| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 04/17/2003 | WO2003032245A1 Chip card and method for producing a chip card of this type |
| 04/17/2003 | WO2003032088A1 Aqueous developable photoimageable thick film compositions for making photoimageable black electrodes |
| 04/17/2003 | WO2003032087A2 Aqueous developable photoimageable thick film compositions |
| 04/17/2003 | WO2003032084A2 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 04/17/2003 | WO2003031373A2 Thick film conductor compositions for use on aluminum nitride substrates |
| 04/17/2003 | WO2003031372A2 Method for the production of metal-ceramic composite materials, especially metal-ceramic substrates and ceramic composite material produced according to said method, especially a metal-ceramic substrate. |
| 04/17/2003 | WO2003031307A1 Retractable cable assemblies and devices including the same |
| 04/17/2003 | WO2003031101A1 Highly filled composites of powdered fillers and polymer matrix |
| 04/17/2003 | WO2001073868A3 Device enclosures and devices with integrated battery |
| 04/17/2003 | WO1999060829A3 Method and apparatus for making electrical traces, circuits and devices |
| 04/17/2003 | US20030074638 Design support apparatus for circuit including directional coupler, design support tool, method of designing circuit, and circuit board |
| 04/17/2003 | US20030074193 Data processing of a bitstream signal |
| 04/17/2003 | US20030073803 Flexibility, toughness, chemical and heat resistance; multilaye rprinted circuit |
| 04/17/2003 | US20030073781 Phosphorus-containing resin and flame retardant resin composition containing the same |
| 04/17/2003 | US20030073349 Structure of joining chip part to bus bars |
| 04/17/2003 | US20030073330 Device for retaining at least two electronic components disposed opposite each other on each side of a connection board |
| 04/17/2003 | US20030073328 Interconnection system |
| 04/17/2003 | US20030073326 Technique for identifying multiple circuit components |
| 04/17/2003 | US20030072954 Can be bonded to a metal film, particularly, a stainless steel film and a copper film, with a high strength and which can be easily etched |
| 04/17/2003 | US20030072929 Low signal loss bonding ply for multilayer circuit boards |
| 04/17/2003 | US20030072142 Wiring board with terminals and method for manufacturing the same |
| 04/17/2003 | US20030072140 Resistive element apparatus and method |
| 04/17/2003 | US20030072129 Double-sided copper clad laminate for capacitor layer formation and its manufacturing method |
| 04/17/2003 | US20030071350 High-frequency semiconductor device |
| 04/17/2003 | US20030071349 Electronic circuit unit suitable for miniaturization |
| 04/17/2003 | US20030071346 Flexible lead structures and methods of making same |
| 04/17/2003 | US20030071245 Self-supporting, curable insulative binder with an initial non-solid state and a cured solid state with conductive particles impregnated in the non-solid state |
| 04/17/2003 | US20030071112 Solder bump fabrication method and apparatus |
| 04/17/2003 | US20030071013 Printed circuit board micro hole processing method |
| 04/17/2003 | US20030071012 Method of manufacturing a micro-electromechanical fluid ejecting device |
| 04/17/2003 | US20030070839 Interconnect structure and method of making same |
| 04/17/2003 | US20030070838 Multilayer printed wiring board and its manufacturing method |
| 04/17/2003 | US20030070837 Wiring connection structure and transmitter using the same |
| 04/17/2003 | US20030070834 Integrated lead suspension and method of construction |
| 04/17/2003 | US20030070833 Extensible spiral for flex circuit |
| 04/17/2003 | US20030070483 Multiaxial inertial sensor system and method of producing same |
| 04/17/2003 | US20030070292 Circuit board, method for manufacturing same, and high-output module |
| 04/17/2003 | US20030070287 Method of attaching printed circuit boards within an electronic module housing |
| 04/17/2003 | CA2391492A1 Circuit board, method for manufacturing same, and high-output module |
| 04/16/2003 | EP1303171A2 Electronic circuit unit suitable for miniaturization |
| 04/16/2003 | EP1303164A2 Microphone having a flexible printed circuit board for mounting components |
| 04/16/2003 | EP1303006A2 Circuit board-to-board interconnection device |
| 04/16/2003 | EP1302895A2 Conductive electrical element and antenna with ink additive technology |
| 04/16/2003 | EP1302894A2 Contactless chipcard and manufacturing process |
| 04/16/2003 | EP1302496A1 Insulating resin composition, adhesive resin composition and adhesive sheeting |
| 04/16/2003 | EP1302094A1 Method for producing an electrical and/or mechanical connection between flexible thin-film substrates |
| 04/16/2003 | EP1301302A1 Paste filled with metal powder and metal products obtained with same |
| 04/16/2003 | EP0784384B1 Antenna switch |
| 04/16/2003 | CN2545721Y Electric connector with overvoltage suppressing device |
| 04/16/2003 | CN1411593A Display and backlighting assembly |
| 04/16/2003 | CN1411330A Printed wiring substrate structure and mfg. method thereof |
| 04/16/2003 | CN1411329A Circuit substrate connecting structure, liquid crystal display with same and mounting method |
| 04/16/2003 | CN1411328A Flexible printed circuit board and mfg. method thereof |
| 04/16/2003 | CN1411327A Flexible printed circuid board |
| 04/16/2003 | CN1411059A Method for preventing impedance of storage chip circumference from mismatching, storage system and model |
| 04/16/2003 | CN1411055A Wiring substrate for small electronic unit and mfg. method thereof |
| 04/16/2003 | CN1411010A Method for mfg. laminated ceramic electronic device, assembly electronic device and laminated ceramic electronic device |
| 04/16/2003 | CN1410792A Solid image testing device |
| 04/16/2003 | CN1410471A Preparation method of polyether imide flexible printed circuit substrate material |
| 04/16/2003 | CN1106137C Shield element and production of same |
| 04/16/2003 | CN1106136C 电子电路结构 Electronic circuit structure |
| 04/16/2003 | CN1106023C Interfering signal-removing assembly fitted with feedthrough thin-film capacitor |
| 04/16/2003 | CN1105643C Heat stable aluminium hydroxide, method for making laminates for printed circuit boards and laminates |
| 04/15/2003 | US6550037 Method for designing a decoupling circuit |
| 04/15/2003 | US6549420 Method and apparatus for increasing memory capacity |
| 04/15/2003 | US6549419 Electronic substrate and method for manufacturing electronic equipment using the same |
| 04/15/2003 | US6549409 Power converter assembly |
| 04/15/2003 | US6549179 LED display assembly |
| 04/15/2003 | US6549132 Deactivatable electronic article surveillance tag and method for making same |
| 04/15/2003 | US6549114 Protection of electrical devices with voltage variable materials |
| 04/15/2003 | US6549090 Inverted coplanar waveguide coupler with integral microstrip connection ports |
| 04/15/2003 | US6549031 Point to point alternating current (AC) impedance compensation for impedance mismatch |
| 04/15/2003 | US6549025 System and method for thermal testing of circuit boards using thermal films |
| 04/15/2003 | US6548972 Control unit and method of manufacturing the same |
| 04/15/2003 | US6548898 External connection terminal and semiconductor device |
| 04/15/2003 | US6548858 Multi-layer circuit board |
| 04/15/2003 | US6548832 Hybrid integrated circuit device |
| 04/15/2003 | US6548827 Electroconductivity; positioning; accuracy |
| 04/15/2003 | US6548767 Multi-layer printed circuit board having via holes formed from both sides thereof |
| 04/15/2003 | US6548766 Printed wiring board for attachment to a socket connector, having recesses and conductive tabs |
| 04/15/2003 | US6548765 Mounting structure of electronic component on substrate board |
| 04/15/2003 | US6548758 Electronic component and manufacturing method thereof |
| 04/15/2003 | US6548627 Flame-retardant phosphorus-modified epoxy resins |
| 04/15/2003 | US6548612 Melt-processible poly(tetrafluoroethylene) |
| 04/15/2003 | US6548328 Circuit device and manufacturing method of circuit device |
| 04/15/2003 | US6548179 Reacting Pyromellitic dianhydride, phenylenediamine, methylenedianiline and 3, 4'-oxydianiline; block or inter-penetrating polymer network Copolymer; flexible printed circuits or tape-automated bonding tape; high elastic modulus |
| 04/15/2003 | US6548159 Epoxy/clay nanocomposite for making printed circuit boards |
| 04/15/2003 | US6548152 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
| 04/15/2003 | US6547879 Electrode forming apparatus for electric parts |
| 04/15/2003 | US6547597 Apparatus and method for incorporating surface mount components into connectors |
| 04/15/2003 | US6547591 Connector holding structure for securely mounting print-board connector in casing |
| 04/15/2003 | US6547572 Integrated and flexible power distribution assembly |
| 04/15/2003 | US6547410 LED alley/take-down light |
| 04/15/2003 | US6546622 Printed-wiring substrate and method for fabricating the same |
| 04/15/2003 | CA2228152C Conductive device |
| 04/10/2003 | WO2003030607A1 Electrical circuit arrangement comprised of a number of electrically interconnected circuit components |
| 04/10/2003 | WO2003030602A1 Multi-layered circuit wiring plate, ic package, and production method of multi-layered circuit wiring plate |
| 04/10/2003 | WO2003030601A1 Electronic circuit comprising conductive bridges and method for making such bridges |
| 04/10/2003 | WO2003030600A1 Printed wiring board and production method for printed wiring board |
| 04/10/2003 | WO2003030599A1 Copper foil with carrier and printed board comprising this copper foil |