Patents for H05K 1 - Printed circuits (98,583)
03/2003
03/20/2003US20030053714 Method and apparatus for searching for fiducial marks, and method of detecting positions of the fiducial marks
03/20/2003US20030053303 Circuit board assembly having a compact structure
03/20/2003US20030053302 Printed circuit board routing and power delivery for high frequency integrated circuits
03/20/2003US20030053301 High-g mounting arrangement for electronic chip carrier
03/20/2003US20030053296 Cooling device capable of reducing thickness of electronic apparatus
03/20/2003US20030053279 Flexible circuit adhered to metal frame of device
03/20/2003US20030053258 Hard disk drive suspension with integral flexible circuit
03/20/2003US20030053056 Mark for visual inspection upon assembling a display
03/20/2003US20030052968 Inspecting apparatus of printed state or the like in flexible printed circuit board
03/20/2003US20030052655 Integrated magnetic buck converter with magnetically coupled synchronously rectified mosfet gate drive
03/20/2003US20030052594 Lighting apparatus whose light emitting elements are hard to be taken off
03/20/2003US20030052416 A hybrid integrated circuit have the welded connection between a lead and a conductor by a thermoplastic epoxy containing conductive metallic particles; resist to oxidation at elevated operating temperature
03/20/2003US20030052395 Semiconductor device and design support method of electronic device using the same
03/20/2003US20030052340 Magnetic shielding for integrated circuits
03/20/2003US20030052176 Data processing system and data processing method
03/20/2003US20030052156 A soldering means having a curved exterior surface enclosing a first volume, and an interior cavity having a displacement constituting a second volume, useful for electrical and mechaincal connecting two metal planer surfaces
03/20/2003US20030052104 Laser processing apparatus
03/20/2003US20030052099 System and method for unveiling targets embedded in a multi-layered electrical circuit
03/20/2003US20030052077 Method for forming a product sensor, and a product sensor
03/20/2003US20030051909 Ball grid array attaching means having improved reliability and method of manufacturing same
03/20/2003US20030051904 Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip
03/20/2003US20030051902 Multi-layer interconnection board
03/20/2003US20030051893 Surface-mounting connector and semiconductor module using the same
03/20/2003US20030051806 Security tag and process for making same
03/20/2003US20030051799 Printed circuit techniques for polyethylene surfaces
03/20/2003US20030051617 Continuous printing and mounting apparatus for film-like printing body
03/20/2003US20030051340 Apparatus and method for providing a ground reference potential
03/20/2003CA2776343A1 Sensor substrate and method of fabricating same
03/20/2003CA2459401A1 Sensor substrate and method of fabricating same
03/19/2003EP1294023A2 Semiconductor integrated circuit modules, manufacturing methods and usage thereof
03/19/2003EP1293492A1 Joint body of glass-ceramic and aluminum nitride sintered compact and method for producing the same
03/19/2003EP1293110A1 Electronic ballast for a discharge lamp
03/19/2003EP1293009A1 Multi-layer microwave circuits and methods of manufacture
03/19/2003CN1404612A Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact ID and production method thereof
03/19/2003CN1404535A Composite copper foil and manufacturing method thereof
03/19/2003CN1404354A Electronic element assembling examining method
03/19/2003CN1404352A Flexible printing circuit board
03/19/2003CN1404351A High-speed circuit board with high-dielectric coefficient insulating material to lower wire impedance
03/19/2003CN1404350A Flexible electronic circuit board
03/19/2003CN1404120A Method for removing stain from through-hole
03/19/2003CN1403874A Photo-sensitive conducting resin, conductor pattern forming method and manufacturing method of ceramic laminated structural parts
03/19/2003CN1103503C Method for connection beween electronic element and circuit board and its finished products
03/18/2003US6535845 Processing an audio bitstream signal
03/18/2003US6535398 Multichip module substrates with buried discrete capacitors and components and methods for making
03/18/2003US6535396 Combination circuit board and segmented conductive bus substrate
03/18/2003US6535395 Processor power delivery system
03/18/2003US6535393 Electrical device allowing for increased device densities
03/18/2003US6535088 Suspended transmission line and method
03/18/2003US6535083 Embedded ridge waveguide filters
03/18/2003US6535005 Systems and methods for obtaining an electrical characteristics of a circuit board assembly process
03/18/2003US6534968 Integrated circuit test vehicle
03/18/2003US6534875 Semiconductor part for component mounting, mounting structure and mounting method
03/18/2003US6534872 Apparatus and system with increased signal trace routing options in printed wiring boards and integrated circuit packaging
03/18/2003US6534854 Pin grid array package with controlled impedance pins
03/18/2003US6534844 Integrated decoupling networks fabricated on a substrate having shielded quasi-coaxial conductors
03/18/2003US6534726 Module substrate and method of producing the same
03/18/2003US6534725 High-frequency circuit board and semiconductor device using the high-frequency circuit board
03/18/2003US6534707 Method for absorbing active, external and dynamic magnetic fields using a ferrite encapsulated coating
03/18/2003US6534601 Flame retardant epoxy resin modified with phosphorus and silicon
03/18/2003US6534249 Method of making low cost integrated out-of-plane micro-device structures
03/18/2003US6534192 Multi-purpose finish for printed wiring boards and method of manufacture of such boards
03/18/2003US6534181 Lower dielectric constant and dissipation factor, as well as higher thermal and moisture resistance; useful in high-speed, low-loss printed wire board applications
03/18/2003US6534179 Polytriazine product of cyanate ester monomer or prepolymer and a bismaleimide, and a flame inhibitor of a polyepoxide reacted with an organic phosphorus compound
03/18/2003US6534161 Crystallized glass composition, sintered crystallized glass compact, and circuit substrate using the same
03/18/2003US6534160 Dielectric is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impreganated with a thermoset material; printed circuits; good adhesion, dimensional stability, laser drillability
03/18/2003US6534124 Molding a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, air blasting the surface, catalyst coating, activation treatment and electroless plating.
03/18/2003US6533963 Molding material comprising elastic matrix and interspersed coated fiber and coated spheroidal particle fillers
03/18/2003US6533915 Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil
03/18/2003US6533888 Apparatus and method for fabricating buried and flat metal features
03/18/2003US6533860 Process for preparing green pigment composition containing no halogen
03/18/2003US6533620 Electrical connection method and connection site
03/18/2003US6533618 Bi-directional balance low noise communication interface
03/18/2003US6533587 Circuit board riser
03/18/2003US6533586 Electromagnetic coupler socket
03/18/2003US6533396 Printhead cartridge with asymmetrical contacts
03/18/2003US6532683 Drying method for woven glass fabric
03/18/2003US6532652 Method for manufacturing wire harness with branch connection terminals
03/13/2003WO2003022024A1 Printed board unit and electronic apparatus
03/13/2003WO2003022020A2 Sheet material and its use in circuit boards
03/13/2003WO2003022019A2 Wireless suspension design to accommodate multiple drive designs
03/13/2003WO2003021993A1 Wireless access system using selectively adaptable beam forming in tdd frames and method of operation
03/13/2003WO2003021678A1 Package for electronic components and method for forming a package for electronic components
03/13/2003WO2003021672A2 An electronic package having a thermal stretching layer
03/13/2003WO2003021668A1 Wiring board, semiconductor device and method for producing them
03/13/2003WO2003021184A1 Rapid in-situ mastering of an aspheric fizeau
03/13/2003WO2003020780A1 Three-dimensional copolymers of polyphenylene ether resins and sytrenic resins
03/13/2003WO2003020527A2 Screen printing process
03/13/2003WO2003020512A1 High nitrogen containing triazine-phenol-aldehyde condensate
03/13/2003WO2003020511A1 Solid sheet material especially useful for circuit boards
03/13/2003WO2003020484A1 Grinding of liquid crystalline polymers
03/13/2003WO2003003520A3 Printed circuit board with isolated metallic substrate comprising an integrated cooling system
03/13/2003WO2002096177A3 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield
03/13/2003WO2002089664A3 Flex circuit shielded optical sensor and method of fabricating the same
03/13/2003WO2002057919A3 Redundant telecommunication system using standby unit memory updating apparatus and method of operation
03/13/2003WO2002047856A3 Irregular shaped copper particles and methods of use
03/13/2003WO2002033752A3 Electronic module having canopy-type carriers
03/13/2003WO2001073870A3 Integrated capacitor-like battery and associated method
03/13/2003US20030050407 Polyamide acid and polyimide, and optical material
03/13/2003US20030050094 Wireless terminal
03/13/2003US20030049955 Clip for replaceable surface mounted devices