Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
03/2003
03/13/2003US20030049952 Method and apparatus to compliantly interconnect commercial-off-the-shelf chip scale packages and printed wiring boards
03/13/2003US20030049949 Computer system, switch connector, and method for controlling operations of the computer system
03/13/2003US20030049948 Apparatus and method for coupling buses
03/13/2003US20030049886 Electronic system modules and method of fabrication
03/13/2003US20030049885 Semiconductor package, method of manufacturing the same, and semiconductor device
03/13/2003US20030049572 Method for forming patterned insulating elements and methods for making electron source and image display device
03/13/2003US20030049517 Metal-air battery components and methods for making same
03/13/2003US20030049487 Process for preparing metal-coated aromatic polyimide film
03/13/2003US20030049412 Process of forming a pattern on a substrate
03/13/2003US20030049193 For use in printed circuit boards; semiconductors
03/13/2003US20030049166 Sensor substrate and method of fabricating same
03/13/2003US20030048998 Optical/electrical interconnects and package for high speed signaling
03/13/2003US20030048621 Multi-folded printed wiring construction for an implantable medical device
03/13/2003US20030048620 Printed-circuit board with fuse
03/13/2003US20030048616 Memory module
03/13/2003US20030048457 Rapid in-situ mastering of an aspheric fizeau
03/13/2003US20030048172 Composition and method for manufacturing integral resistors in printed circuit boards
03/13/2003US20030048111 Test Fixture Comprising Drilled and Etched Pin holes and Related Methods.
03/13/2003US20030047849 Method of modifying the temperature stability of a low temperature cofired ceramics (LTCC)
03/13/2003US20030047809 Embedding resin and wiring substrate using the same
03/13/2003US20030047807 Electronic package having a thermal stretching layer
03/13/2003US20030047801 Semiconductor device and manufacturing method of the same
03/13/2003US20030047800 Semiconductor integrated circuit modules, manufacturing methods and usage thereof
03/13/2003US20030047799 Wafer level interconnection
03/13/2003US20030047357 Forming a through hole in a photoimageable dielectric structure
03/13/2003US20030047356 Electronic assembly and a method of constructing an electronic assembly
03/13/2003US20030047355 Printed wiring board with high density inner layer structure
03/13/2003US20030047353 Multilayer modules with flexible substrates
03/13/2003US20030047352 Substrate design of a chip using a generic substrate design
03/13/2003US20030047351 Thermal stable low elastic modulus material and device using the same
03/13/2003US20030047350 Embedded PCB identification
03/13/2003US20030047349 Integrated circuit package and printed circuit board arrangement
03/13/2003US20030047348 Grid array mounting arrangements
03/13/2003US20030047344 I-channel surface-mount connector with extended flanges
03/13/2003US20030047304 Power feed and heat dissipating device for power semiconductor devices
03/13/2003US20030046809 Method of connecting a device to a support, and pad for establishing a connection between a device and a support
03/13/2003CA2455073A1 Grinding of liquid crystalline polymers
03/12/2003EP1292177A1 Method for preparing substrate for flexible print wiring board and substrate for flexible print wiring board
03/12/2003EP1291983A2 Connecting unit for an electrical modul
03/12/2003EP1291911A1 Method having resin package and method of producing the same
03/12/2003EP1291750A2 Electromagnetic interference reduction system
03/12/2003EP1291577A1 Small portable flashlight
03/12/2003EP1290753A1 Electronically tunable dielectric composite thick films
03/12/2003EP1290536A2 Usb-compliant personal key using a smartcard processor and a smartcard reader emulator
03/12/2003EP1290054A1 Glyoxal-phenolic condensates with enhanced fluorescence
03/12/2003EP1046326B1 Printed circuit board assembly having an integrated fusible link
03/12/2003EP1008207B1 Cable assembly
03/12/2003CN2540051Y Small connect-disconnect transmit-receive module shell
03/12/2003CN1402959A Multilayered printed circuit board
03/12/2003CN1402760A 树脂组合物和挠性印刷电路板 The resin composition and the flexible printed circuit board
03/12/2003CN1402753A Impregnated glass fiber strands and products including same
03/12/2003CN1402750A Poly (phenylene ether)-polyvinyl thermosetting resin
03/12/2003CN1402695A Impregnated glass fibre strands and products including same
03/12/2003CN1402604A Wiring layer of silver or silver alloy, mfg. method thereof and display screen substrate therewith
03/12/2003CN1402603A Method for improving inverter line of suppressing high-speed line electromagnetic interference
03/12/2003CN1402602A Printed circuit board fixing pin assembly and assembling method thereof
03/12/2003CN1402426A Multi-layer LC composite element and mfg. method thereof
03/12/2003CN1402320A Circuit device mfg. method
03/12/2003CN1402186A Upper chip for secondary board of optic mouse
03/12/2003CN1402086A Pattern, wiring, circuit board, electron source and image forming device mfg. method
03/12/2003CN1401482A Asymmetric tape auto-joining device
03/12/2003CN1103179C Microelectronic connecting element and module contg. same
03/11/2003US6532439 Method for determining the desired decoupling components for power distribution systems
03/11/2003US6532157 Angulated semiconductor packages
03/11/2003US6532143 Multiple tier array capacitor
03/11/2003US6531928 High-frequency module
03/11/2003US6531810 Electric load
03/11/2003US6531775 High-frequency module
03/11/2003US6531772 Electronic system including memory module with redundant memory capability
03/11/2003US6531770 Electronic part unit attached to a circuit board and including a cover member covering the electronic part
03/11/2003US6531760 Semiconductor device
03/11/2003US6531677 Method and apparatus for drilling printed wiring boards
03/11/2003US6531662 Circuit board, battery pack, and method of manufacturing circuit board
03/11/2003US6531661 Multilayer printed circuit board and method of making the same
03/11/2003US6531660 Printed substrate board
03/11/2003US6531559 Thermoplastic resins comprising blends of allyl and vinyl homo/copolymers having good viscosity and elasticity, used as fibers or films
03/11/2003US6531370 Method for manufacturing circuit devices
03/11/2003US6531257 Organic binder having an acid functional group, a copper powder with a surface layer of thickness .1 mu m and copper oxide as a main component, and a photosensitive organic component
03/11/2003US6531181 Process for producing a conductive coating on glass or on enamelled steel and substrates coated by this process
03/11/2003US6531026 Method for mounting electronic elements
03/11/2003US6531022 Mounting method of semiconductor element
03/11/2003US6530792 Cover connecting mechanism
03/11/2003US6530790 Electrical connector
03/11/2003US6530787 Coaxial plug connector for mounting on a circuit board
03/11/2003US6530786 Printed circuit board-connecting connector
03/11/2003US6530147 Forming glass fiber reinforced resin coated copper prepreg
03/10/2003CA2402055A1 Method and apparatus to compliantly interconnect commercial-off-the-shelf chip scale packages and printed wiring boards
03/06/2003WO2003020004A1 Layered circuit boards and methods of production thereof
03/06/2003WO2003020001A1 Multi-milling method for the production of printed circuits and the printed circuits thus obtained
03/06/2003WO2003019999A1 Low cost, large scale rf hybrid package for simple assembly onto mixed signal printed wiring boards
03/06/2003WO2003019998A1 Thermosetting electroconductive paste for electroconductive bump use
03/06/2003WO2003019997A1 Improved heat sink for surface mounted power devices
03/06/2003WO2003019742A1 Optical data link
03/06/2003WO2003019734A1 High data rate interconnecting device
03/06/2003WO2003019733A1 Electromagnetic emission reduction technique for shielded connectors
03/06/2003WO2003019656A2 Interconnect module with reduced power distribution impedance
03/06/2003WO2003019651A2 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
03/06/2003WO2003019506A1 Illuminated sign or display apparatus and mounting of circuit devices
03/06/2003WO2003019467A1 A pin pad
03/06/2003WO2003018675A1 Resin composition, prepreg, laminated sheet and semiconductor package
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