| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 02/13/2003 | WO2003013148A2 Microencapsulated electrophoretic display with integrated driver |
| 02/13/2003 | WO2003012868A1 Semiconductor device and its manufacturing method |
| 02/13/2003 | WO2003012802A1 Method for producing nanocomposite magnet using atomizing method |
| 02/13/2003 | WO2003012547A1 Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern |
| 02/13/2003 | WO2003011952A1 Polyparaxylylene film, production method therefor and semiconductor device |
| 02/13/2003 | WO2003011589A1 Capacitor layer forming both-side copper-clad laminated heet and production method therefor |
| 02/13/2003 | WO2003011141A1 Ultrasound probe wiring method and apparatus |
| 02/13/2003 | WO2002080302B1 Multi-layer flat plate antenna with low-cost material and high-conductivity additive processing |
| 02/13/2003 | WO2002052910A3 Manufacture of printed circuits using single layer processing techniques |
| 02/13/2003 | US20030033108 Multilayer board in which wiring of signal line that requires tamper-resistance is covered by component or foil, design apparatus, method, and program for the multilayer board, and medium recording the program |
| 02/13/2003 | US20030032337 Adapter for a light source |
| 02/13/2003 | US20030032312 Constitution connector |
| 02/13/2003 | US20030032309 Improvement to Current Mode Data Bus Incorporating Integrated Coupler Circuitry |
| 02/13/2003 | US20030032217 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures |
| 02/13/2003 | US20030031888 Copper foil excellent in laser beam drilling performance and production method therefor |
| 02/13/2003 | US20030031873 Laminates for printed wiring boards |
| 02/13/2003 | US20030031830 Printed circuit boards and printed circuit board based substrates structures with multiple core layers |
| 02/13/2003 | US20030031001 Flat panel display and printed circuit board used therein |
| 02/13/2003 | US20030031000 Electrical device allowing for increased device densities |
| 02/13/2003 | US20030030999 High dielectric constant composite material and multilayer wiring board using the same |
| 02/13/2003 | US20030030997 Deformation-resistant mounting structure of portable device |
| 02/13/2003 | US20030030996 Electrical connection box |
| 02/13/2003 | US20030030994 Substrate for electronic part and electronic part |
| 02/13/2003 | US20030030985 Laminated ceramic electroni component, production method therefor, and electronic device |
| 02/13/2003 | US20030030983 Mechanical packaging architecture for heat dissipation |
| 02/13/2003 | US20030030966 Use of 9,9-bis(aminophenyl)fluorene curing agents reduces water adsorption in the dielectric layer |
| 02/13/2003 | US20030030587 Antenna with an integral RF circuit, antenna module incorporating the same, and communication apparatus incorporating the same |
| 02/13/2003 | US20030030585 Printed circuit board antenna |
| 02/13/2003 | US20030030533 Printed circuit board |
| 02/13/2003 | US20030030516 Connected construction of a high-frequency package and a wiring board |
| 02/13/2003 | US20030030510 Multilayered LC composite component and method for manufacturing the same |
| 02/13/2003 | US20030030143 Electronic component with stacked electronic elements and method for fabricating an electronic component |
| 02/13/2003 | US20030029917 Optical reader for imaging module |
| 02/13/2003 | US20030029830 Method for producing multilayer substrate and electronic part, and multilayer electronic part |
| 02/13/2003 | US20030029730 Copper on INVAR® composite |
| 02/13/2003 | US20030029638 Discrete solder ball contact and circuit board assembly utilizing same |
| 02/13/2003 | US20030029637 Circuit board assembly with ceramic capped components and heat transfer vias |
| 02/13/2003 | US20030029636 Coupling of conductive vias to complex power-signal substructures |
| 02/13/2003 | US20030029635 Pathway arrangement |
| 02/13/2003 | US20030029634 Aromatic liquid-crystalline polyester metal laminate |
| 02/13/2003 | US20030029631 Power, ground, and routing scheme for a microprocessor power regulator |
| 02/13/2003 | US20030029541 Conductive resin composition and contact board using the same |
| 02/13/2003 | US20030029026 Integrated lead suspension with IC chip and method of manufacture |
| 02/13/2003 | DE20217628U1 Miniature pulse transformer has circuit boards with pairs of planar spiral windings |
| 02/13/2003 | CA2424557A1 Radiation sensitive dielectric constant changing composition and dielectric constant changing method |
| 02/12/2003 | EP1283663A2 Printed circuit board |
| 02/12/2003 | EP1282655A2 Thermosetting resins and laminates |
| 02/12/2003 | EP1103163B1 High frequency heating apparatus |
| 02/12/2003 | EP0909462B1 Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules |
| 02/12/2003 | EP0717749B1 Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics |
| 02/12/2003 | CN1397154A Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body |
| 02/12/2003 | CN1397153A Circuit board producing method and circuit board producing device |
| 02/12/2003 | CN1397152A High speed interconnect |
| 02/12/2003 | CN1397101A Electrical cornector having customizable circuit board wafers |
| 02/12/2003 | CN1397093A Flexible electronic device |
| 02/12/2003 | CN1396943A Liquid thermosetting resin composition, printed wiring boards and process for their production |
| 02/12/2003 | CN1396937A Polynuclear epoxy compound, resin obtained therefrom curable with actinic energy ray, and photocurable/thermosetting resin composition containing the same |
| 02/12/2003 | CN1396800A Manufacture method of circuit substrate and circuit substrate and its power switching module |
| 02/12/2003 | CN1396799A Printed circuit board with improved pad structure |
| 02/12/2003 | CN1396798A Laminated substrate for flexible printed substrate |
| 02/12/2003 | CN1396797A Multilayer terminal plate assembly, multilayer terminal plate assembly unit and its manufacturing method |
| 02/12/2003 | CN1396796A Multilayer circuit board and method for manufacturing multilayer circuit board |
| 02/12/2003 | CN1396675A Central electrode subassembly and its production method, nonreciprocal circuit device, communication device |
| 02/12/2003 | CN1396655A Circuit board and its making method and high output module |
| 02/12/2003 | CN1396654A Circuit board and its making method and high-output module |
| 02/12/2003 | CN1396653A 半导体装置 Semiconductor device |
| 02/12/2003 | CN1396212A Active energy line solidified polyimide resin composition |
| 02/12/2003 | CN1101420C Poly(phenylene ether) thermoset compositions |
| 02/11/2003 | US6519741 Power decoupling circuit generating system and power decoupling circuit generating method |
| 02/11/2003 | US6519658 Memory unit and method of assembling a computer |
| 02/11/2003 | US6519173 Memory system |
| 02/11/2003 | US6519172 Apparatus for on-board programming of serial EEPROMS |
| 02/11/2003 | US6519161 Molded electronic package, method of preparation and method of shielding-II |
| 02/11/2003 | US6519156 Surface mounted conduction heat sink |
| 02/11/2003 | US6519152 Yarn processing system |
| 02/11/2003 | US6519021 Wiring board for connection of electro-optical panel, electro-optical device and electronic apparatus |
| 02/11/2003 | US6519020 Liquid crystal display module, using a flexible printed circuit board with enhanced thermocompression characteristics |
| 02/11/2003 | US6518936 Precision etched radome |
| 02/11/2003 | US6518868 Thermally conducting inductors |
| 02/11/2003 | US6518864 Coplanar transmission line |
| 02/11/2003 | US6518844 Suspended transmission line with embedded amplifier |
| 02/11/2003 | US6518677 Semiconductor flip-chip package and method for the fabrication thereof |
| 02/11/2003 | US6518675 Wafer level package and method for manufacturing the same |
| 02/11/2003 | US6518674 For use in test and burn-in, and subsequent removal without damaging the solder balls, by using first and second volumes of fusible material with melting points such that first volume is not melted when first and second are joined |
| 02/11/2003 | US6518672 Multi-layer wiring board substrate and semiconductor device using the multi-layer wiring substrate |
| 02/11/2003 | US6518666 Circuit board reducing a warp and a method of mounting an integrated circuit chip |
| 02/11/2003 | US6518663 Constant impedance routing for high performance integrated circuit packaging |
| 02/11/2003 | US6518661 Apparatus for metal stack thermal management in semiconductor devices |
| 02/11/2003 | US6518658 Surface-mounting type electronic circuit unit suitable for miniaturization |
| 02/11/2003 | US6518656 Reduced thickness optical image pickup device with improved sealing and method of making same |
| 02/11/2003 | US6518518 Resin substrate |
| 02/11/2003 | US6518515 Printed wiring board, and method and apparatus for manufacturing the same |
| 02/11/2003 | US6518514 Circuit board and production of the same |
| 02/11/2003 | US6518512 Structure for inspecting electrical component alignment |
| 02/11/2003 | US6518510 Bump-attached wiring circuit board and method for manufacturing same |
| 02/11/2003 | US6518509 Copper plated invar with acid preclean |
| 02/11/2003 | US6518503 Bending-resistant flexible flat cable and production process thereof |
| 02/11/2003 | US6518496 Non-silicone conductive paste for the electrical industry, and its use |
| 02/11/2003 | US6518392 Encapped oligomeric polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid esters as precursors for dielectric compounds |
| 02/11/2003 | US6518390 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device |