Patents for H05K 1 - Printed circuits (98,583)
03/2003
03/27/2003US20030056972 Flat flexible cable and its connection and contacting
03/27/2003US20030056474 Method of inspecting newly purchased or reground materials for making printed circuit boards
03/27/2003US20030056367 Method and apparatus for reducing the flare in a flex cable
03/27/2003US20030056366 Printed circuit board and method for manufacturing the same
03/27/2003US20030056365 Coupon registration mechanism and method
03/27/2003DE20219746U1 Connection facility for mounting an expansion circuit board onto a main board
03/27/2003DE20118393U1 Connection system for a flat flexible ribbon cable or foil conductor uses particle coating
03/27/2003DE10145348C1 Intermediate carrier for electronic component has suction used for removal of excess solder at foot of contact projections formed integral with plastics carrier body
03/27/2003CA2460565A1 Security tag and process for making same
03/26/2003EP1296544A1 Flexible printed circuit board and foldable cell phone terminal
03/26/2003EP1296453A2 Package substrate for integrated circuit device
03/26/2003EP1296431A2 Bus bar assembly
03/26/2003EP1296422A2 Flex cable
03/26/2003EP1296345A2 Flexible printed circuit adhered to metal frame
03/26/2003EP1295900A2 Uses of epoxy-acrylates
03/26/2003EP1295671A1 Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method
03/26/2003EP1295518A2 Process for thick film circuit patterning
03/26/2003EP1295517A1 Vialess printed circuit board
03/26/2003EP1295516A2 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures
03/26/2003EP1295339A2 Semiconductor chip package with embedded capacitors
03/26/2003EP1295337A1 Process for the manufacture of printed circuit boards with plated resistors
03/26/2003EP1245138B1 Method, facility and device for producing an electrical connecting element, electrical connecting element and semi-finished product
03/26/2003EP1159725B1 Display and backlighting assembly
03/26/2003EP1019986A4 Wiring board constructions and methods of making same
03/26/2003EP0858433B1 Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board
03/26/2003CN1406457A Radio communication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard
03/26/2003CN1406455A Multilayer printed wiring board and method ofr producing multilayer printed wiring board
03/26/2003CN1406454A Production method of circuit board module
03/26/2003CN1406453A 印制电路板 Printed circuit board
03/26/2003CN1406451A Electronic printed-circuit board for electronic devices, especially communications terminals
03/26/2003CN1406385A Laminated circuit board and prodroduction method for electronic part, and laminated electronic part
03/26/2003CN1406262A Adhesive polyimide resin and adhesive laminate
03/26/2003CN1406105A Copper alloy foil for lamina plate
03/26/2003CN1406104A Flexible circuit base board and its manufacturing method
03/26/2003CN1104184C Vibrator holding device
03/26/2003CN1104063C Edge card connector with alignment means
03/26/2003CN1103684C Laminate product and method of manufacture thereof
03/25/2003WO2002027746A1 Lamp base comprising an electronic component and a method for producing a lamp base
03/25/2003US6539449 Capacitively loaded continuity module
03/25/2003US6539157 Layered circuit boards and methods of production thereof
03/25/2003US6539137 Thermo-electric signal coupler
03/25/2003US6538903 Method and apparatus for reducing electromagnetic radiation from a computer enclosure
03/25/2003US6538899 Traceless midplane
03/25/2003US6538890 Heat sink element and high-frequency electronic circuit substrate using such
03/25/2003US6538878 Bus bar assembly
03/25/2003US6538871 Connecting structure of flat circuit member with reinforced connection boundary
03/25/2003US6538801 Electrophoretic displays using nanoparticles
03/25/2003US6538538 High frequency printed circuit board via
03/25/2003US6538525 Voltage biased section of non-linear transmission line
03/25/2003US6538405 Accessory control system
03/25/2003US6538325 Multi-layer conductor system with intermediate buffer layer for improved adhesion to dielectrics
03/25/2003US6538316 High frequency semiconductor device housing package
03/25/2003US6538312 Multilayered microelectronic device package with an integral window
03/25/2003US6538305 BGA type semiconductor device having a solder-flow damping/stopping pattern
03/25/2003US6538214 Method for manufacturing raised electrical contact pattern of controlled geometry
03/25/2003US6538213 High density design for organic chip carriers
03/25/2003US6538210 Circuit component built-in module, radio device having the same, and method for producing the same
03/25/2003US6538207 Strain relief structures for lead connections
03/25/2003US6538205 Cable and method of manufacturing it
03/25/2003US6537852 Spacer - connector stud for stacked surface laminated multichip modules and methods of manufacture
03/25/2003US6537850 Method for fabricating semiconductor components with terminal contacts having alternate electrical paths
03/25/2003US6537411 Simultaneous with graft interfacial free radical polymeri-zation of monomer and crosslinking agent
03/25/2003US6537359 Conductive ink or paint
03/25/2003US6537087 Electrical connector
03/25/2003US6537085 Portable electronic apparatus having external connector fixed at internal circuit board
03/25/2003US6537084 Electrical connector with electrical shield having latch and mounting arms
03/25/2003US6536871 Reliable flex circuit interconnect on inkjet print cartridge
03/25/2003CA2423466A1 Lamp base comprising an electronic assembly, and a method for producing a lamp base
03/20/2003WO2003024170A1 An electronic assembly and a method of constructing an electronic assembly
03/20/2003WO2003024168A1 Ceramic electronic component and production method therefor
03/20/2003WO2003024167A1 Pin-free socket compatible with optical-electrical interconnects
03/20/2003WO2003024166A1 Heat dissipating element for electronic components
03/20/2003WO2003024165A1 Heat dissipating element for electronic components
03/20/2003WO2003024164A2 Clip for replaceable surface mounted devices
03/20/2003WO2003023903A1 Printed wiring board with high density inner layer structure
03/20/2003WO2003023790A1 Conductor composition and method for production thereof
03/20/2003WO2003023787A1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof
03/20/2003WO2003023768A1 Flex on suspension with actuator dynamic function
03/20/2003WO2003023477A2 Optical/electrical interconnects and package for high speed signaling
03/20/2003WO2003023428A1 Test fixture glass etch
03/20/2003WO2003023388A1 Sensor substrate and method of fabricating same
03/20/2003WO2003022780A1 Porous silicon nitride ceramics and method for producing the same
03/20/2003WO2003022778A2 Low temperature cofired ceramics (ltcc) temperature stability
03/20/2003WO2003022581A2 Inkjet deposition apparatus and method
03/20/2003WO2003022575A1 Heat-stabilised poly(ethylene naphthalate) film for flexible electronic and opto-electronic devices
03/20/2003WO2003022571A1 Process for the production of patterned ceramic green-sheets and multilayered ceramic devices
03/20/2003WO2003005616A3 System and method for integrating optical layers in a pcb for inter-board communications
03/20/2003WO2002100140A3 Circuit board with at least one electronic component
03/20/2003WO2002081402A3 Esd dissipative ceramics
03/20/2003WO2002045162A3 Interposer for a semiconductor module, semiconductor produced using such an interposer and method for producing such an interposer
03/20/2003US20030055121 Adhesives
03/20/2003US20030054936 Low-dielectric-constant glass fiber and glass fiber fabric made thereof
03/20/2003US20030054678 Slanted connector
03/20/2003US20030054674 Connection of coaxial cable to a circuit board
03/20/2003US20030054589 Method of improving mount assembly in a multilayer PCB's
03/20/2003US20030054218 Method for making composite particles including a polymer phase
03/20/2003US20030054152 Printed circuit boards
03/20/2003US20030054146 Epoxy resin composition and laminate using the same
03/20/2003US20030053765 Photo-electric combined substrate
03/20/2003US20030053762 Transceiver assembly for use in fiber optics communications