Patents for H05K 1 - Printed circuits (98,583) |
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03/06/2003 | WO2003018645A1 Functionalised nanoparticle films |
03/06/2003 | WO2003018509A1 Enhanced ceramic layers for laminated ceramic devices |
03/06/2003 | WO2003018507A2 Dielectric ceramic composition |
03/06/2003 | WO2003018285A1 Method and device for forming module electronic component and module electronic component |
03/06/2003 | WO2002103848A3 Apparatus and methods to pre-stress anisotropic conductive elastomer meterials |
03/06/2003 | WO2002082465A3 The use of conductor compositions in electronic circuits |
03/06/2003 | WO2002073558A3 Improvements in and relating to smoke detectors |
03/06/2003 | US20030045785 Low-noise optical probes for reducing ambient noise |
03/06/2003 | US20030045669 Polyimide resin and resin composition, adhesive solution, film-state joining component,and adhesive laminate film improved in moisture resistance using it,and production methods therefor |
03/06/2003 | US20030045635 Polysilazane-modified polyamine hardeners for epoxy resins |
03/06/2003 | US20030045177 Flexible wiring plate and an electronic device for recording and/or playing back information using the flexible wiring plate |
03/06/2003 | US20030045164 Non-woven fabric material and prepreg, and circuit board using the same |
03/06/2003 | US20030045024 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
03/06/2003 | US20030045016 Wire connection structure and method of manufacturing the same |
03/06/2003 | US20030044699 Check board replacement systems |
03/06/2003 | US20030044631 Thermally conductive elastomeric pad and method of manufacturing same |
03/06/2003 | US20030044610 Method for manufacturing a metal powder, a metal powder, an electroconductive paste using the same, and a multilayer ceramic electronic component using the same |
03/06/2003 | US20030044597 Thermally fusion-bonded with liquid crystal polymer. |
03/06/2003 | US20030044590 X-ray printing personalization technique |
03/06/2003 | US20030044589 Ceramic board for apparatuses for semiconductor manufacture and inspection |
03/06/2003 | US20030044582 Screen printing process |
03/06/2003 | US20030044547 An acrylated epoxy oligomer; an isobornyl acrylate monomer; a photoinitiator; a magnetic powder; may be used to produce printed capacitors and inductors. |
03/06/2003 | US20030044521 Low voc laminating formulations |
03/06/2003 | US20030044248 Circuit board production method and circuit board production data |
03/06/2003 | US20030043650 Multilayered memory device |
03/06/2003 | US20030043613 Memory module with equal driver loading |
03/06/2003 | US20030043570 Spread illuminating apparatus with flexible printed circuit |
03/06/2003 | US20030043563 Electronic device and method for manufacturing the same, and method for shielding printed circuit board |
03/06/2003 | US20030043560 Printed circuit board having a microelectronic semiconductor device mount area for trace routing therethrough |
03/06/2003 | US20030043559 Three-dimensional disposition structure of an electric board component |
03/06/2003 | US20030043558 Mounting structure of high-frequency wiring board |
03/06/2003 | US20030043557 System and method for reducing apparent height of a board system |
03/06/2003 | US20030043556 Wiring board and process for producing the same |
03/06/2003 | US20030043552 Circuit board |
03/06/2003 | US20030043508 Flex on suspension with actuator dynamic function |
03/06/2003 | US20030043465 Vehicle mirror system with vehicle heading sensor assembly |
03/06/2003 | US20030043236 Ink-jet recording head and ink-jet recording apparatus |
03/06/2003 | US20030043081 Circuit board and SMD antenna for this |
03/06/2003 | US20030042994 High performance diplexer and method |
03/06/2003 | US20030042881 Programmable power supply |
03/06/2003 | US20030042626 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly |
03/06/2003 | US20030042618 Semiconductor device and a method of manufacturing the same |
03/06/2003 | US20030042604 Power layout structure of main bridge chip substrate and motherboard |
03/06/2003 | US20030042588 TAB type semiconductor device |
03/06/2003 | US20030042585 Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods |
03/06/2003 | US20030042566 Layout structure for providing stable power source to a main bridge chip substrate and a motherboard |
03/06/2003 | US20030042469 Mixture of solvent and metal particles |
03/06/2003 | US20030042295 Self-adhesive flexible repair circuit |
03/06/2003 | US20030042289 Electronic parts assembling and testing method, and electronic circuit baseboard manufactured by the method |
03/06/2003 | US20030042144 Multilayer coating of copper and silver, nickel alloy |
03/06/2003 | US20030042046 Laminate circuit structure and method of fabricating |
03/06/2003 | US20030042044 Circuit board plane interleave apparatus and method |
03/06/2003 | US20030042042 Flexible printed circuit board with reinforcing plate |
03/06/2003 | US20030042041 Connection structure of coaxial cable |
03/06/2003 | US20030042031 Clamp to secure carrier to device for electromagnetic coupler |
03/06/2003 | US20030041947 Method for sinter distortion control |
03/06/2003 | US20030041762 Method for preventing distortions in a flexibly transferred feature pattern |
03/06/2003 | US20030041761 Method for removing unwanted particles from a surface used in the process of flexibly transferring a feature pattern from an inked surface to a substrate |
03/06/2003 | CA2458356A1 High data rate interconnecting device |
03/06/2003 | CA2457847A1 Functionalised nanoparticle films |
03/06/2003 | CA2456769A1 Interconnect module with reduced power distribution impedance |
03/05/2003 | EP1289355A1 Method for producing ceramic substrate |
03/05/2003 | EP1289353A1 Surface mounting type electronic component |
03/05/2003 | EP1289352A2 High-frequency circuit device and method for manufacturing the same |
03/05/2003 | EP1289351A1 "Improved electronic board" |
03/05/2003 | EP1289070A2 Power connector |
03/05/2003 | EP1289053A2 Circuit board and SMD-antenna thereof |
03/05/2003 | EP1289052A2 Antenna with an integral RF circuit, antenna module and communication apparatus incorporating the same |
03/05/2003 | EP1289014A1 Power semiconductor device |
03/05/2003 | EP1289011A2 Switching or control apparatus |
03/05/2003 | EP1288991A2 Protection circuit for communication devices |
03/05/2003 | EP1287725A1 Trimming of embedded structures |
03/05/2003 | EP1287720A1 Electromechanical transducer |
03/05/2003 | EP1287581A1 Waveguide in multilayer structures |
03/05/2003 | EP1286858A1 External mirror on a motor vehicle |
03/05/2003 | EP1247067A4 Low cost hall position sensor and method for fabricating the same |
03/05/2003 | EP1242236A4 Polyolefin composites for printed circuit board and antenna base material |
03/05/2003 | EP1155603B1 Method for making electronic modules with ball connector or with integrated preforms capable of being soldered on a printed circuit and implementing device |
03/05/2003 | EP1125483A4 Case for circuit board for horizontal or vertical mounting |
03/05/2003 | EP0852014B1 Method of controlling printed circuits |
03/05/2003 | CN1401210A Method of printing and printing machine |
03/05/2003 | CN1401209A Copper clad laminated sheet |
03/05/2003 | CN1401148A 印制电路板和连接器组件 Printed circuit board and connector assembly |
03/05/2003 | CN1401138A Ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture |
03/05/2003 | CN1401127A Electronic component-use substrate and electronic component |
03/05/2003 | CN1400856A Device with contact made of conductive carbon black and its contact producing process |
03/05/2003 | CN1400855A Copper alloy foil for integrated board |
03/05/2003 | CN1400854A Electronic device and its design method and making process, circuit substrate and electronic equipment |
03/05/2003 | CN1400101A Circuit board connector, integrated circuit chip and ink cartridge with the chip |
03/05/2003 | CN1102498C Laminate material and method for sealing and packaging |
03/04/2003 | US6529385 Component array adapter |
03/04/2003 | US6529105 Process and device for bonding two millimeter elements |
03/04/2003 | US6529027 Interposer and methods for fabricating same |
03/04/2003 | US6528986 Inner component board assembly for an electric utility meter |
03/04/2003 | US6528941 Electroluminescent device and shield therefor |
03/04/2003 | US6528900 Circuit connection assembly for vehicle wire harness |
03/04/2003 | US6528889 Electronic circuit device having adhesion-reinforcing pattern on a circuit board for flip-chip mounting an IC chip |
03/04/2003 | US6528872 Packaging structure for ball grid array |
03/04/2003 | US6528870 Semiconductor device having a plurality of stacked wiring boards |
03/04/2003 | US6528869 Semiconductor package with molded substrate and recessed input/output terminals |