Patents for H05K 1 - Printed circuits (98,583)
04/2003
04/08/2003US6544638 Electronic chip package
04/08/2003US6544048 Plug connector
04/08/2003US6543885 Ink jet charge plate with integrated flexible lead connector structure
04/08/2003US6543673 Dissolving shunt connection system for ESD sensitive components
04/08/2003US6543347 Apparatus for displacing an article during screening
04/08/2003US6543258 Glass fiber nonwoven fabric and printed wiring board
04/08/2003US6543098 Printed circuit board mounting facility
04/03/2003WO2003028419A1 Laminate for formation of capacitor layer and method for production thereof
04/03/2003WO2003028418A1 Thin film circuit board device and its manufacturing method
04/03/2003WO2003028415A1 Component arrangement
04/03/2003WO2003028414A1 Vented vias for via in pad technology assembly process yield improvements
04/03/2003WO2003028413A1 Coupon registration mechanism and method
04/03/2003WO2003028165A1 Wiring board having terminal
04/03/2003WO2003028147A1 Waveguide in a printed circuit board
04/03/2003WO2003028135A1 Fuel cell and electronic device using fuel cell
04/03/2003WO2003028119A2 Light emitting diode with integrated heat dissipater
04/03/2003WO2003028099A2 Arrangement of vias in a substrate to support a ball grid array
04/03/2003WO2003028085A2 Method for producing a ceramic substrate
04/03/2003WO2003028050A1 Capacitor, laminated capacitor, and capacitor built-in board
04/03/2003WO2003028044A2 Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured
04/03/2003WO2003027365A1 Multi-component fibers having reversible thermal properties and methods of manufacturing thereof
04/03/2003WO2003027167A1 Functionalized polyphenylene ether
04/03/2003WO2003026856A1 Production method of laminated ceramic electronic component and electronic apparatus
04/03/2003WO2003026788A1 Microcomponent
04/03/2003WO2002103426A9 Optical power control system
04/03/2003WO2002099850A3 Interchangeable microdeposition head apparatus and method
04/03/2003WO2002073953A3 Optical reader imaging module
04/03/2003WO2002039802A3 Methods of positioning components using liquid prime movers and related structures
04/03/2003US20030065367 Method and system of tape automated bonding
04/03/2003US20030064873 Comprising silver powder and a silver alloy powder, a boron powder, an inorganic binder and an organic vehicle
04/03/2003US20030064548 Panel stacking of BGA devices to form three-dimensional modules
04/03/2003US20030064546 Vented vias for via in pad technology yield improvements
04/03/2003US20030064315 N,N'-ditrifluoromethanesulphonyloxy-4,4'-(phenylene-1,3-dioxy) dinaphthalene-1,8:1',8'-tetracarboxylic imide increases the degree of polymerization; for passivation layer, buffer coating, or dielectric film in printed circuits
04/03/2003US20030064265 Membrane electrode assemblies for use in fuel cells
04/03/2003US20030064223 Uncured composite materials of a solid epoxy resin matrix composed of a crystalline epoxy resin and a solid curing agent
04/03/2003US20030064212 Printed circuit board or card having plated through-holes filled with a photocured polymer
04/03/2003US20030064210 Conductive paste and laminated ceramic electronic component
04/03/2003US20030064147 Wetting surface of circuit substrate with a solvent which is capable of dissolving resin solution; applying resin solution onto surface wetted with solvent; drying resin solution to thereby form resin cover layer
04/03/2003US20030063872 Flexible electrical interconnect for optical fibre transceivers
04/03/2003US20030063524 Drug delivery management system
04/03/2003US20030063477 Integrated light and accessory assembly
04/03/2003US20030063465 Providing layered metal substrate with an aluminum layer positioned between copper layers; removing defined area of copper layer to form reflective portion within area; providing a localized light source positioned to allow light to reflect
04/03/2003US20030063453 Multilayer wiring circuit board
04/03/2003US20030063452 Circuit substrate connecting structure, liquid crystal display device having the connecting structure and mounting method of liquid crystal display device
04/03/2003US20030063451 Expansion board apparatus and removing method
04/03/2003US20030063449 Structure of flexible printed circuit board
04/03/2003US20030063448 Electronic component package, printed circuit board, and method of inspecting the printed circuit board
04/03/2003US20030063447 Low inductance multiple resistor EC capacitor pad
04/03/2003US20030063443 Printed circuit board and manufacturing method thereof
04/03/2003US20030063427 Variable capacitor and a variable inductor
04/03/2003US20030063417 Capacitor damage arrestor
04/03/2003US20030063247 Heat sink attachment
04/03/2003US20030063225 Video-apparatus-tuner mounting board
04/03/2003US20030062966 Method, memory system and memory module board for avoiding local incoordination of impedance around memory chips on the memory system
04/03/2003US20030062965 Circuit board having ferrite containing layer
04/03/2003US20030062935 Switching circuit with improved signal blocking effect in off mode
04/03/2003US20030062629 Flip chip adaptor package for bare die
04/03/2003US20030062624 Component built-in module and method of manufacturing the same
04/03/2003US20030062616 Electrically conductive path through a dielectric material
04/03/2003US20030062413 Optical reader comprising multiple color illumination
04/03/2003US20030062399 Metal/ceramic bonding article and method for producing same
04/03/2003US20030062398 Method for manufacturing raised electrical contact pattern of controlled geometry
04/03/2003US20030062338 Manufacture and method for obtaining accurately dimensioned features from a metal-containing web processed with a continuous etch process
04/03/2003US20030062196 Anchor point for RF circuit boards and related methods
04/03/2003US20030062194 Flexible circuit with electrostatic damage limiting feature
04/03/2003US20030062192 Method and structure for identifying lead-free solder
04/03/2003US20030062150 Temperature/strain control of fatigue vulnerable devices used in electronic circuits
04/03/2003US20030062111 Method of manufacturing glass ceramic multilayer substrate
04/03/2003US20030061927 Stamping apparatus having replaceable dies
04/03/2003US20030061712 Method and device for folding of ribbon cables
04/03/2003US20030061711 Method for reducing multiline effects on a printed circuit board
04/03/2003US20030061709 Extension mechanism and method for assembling overhanging components
04/03/2003US20030061696 Electronic units and method for packaging and assembly of said electronic units
04/03/2003DE10152330C1 Rear-sided surface mounting method for flexible circuit board components uses pins of pin plate for supporting circuit board with rear side facing upwards
04/03/2003DE10138278C1 Elektronisches Bauteil mit aufeinander gestapelten elektronischen Bauelementen und Verfahren zur Herstellung derselben An electronic part having stacked electronic components and methods for making same
04/03/2003CA2462175A1 Light emitting diode with integrated heat dissipater
04/02/2003EP1298972A2 Multilayer wiring circuit board
04/02/2003EP1298970A2 Method for producing metal/ceramic bonding circuit board
04/02/2003EP1298969A1 Base member for mounting high-frequency components
04/02/2003EP1298968A2 Metal/ceramic circuit board
04/02/2003EP1298967A2 Electronic card
04/02/2003EP1298109A2 Metal/ceramic bonding article and method for producing same
04/02/2003EP1298108A2 Metal/ceramic bonding article
04/02/2003EP1298007A2 Integrated light and accessory assembly
04/02/2003EP1297965A2 Media cartridge with printed circuit board for use in a printing system
04/02/2003EP1297539A2 Insulation material for use in high-frequency electronic parts
04/02/2003EP1297431A2 Multiple channel modules and bus systems
04/02/2003EP1297383A1 A method for individualised marking of circuit boards
04/02/2003EP1296913A2 Photostructured paste
04/02/2003EP1198532A4 Dielectric material including particulate filler
04/02/2003EP1192199A4 Phenol-novolacs with improved optical properties
04/02/2003EP1149521B1 An electronic circuit board, an arrangement comprising an insulating material and an electronic circuit board
04/02/2003EP0951500B1 Microporous polytetrafluoroethylene (ptfe) bodies with filler
04/02/2003CN1408197A Method, facility and device for producing electrical connecting element, product and semi-finished products thereof
04/02/2003CN1408176A Small-sized image pickup module
04/02/2003CN1407845A Module element, core substrate assembly, multi-layer substrate and their manufacture
04/02/2003CN1407618A Integrated circuit modules and printing circuit board device
04/02/2003CN1407611A Laminated film and film carrying band for packaging electronic device
04/02/2003CN1407563A Card-like zero magnetic field generator and method thereof
04/02/2003CN1407561A Conductive paste composition, conductive paste and its preparation