Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
04/2003
04/02/2003CN1407556A Flexible electric circuit board and recording/playing-back device therewith
04/02/2003CN1407462A 系统板 System board
04/02/2003CN1104832C Method for plating independent conductor circuit
04/02/2003CN1104749C Laminated electronic spares
04/02/2003CN1104301C Ultrasonic welding of copper foil
04/01/2003USRE38053 Liquid crystal display device and manufacturing method thereof
04/01/2003US6542393 Dual-bank memory module with stacked DRAM chips having a concave-shaped re-route PCB in-between
04/01/2003US6542384 Riser card local EMI shield for a computer chassis
04/01/2003US6542379 High density circuit
04/01/2003US6542377 Printed circuit assembly having conductive pad array with in-line via placement
04/01/2003US6542376 High density packaging of electronic components
04/01/2003US6542375 Hybrid PCB-IC directional coupler
04/01/2003US6542374 Circuit board, method for manufacturing the circuit board, and display device and electronic equipment employing the circuit board
04/01/2003US6542373 Memory module device formation and mounting methods thereof
04/01/2003US6542352 Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant vias
04/01/2003US6542213 Compression-bond-connection substrate, liquid crystal device, and electronic equipment
04/01/2003US6542065 Variable voltage protection structures and method for making same
04/01/2003US6542048 Suspended transmission line with embedded signal channeling device
04/01/2003US6541942 Capacitor tub assembly and method of cooling
04/01/2003US6541868 Interconnecting conductive links
04/01/2003US6541865 Porous dielectric material and electronic devices fabricated therewith
04/01/2003US6541857 Method of forming BGA interconnections having mixed solder profiles
04/01/2003US6541855 Printed board unit
04/01/2003US6541853 Randomly oriented magnetic particles in a selected localized region of the dielectric are aligned to form an electrically conductive path between the first conductive point and the second conductive point the dielectric
04/01/2003US6541762 Sub chip on board for optical mouse
04/01/2003US6541756 Shielded optical probe having an electrical connector
04/01/2003US6541736 Circuit board/printed circuit board having pre-reserved conductive heating circuits
04/01/2003US6541712 High speed multi-layer printed circuit board via
04/01/2003US6541711 Isolated ground circuit board apparatus
04/01/2003US6541378 High density connectors; connecting copper to dielectric; precleaning with argon; polyimide silicone epoxy adhesive
04/01/2003US6541304 Method of dispensing a viscous material
04/01/2003US6541137 Multi-layer conductor-dielectric oxide structure
04/01/2003US6541126 Copper microparticles deposited on the surface of carrier foil and covered with the release interface layer and electrodeposited copper layer; very accurate holes formed by laser; high yield in production of printed wiring boards
04/01/2003US6541122 Heat shrinkage ratio; glass transition temperature
04/01/2003US6540527 Method and adapter for reworking a circuit containing an LGA device
04/01/2003US6540526 Electrical connector
04/01/2003US6540525 High I/O stacked modules for integrated circuits
04/01/2003US6539626 Electroconductive path parallel to the surface are provided internally
04/01/2003US6539613 Method of forming trimmable resistors
04/01/2003US6539609 Method of forming a head gimbal assembly
03/2003
03/27/2003WO2003026371A1 Low signal loss bonding ply for multilayer circuit boards
03/27/2003WO2003026370A1 Surface mounting package
03/27/2003WO2003026368A1 Method for forming image on object surface including circuit substrate
03/27/2003WO2003026366A1 Flexible wiring board and liquid crystal display unit using the same
03/27/2003WO2003026064A1 Wireless terminal
03/27/2003WO2003026060A1 High-frequency module substrate device
03/27/2003WO2003026010A1 Thin electronic label and method for making same
03/27/2003WO2003026009A2 Power electronics component
03/27/2003WO2003026008A2 Power electronics component
03/27/2003WO2003025976A2 Embedded inductor for semiconductor device circuit
03/27/2003WO2003025974A2 Intermediate support for electronic components and method for solder contacting such an intermediate support
03/27/2003WO2003025589A1 Contact structure, method of manufacturing the structure, and contact assembly using the structure
03/27/2003WO2003025588A1 Contact structure, method of manufacturing the structure, and contact assembly using the structure
03/27/2003WO2003024889A1 Printed circuit techniques for polyethylene surfaces
03/27/2003WO2003024711A2 Method for producing a ceramic substrate and ceramic substrate
03/27/2003WO2003024708A1 Security tag and process for making same
03/27/2003WO2003024707A1 Metal-containing web processed with a continuous etch process
03/27/2003WO2003024695A1 Polymer film and method for preparation thereof
03/27/2003WO2003007078A3 Photocurable resist inks
03/27/2003WO2002023620A3 Connection for conducting high frequency signal between a circuit and a discrete electrical component
03/27/2003US20030061591 Interconnected series of plated through hole vias and method of fabrication therefor
03/27/2003US20030061590 System and method for printed circuit board conductor channeling
03/27/2003US20030061588 Managing one or more domains in a system over a network connection
03/27/2003US20030060531 Do not require solvent to provide a system having suitable viscosity for convenient handling; rapid cure; adhesively attaching a microelectronic device to a substrate; die-attach paste
03/27/2003US20030060172 Radio frequency module
03/27/2003US20030060062 Flexible Printed Circuit Board Having Conductor Lands Formed Thereon
03/27/2003US20030060000 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
03/27/2003US20030059964 Electric-circuit fabricating method and system, and electric-circuit fabricating program
03/27/2003US20030059961 Electric-circuit fabricating system and method, and electric-circuit fabricating program
03/27/2003US20030059723 Electronic device manufacture
03/27/2003US20030059541 Vacuum deposition; flexible printed circuits
03/27/2003US20030059367 Laminate for printed circuit boards
03/27/2003US20030059246 Media cartridge with printed circuit board for use in a printing system
03/27/2003US20030059151 Waveguide in a printed circuit board and method of forming the same
03/27/2003US20030058650 Light emitting diode with integrated heat dissipater
03/27/2003US20030058630 Multilayer circuit board and semiconductor device using the same
03/27/2003US20030058629 Wiring substrate for small electronic component and manufacturing method
03/27/2003US20030058628 Power module adapter
03/27/2003US20030058625 Identifiable flexible printed circuit board and method of fabricating the same
03/27/2003US20030058398 Display apparatus characterized by wiring structure
03/27/2003US20030058311 Inkjet cartridge and method of identifying color of ink thereof by flexible printed circuit board
03/27/2003US20030058230 Flat-panel type display apparatus
03/27/2003US20030058064 Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device
03/27/2003US20030057982 Detecting structure formed on a PCB to detect unavailability of the lines
03/27/2003US20030057974 Arrangement of vias in a substrate to support a ball grid array
03/27/2003US20030057885 Electronic equipment
03/27/2003US20030057779 Electronic module interconnect system
03/27/2003US20030057731 Door module with electrical wires and connectors
03/27/2003US20030057548 Integrated power delivery and cooling system for high power microprocessors
03/27/2003US20030057544 Substrate for receipt of packaged components face down or face up in such manner as to allow interconnection of packaged components using photolithographic techniques or direct laser writing so as to provide a monolithic integrated structure
03/27/2003US20030057515 Electronic interface structure comprising base, elastomeric island supported by base, patterned metallization overlying elastomeric island and including floating pad at least partially overlying elastomeric island
03/27/2003US20030057470 Circuit substrate
03/27/2003US20030057363 Optical power control system
03/27/2003US20030057275 Method and apparatus for display in a fuel dispenser
03/27/2003US20030057193 Method for forming a via hole, flexible wiring board using the method, and method for producing the flexible wiring board
03/27/2003US20030057181 Method of manufacturing a microstrip edge ground termination
03/27/2003US20030056981 Ceramic circuit board and method for manufacturing the same
03/27/2003US20030056978 Interlayer connection structure of multilayer wiring board, method of manufacturing flexible printed circuit board and method of forming land thereof
03/27/2003US20030056976 Fabricating method of semiconductor devices, fabricating method of printed wired boards, and printed wired board
03/27/2003US20030056975 Anti-tombstoning structures and methods of manufacture
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