2003
01/09/2003WO2003003456A2 Electronic assembly with vertically connected capacitors and manufacturing method
01/09/2003WO2003003421A2 Optical chip packaging via through hole
01/09/2003WO2003003381A1 Low temperature method and compositions for producing electrical conductors
01/09/2003WO2003002961A1 Very low phase noise temperature stable voltage controlled oscillator
01/09/2003WO2003002929A2 Ignitor with printed electrostatic discharge spark gap
01/09/2003WO2003002675A1 Selective deposition of circuit-protective polymers
01/09/2003WO2002068514A3 Solid surface sheet materials containing synthetic mica
01/09/2003WO2002025709A3 Integrated thin film capacitor/inductor/interconnect system and method
01/09/2003WO2001069717A9 Method for forming radio frequency antenna using conductive inks
01/09/2003WO2001068567A3 Photostructured paste
01/09/2003US20030009726 Method and apparatus for the formation of laminated circuit having passive componets therein
01/09/2003US20030009684 Tamper-evident and/or tamper-resistant electronic components
01/09/2003US20030008989 Polymer synthesis and films therefrom
01/09/2003US20030008590 Three-dimensional nonwoven substrate for circuit board
01/09/2003US20030008549 Holder
01/09/2003US20030008535 Electrical contact and electrical connection device using same
01/09/2003US20030008182 Comprises shrink-suppressing layers on main surface of presintered ceramic; efficiency; electronic
01/09/2003US20030008156 Selective deposition of circuit-protective polymers
01/09/2003US20030008123 Carbon tubes dispersed in polymer matrix; high energy capacitors
01/09/2003US20030007745 Optically interconnecting integrated circuit chips
01/09/2003US20030007421 Drug delivery management system
01/09/2003US20030007340 Electrical device allowing for increased device densities
01/09/2003US20030007339 Stacked backplane assembly
01/09/2003US20030007338 Device and bridge card for a computer
01/09/2003US20030007337 Multiple channel modules and bus systems using same
01/09/2003US20030007331 Flexible printed circuit board and connecting method thereof
01/09/2003US20030007330 Multilayer circuit board and method for manufacturing multilayer circuit board
01/09/2003US20030007292 Reduced stiffness printed circuit head interconnect
01/09/2003US20030007289 Multilayer suspension, head gimbal assembly and manufacturing method of head gimbal assembly
01/09/2003US20030007084 Small image pickup module
01/09/2003US20030006857 High performance dense wire for printed circuit board
01/09/2003US20030006855 Center electrode assembly, nonreciprocal circuit device, communication device, and method of producing the center electrode assembly
01/09/2003US20030006798 Engagement probes
01/09/2003US20030006650 Method and apparatus for providing wideband power regulation to a microelectronic device
01/09/2003US20030006517 Methods for the production of patterned and unpatterned metal-carbon features
01/09/2003US20030006509 Semiconductor device
01/09/2003US20030006503 Device having resin package and method of producing the same
01/09/2003US20030006500 Circuit board, method for manufacturing same, and high-output module
01/09/2003US20030006491 Single package containing multiple integrated circuit devices
01/09/2003US20030006489 Flexible wiring substrate interposed between semiconductor element and circuit substrate
01/09/2003US20030006402 Mixture of polymer and electroconductive material
01/09/2003US20030006141 Analysis system
01/09/2003US20030006068 System and method for integrating optical layers in a PCB for inter-board communications
01/09/2003US20030006067 High-density electronic circuits
01/09/2003US20030006066 An electronic package having a substrate with electrically conductive filled through holes
01/09/2003US20030006065 Monolithic ceramic electronic component, method for manufacturing the same, and electronic device
01/09/2003US20030006064 Circuit board for memory components
01/09/2003US20030006063 Wiring substrate
01/09/2003US20030006061 Hybrid surface mount and pin thru hole circuit board
01/09/2003US20030005723 Process for manufacturing inorganic article, inorganic article, and circuit substrate
01/09/2003US20030005582 Circuit board, method for manufacturing same, and high-output module
01/09/2003US20030005576 Process for making electronic chip device incorporating plural elements
01/09/2003DE9321655U1 Printed circuit board coil structure - has groups of parallel track sections on both sides of PCB connected via metallised through holes
01/09/2003CA2451636A1 Low temperature method and compositions for producing electrical conductors
01/09/2003CA2447348A1 Optical chip packaging via through hole
01/08/2003EP1274289A1 HDI circuit board and manufacturing method of an HDI circuit board
01/08/2003EP1274149A2 Radio frequency circuit manufacturing method and radio frequency circuit
01/08/2003EP1274126A2 Circuit board, method for manufacturing same, and high-output module
01/08/2003EP1274125A2 Circuit board, method for manufacturing same, and high-output module
01/08/2003EP1273998A1 Tamper-evident and/or tamper-resistant electronic components
01/08/2003EP1273608A1 Flame-retardant epoxy resin composition, molded object thereof, and electronic part
01/08/2003EP1273212A1 Double-sided wiring board and its manufacture method
01/08/2003EP1273181A2 Splitter architecture for a telecommunication system
01/08/2003EP1273093A2 Dc power adapter system
01/08/2003EP1273058A2 Thin-film battery having ultra-thin electrolyte and associated method
01/08/2003EP1273054A2 Battery-operated wireless-communication apparatus and method
01/08/2003EP1273040A2 Contactless interconnection system
01/08/2003EP1272550A1 Impregnated glass fiber strands and products including the same
01/08/2003EP1272285A1 High speed flip chip assembly process
01/08/2003EP1218178A4 An adhesion promoting layer for use with epoxy prepregs
01/08/2003EP1073781A4 Method of electrophoretic deposition of ceramic bodies for use in manufacturing dental appliances
01/08/2003CN1390238A Highly stable packaging substrates and brominated indane derivatives
01/08/2003CN1390088A Power assembly and method for manufacturing the same
01/08/2003CN1390086A Method for making multi-layer circuit assembly
01/08/2003CN1390075A Electronic component and mobile communicating device using the same
01/08/2003CN1389958A Connecting plug and method for manufacturing the same
01/08/2003CN1389935A Fixing device of plate-type magnetic-resistance sensing element
01/08/2003CN1389877A Strip-like cable
01/08/2003CN1389848A Liquid crystal display apparatus with drive IC fitted on to flexible board directly connected with liquid crystal display face-board
01/08/2003CN1389325A Method for fixing electronic element using lead-less tin-zinc soldering material without redacing connection strength
01/08/2003CN1098620C Contact arrangement for detachably attaching an electric component, especially integrated circuit to printed circuit board
01/08/2003CN1098393C Aramid papers of improved solvent resistance and dimensionally stable laminates mad therefrom
01/08/2003CN1098392C Heat resistant fiber sheet
01/07/2003US6505330 Method and apparatus for designing trace lengths of a clocked bus of a mounting surface
01/07/2003US6504726 Telecommunications patch panel
01/07/2003US6504725 Topology for PCI bus riser card system
01/07/2003US6504724 Structure of drawing out flexible circuit member
01/07/2003US6504705 Electrolytic capacitor, circuit board containing electrolytic capacitor, and method for producing the same
01/07/2003US6504444 High frequency integrated circuit including an isolator and dielectric filter
01/07/2003US6504389 Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems
01/07/2003US6504366 Magnetometer package
01/07/2003US6504248 Surface treatment of organic insulating film and the removal of oxidized surface layer on lower electrode are done at same time by irradiation with inert gas ion; increased adhesion strength and reliable electroconductivity
01/07/2003US6504110 Insulating circuit board and power semiconductor apparatus employing the same
01/07/2003US6504105 Solder ball connections and assembly process
01/07/2003US6504104 Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array
01/07/2003US6503645 Barium, zirconium, zinc, tantalum oxide ceramic and a glass component comprising silicon oxide and boron oxide and at least one of an alkaline earth metal oxide and zinc oxide
01/07/2003US6503291 Froming metal hydroxide; reduction
01/07/2003US6503089 Socket for electrical parts
01/07/2003US6503088 I-channel surface-mount connector with extended flanges
01/07/2003US6502968 Printed circuit board having a light source