Patents for H05K 1 - Printed circuits (98,583)
04/2003
04/10/2003WO2003030598A1 Polyimide film for flexible printed board and flexible printed board using the same
04/10/2003WO2003030308A1 Electrical connector
04/10/2003WO2003030280A1 Battery pack and thermostat used for it
04/10/2003WO2003030252A2 Process for producing interconnects
04/10/2003WO2003030248A2 Method of mounting an electronic device on a substrate by a laser beam
04/10/2003WO2003030247A2 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces
04/10/2003WO2003030186A2 Nickel coated copper as electrodes for embedded passive devices
04/10/2003WO2003029510A1 Aluminum alloy thin film and wiring circuit having the thin film and target material for forming the tin film
04/10/2003WO2003029509A1 Method for forming resin film and method for manufacturing electronic parts
04/10/2003WO2003029166A2 Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same
04/10/2003WO2002089338A3 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
04/10/2003US20030069384 Preparation of polyindanebisphenols and polymers derived therefrom
04/10/2003US20030069357 Aromatic oligomer, phenolic resin composition containing the same, and epoxy resin composition and cured product obtained therefrom
04/10/2003US20030069356 Comprising an organophosphorus compound, a trifunctional epoxy resin and a bifunctional epoxy resin; curing; semiconductor coatings; electronic and electrical apparatus prepregs
04/10/2003US20030069343 Melt-processible poly(tetrafluoroethylene)
04/10/2003US20030068920 High density, high frequency memory chip modules having thermal management structures
04/10/2003US20030068877 Circuit boards containing vias and methods for producing same
04/10/2003US20030068537 Metal/ceramic circuit board
04/10/2003US20030068532 Metal/ceramic bonding article
04/10/2003US20030068520 Laminate
04/10/2003US20030068517 Nickel coated copper as electrodes for embedded passive devices
04/10/2003US20030068511 Comprising one crystallizable thermoplastic resin with at least one pigment, and a hydrolysis stabilizer
04/10/2003US20030068504 Electronic device comprising a layer of flame retardant pressure sensitive adhesive mounted on surface, covering with a fireproofed conformal polysiloxane coatings
04/10/2003US20030068059 Microphone having a flexible printed circuit board for mounting components
04/10/2003US20030067775 Light-emitting unit, light-emitting unit combination, and lighting apparatus assembled from a plurality of light-emitting units
04/10/2003US20030067756 Electrical service distribution board
04/10/2003US20030067755 Electronic component with flexible contacting pads and method for producing the electronic component
04/10/2003US20030067730 Universial energy conditioning interposer with circuit architecture
04/10/2003US20030067720 Wireless suspension design to accommodate multiple drive designs
04/10/2003US20030067577 Liquid crystal display device
04/10/2003US20030067415 Conductive electrical element and antenna with ink additive technology
04/10/2003US20030067413 Recording/playback apparatus with electric wave transmission
04/10/2003US20030067313 Electronic device and coupler
04/10/2003US20030067084 Semiconductor device and manufacturing method thereof
04/10/2003US20030067082 Apparatus and methods for stacking integrated circuit devices with interconnected stacking structure
04/10/2003US20030067074 Circuit boards containing vias and methods for producing same
04/10/2003US20030067068 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component
04/10/2003US20030067060 Routing element for use in multichip modules, multichip modules including the routing element, and methods
04/10/2003US20030067056 Multilayer interconnect board and multilayer semiconductor device
04/10/2003US20030067048 Integrated circuit device
04/10/2003US20030066865 Method for producing metal/ceramic bonding circuit board
04/10/2003US20030066683 Circuit board and production of the same
04/10/2003US20030066682 Printed circuit board electrical interconnects
04/10/2003US20030066680 Terminal electrode of thin-film device with improved mounting strength, manufacturing method for the same, and thin-film magnetic head
04/10/2003US20030066679 Electrical circuit and method of formation
04/10/2003US20030066678 Heating, controlling temperature; flexible printed cables; fitting into pivot-rotation device
04/10/2003US20030066591 Production method for solid image pickup device
04/10/2003DE10031950C2 Glaskeramikzusammensetzung, Verfahren zur Herstellung eines Glaskeramiksinterkörpers und Verwendung eines solchen für ein Schaltungssubstrat Glass ceramic composition, method of producing a glass-ceramic sintered body, and use of such a circuit substrate
04/09/2003EP1301062A2 Semiconductor device, semiconductor package, electronic device, and method for establishing information processing environment
04/09/2003EP1301061A2 Flexible electrical interconnect for optical fibre transceivers
04/09/2003EP1300946A2 High frequency switch and radio communication apparatus
04/09/2003EP1300768A2 Apparatus and method for providing a network connection path
04/09/2003EP1300507A2 Fibre reinforced resin assembly
04/09/2003EP1300444A1 Epoxy resin composition and cured object obtained therefrom
04/09/2003EP1300377A2 Process for producing ceramic member for bonding, ceramic member for bonding, vacuum switch, and vacuum vessel
04/09/2003EP1300066A1 Method of producing plants, plant cultivating device, and light-emitting panel
04/09/2003EP1299907A1 Electronic device with heat conductive encasing device
04/09/2003EP1151646B1 Article having a circuit soldered with parts and method for recycling wastes of the same
04/09/2003EP1123157B1 Method for making integrated multilayered microfluidic devices
04/09/2003EP0912335B1 Conductive elastomers and methods for fabricating the same
04/09/2003EP0758840B1 Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit
04/09/2003EP0680082B1 Structure for mounting semiconductor device and liquid crystal display device
04/09/2003CN1409873A Power transistor module, power amplifier and method in fabrication thereof
04/09/2003CN1409591A Method and device for searching standard and method for detecting standard position
04/09/2003CN1409587A Method for forming holes, using flexible connection board formed thereof and its producing method
04/09/2003CN1409585A Structure of soft printed circuit board
04/09/2003CN1409584A method for producing flexible printed circuit and flexible printed circuit produced thereof
04/09/2003CN1409571A 高频开关和无线电通信装置 High-frequency switching and radio communication devices
04/09/2003CN1409445A Electric power connector
04/09/2003CN1409435A High frequency module
04/09/2003CN1409415A Light-emitting unit, light-emitting unit assembly and light-emitting device composed of multiple light-emitting units
04/09/2003CN1409343A Flexible circuit attached to metal frame of device
04/09/2003CN1409283A Mark for visual detection and electronic instrument
04/09/2003CN1105484C Method for producing embedded capactor in electronic circuit assembly and electronic circuit assembly
04/09/2003CN1105483C 半导体器件封装 The semiconductor device package
04/09/2003CN1105482C Method for preventing assembly-line delamination and sagging in circuit board manufacturing
04/08/2003US6546528 System and method for evaluation of electric characteristics of printed-circuit boards
04/08/2003US6545895 High capacity SDRAM memory module with stacked printed circuit boards
04/08/2003US6545890 Flanged terminal pins for dc/dc converters
04/08/2003US6545876 Technique for reducing the number of layers in a multilayer circuit board
04/08/2003US6545875 Multiple channel modules and bus systems using same
04/08/2003US6545873 System and method for extracting heat from a printed circuit board assembly
04/08/2003US6545868 Electronic module having canopy-type carriers
04/08/2003US6545855 Low inductance termination for electronic components
04/08/2003US6545737 Flat panel display device and manufacturing method thereof
04/08/2003US6545379 Motor provided with flexible circuit board
04/08/2003US6545364 Circuit device and method of manufacturing the same
04/08/2003US6545353 Multilayer wiring board and semiconductor device
04/08/2003US6545351 Underside heat slug for ball grid array packages
04/08/2003US6545345 Mounting for a package containing a chip
04/08/2003US6545229 Method for producing circuit board assemblies using surface mount components with finely spaced leads
04/08/2003US6545225 Module with thin-film circuit
04/08/2003US6545212 Radiation noise suppressing component attachment structure
04/08/2003US6545121 Polyimide film having denatured surface
04/08/2003US6544815 Panel stacking of BGA devices to form three-dimensional modules
04/08/2003US6544734 Multilayered microfluidic DNA analysis system and method
04/08/2003US6544664 Copper foil for printed wiring board
04/08/2003US6544663 Electrodeposited copper foil
04/08/2003US6544652 Cyanate ester-containing insulating composition, insulating film made therefrom and multilayer printed circuit board having the film
04/08/2003US6544651 High dielectric constant nano-structure polymer-ceramic composite