Patents for H05K 1 - Printed circuits (98,583)
03/2003
03/06/2003WO2003018645A1 Functionalised nanoparticle films
03/06/2003WO2003018509A1 Enhanced ceramic layers for laminated ceramic devices
03/06/2003WO2003018507A2 Dielectric ceramic composition
03/06/2003WO2003018285A1 Method and device for forming module electronic component and module electronic component
03/06/2003WO2002103848A3 Apparatus and methods to pre-stress anisotropic conductive elastomer meterials
03/06/2003WO2002082465A3 The use of conductor compositions in electronic circuits
03/06/2003WO2002073558A3 Improvements in and relating to smoke detectors
03/06/2003US20030045785 Low-noise optical probes for reducing ambient noise
03/06/2003US20030045669 Polyimide resin and resin composition, adhesive solution, film-state joining component,and adhesive laminate film improved in moisture resistance using it,and production methods therefor
03/06/2003US20030045635 Polysilazane-modified polyamine hardeners for epoxy resins
03/06/2003US20030045177 Flexible wiring plate and an electronic device for recording and/or playing back information using the flexible wiring plate
03/06/2003US20030045164 Non-woven fabric material and prepreg, and circuit board using the same
03/06/2003US20030045024 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
03/06/2003US20030045016 Wire connection structure and method of manufacturing the same
03/06/2003US20030044699 Check board replacement systems
03/06/2003US20030044631 Thermally conductive elastomeric pad and method of manufacturing same
03/06/2003US20030044610 Method for manufacturing a metal powder, a metal powder, an electroconductive paste using the same, and a multilayer ceramic electronic component using the same
03/06/2003US20030044597 Thermally fusion-bonded with liquid crystal polymer.
03/06/2003US20030044590 X-ray printing personalization technique
03/06/2003US20030044589 Ceramic board for apparatuses for semiconductor manufacture and inspection
03/06/2003US20030044582 Screen printing process
03/06/2003US20030044547 An acrylated epoxy oligomer; an isobornyl acrylate monomer; a photoinitiator; a magnetic powder; may be used to produce printed capacitors and inductors.
03/06/2003US20030044521 Low voc laminating formulations
03/06/2003US20030044248 Circuit board production method and circuit board production data
03/06/2003US20030043650 Multilayered memory device
03/06/2003US20030043613 Memory module with equal driver loading
03/06/2003US20030043570 Spread illuminating apparatus with flexible printed circuit
03/06/2003US20030043563 Electronic device and method for manufacturing the same, and method for shielding printed circuit board
03/06/2003US20030043560 Printed circuit board having a microelectronic semiconductor device mount area for trace routing therethrough
03/06/2003US20030043559 Three-dimensional disposition structure of an electric board component
03/06/2003US20030043558 Mounting structure of high-frequency wiring board
03/06/2003US20030043557 System and method for reducing apparent height of a board system
03/06/2003US20030043556 Wiring board and process for producing the same
03/06/2003US20030043552 Circuit board
03/06/2003US20030043508 Flex on suspension with actuator dynamic function
03/06/2003US20030043465 Vehicle mirror system with vehicle heading sensor assembly
03/06/2003US20030043236 Ink-jet recording head and ink-jet recording apparatus
03/06/2003US20030043081 Circuit board and SMD antenna for this
03/06/2003US20030042994 High performance diplexer and method
03/06/2003US20030042881 Programmable power supply
03/06/2003US20030042626 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly
03/06/2003US20030042618 Semiconductor device and a method of manufacturing the same
03/06/2003US20030042604 Power layout structure of main bridge chip substrate and motherboard
03/06/2003US20030042588 TAB type semiconductor device
03/06/2003US20030042585 Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods
03/06/2003US20030042566 Layout structure for providing stable power source to a main bridge chip substrate and a motherboard
03/06/2003US20030042469 Mixture of solvent and metal particles
03/06/2003US20030042295 Self-adhesive flexible repair circuit
03/06/2003US20030042289 Electronic parts assembling and testing method, and electronic circuit baseboard manufactured by the method
03/06/2003US20030042144 Multilayer coating of copper and silver, nickel alloy
03/06/2003US20030042046 Laminate circuit structure and method of fabricating
03/06/2003US20030042044 Circuit board plane interleave apparatus and method
03/06/2003US20030042042 Flexible printed circuit board with reinforcing plate
03/06/2003US20030042041 Connection structure of coaxial cable
03/06/2003US20030042031 Clamp to secure carrier to device for electromagnetic coupler
03/06/2003US20030041947 Method for sinter distortion control
03/06/2003US20030041762 Method for preventing distortions in a flexibly transferred feature pattern
03/06/2003US20030041761 Method for removing unwanted particles from a surface used in the process of flexibly transferring a feature pattern from an inked surface to a substrate
03/06/2003CA2458356A1 High data rate interconnecting device
03/06/2003CA2457847A1 Functionalised nanoparticle films
03/06/2003CA2456769A1 Interconnect module with reduced power distribution impedance
03/05/2003EP1289355A1 Method for producing ceramic substrate
03/05/2003EP1289353A1 Surface mounting type electronic component
03/05/2003EP1289352A2 High-frequency circuit device and method for manufacturing the same
03/05/2003EP1289351A1 "Improved electronic board"
03/05/2003EP1289070A2 Power connector
03/05/2003EP1289053A2 Circuit board and SMD-antenna thereof
03/05/2003EP1289052A2 Antenna with an integral RF circuit, antenna module and communication apparatus incorporating the same
03/05/2003EP1289014A1 Power semiconductor device
03/05/2003EP1289011A2 Switching or control apparatus
03/05/2003EP1288991A2 Protection circuit for communication devices
03/05/2003EP1287725A1 Trimming of embedded structures
03/05/2003EP1287720A1 Electromechanical transducer
03/05/2003EP1287581A1 Waveguide in multilayer structures
03/05/2003EP1286858A1 External mirror on a motor vehicle
03/05/2003EP1247067A4 Low cost hall position sensor and method for fabricating the same
03/05/2003EP1242236A4 Polyolefin composites for printed circuit board and antenna base material
03/05/2003EP1155603B1 Method for making electronic modules with ball connector or with integrated preforms capable of being soldered on a printed circuit and implementing device
03/05/2003EP1125483A4 Case for circuit board for horizontal or vertical mounting
03/05/2003EP0852014B1 Method of controlling printed circuits
03/05/2003CN1401210A Method of printing and printing machine
03/05/2003CN1401209A Copper clad laminated sheet
03/05/2003CN1401148A 印制电路板和连接器组件 Printed circuit board and connector assembly
03/05/2003CN1401138A Ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
03/05/2003CN1401127A Electronic component-use substrate and electronic component
03/05/2003CN1400856A Device with contact made of conductive carbon black and its contact producing process
03/05/2003CN1400855A Copper alloy foil for integrated board
03/05/2003CN1400854A Electronic device and its design method and making process, circuit substrate and electronic equipment
03/05/2003CN1400101A Circuit board connector, integrated circuit chip and ink cartridge with the chip
03/05/2003CN1102498C Laminate material and method for sealing and packaging
03/04/2003US6529385 Component array adapter
03/04/2003US6529105 Process and device for bonding two millimeter elements
03/04/2003US6529027 Interposer and methods for fabricating same
03/04/2003US6528986 Inner component board assembly for an electric utility meter
03/04/2003US6528941 Electroluminescent device and shield therefor
03/04/2003US6528900 Circuit connection assembly for vehicle wire harness
03/04/2003US6528889 Electronic circuit device having adhesion-reinforcing pattern on a circuit board for flip-chip mounting an IC chip
03/04/2003US6528872 Packaging structure for ball grid array
03/04/2003US6528870 Semiconductor device having a plurality of stacked wiring boards
03/04/2003US6528869 Semiconductor package with molded substrate and recessed input/output terminals