| Patents for H05K 1 - Printed circuits (98,583) |
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| 07/01/2003 | US6586687 Printed wiring board with high density inner layer structure |
| 07/01/2003 | US6586684 Circuit housing clamp and method of manufacture therefor |
| 07/01/2003 | US6586682 Printed wiring board with controlled line impedance |
| 07/01/2003 | US6586681 Flat flexible cable and its connection and contacting |
| 07/01/2003 | US6586533 Method of manufacture of polybutadiene and polyisoprene based thermosetting compositions |
| 07/01/2003 | US6586513 Aqueous dispersion for electrodeposition comprising selected inorganic particles having specified mean particle size and dielectric constant, and organic particles comprised of polyimide-based resin having charge on surface |
| 07/01/2003 | US6586352 Method for reducing coefficient of thermal expansion in chip attach packages |
| 07/01/2003 | US6586275 Wafer level package and method for manufacturing the same |
| 07/01/2003 | US6586274 Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument |
| 07/01/2003 | US6586081 Polyimide film contains titanium element and flexible print wiring boards with the use of the same are disclosed. The polyimide/metal laminates are excellent in adhesion under the ordinary conditions and, high strength |
| 07/01/2003 | US6585904 Method for the manufacture of printed circuit boards with plated resistors |
| 07/01/2003 | US6585902 Non-homogeneous laminate material for suspension with vibration dampening |
| 07/01/2003 | US6585836 Flat cable and a manufacturing method thereof |
| 07/01/2003 | US6585538 Continuous conductor connector system for printed circuit boards |
| 07/01/2003 | US6585525 Memory modules having conductors at edges thereof and configured to conduct signals to or from the memory modules via the respective edges |
| 07/01/2003 | US6585149 Packaging method using lead-free solder |
| 07/01/2003 | US6584905 Plated through-hole ignitor for detonation cord or shock tube |
| 07/01/2003 | US6584685 System and method for package socket with embedded power and ground planes |
| 07/01/2003 | US6584681 Using electricoconductive, flexible adhesive to join semi-conductor chips to track planes of substrates |
| 06/26/2003 | WO2003053121A2 Method and apparatus for the reduction of electromagnetic radiation from display screens |
| 06/26/2003 | WO2003053117A1 Layered circuit boards and methods of production thereof |
| 06/26/2003 | WO2003053113A1 Feedthrough interconnection assembly |
| 06/26/2003 | WO2003053101A1 Flexible electric circuit for heating comprising a metallised fabric |
| 06/26/2003 | WO2003052876A2 Method and apparatus for connecting circuit boards for a sensor assembly |
| 06/26/2003 | WO2003052875A1 Assembly and connecting technique in textile structures |
| 06/26/2003 | WO2003052822A2 Method for making a non-detachable microcircuit card |
| 06/26/2003 | WO2003052809A1 Method for production of dielectric layers using polyfunctional carbosilanes |
| 06/26/2003 | WO2003052436A2 Flexible interface for a test head |
| 06/26/2003 | WO2003051964A1 Prepreg production method and prepreg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method |
| 06/26/2003 | WO2003051628A1 Composite resin molding and process for producing the same |
| 06/26/2003 | WO2003051626A1 Multi-layeres with vias in filled holes |
| 06/26/2003 | WO2003051562A1 Metal oxide dispersion |
| 06/26/2003 | WO2003024711A3 Method for producing a ceramic substrate and ceramic substrate |
| 06/26/2003 | US20030120021 Crosslinking agents |
| 06/26/2003 | US20030119372 Bi-directional balance low noise communication interface |
| 06/26/2003 | US20030119370 Solder mask configuration for a printed circuit board of a modular jack |
| 06/26/2003 | US20030119361 Coaxial dual pin sockets for high speed I/O applications |
| 06/26/2003 | US20030119340 Clip-type lead frame for electrically connecting two substrates or devices |
| 06/26/2003 | US20030118884 Method for fabricating membrane eletrode assemblies |
| 06/26/2003 | US20030118842 Sintered compact; low dielectric; high thermal expansion |
| 06/26/2003 | US20030118836 Fluoropolymer laminates and a process for manufacture thereof |
| 06/26/2003 | US20030118797 Structure for multi-layer conductive via and circuit and method for making same |
| 06/26/2003 | US20030118743 Nanostructured and nanoporous film compositions, structures, and methods for making the same |
| 06/26/2003 | US20030118738 Sustains surface flattening method by employing participation of porous materials such as zeolites, zeolite like, mesoporous and mesoporous composites; planarized substrate comprises ceramic substrate, buffer layer, nanostructure layer |
| 06/26/2003 | US20030118481 Sintered textured channel; heat conductive detector |
| 06/26/2003 | US20030117787 Method and apparatus for EMI shielding |
| 06/26/2003 | US20030117784 Circuit board device and mounting method therefor |
| 06/26/2003 | US20030117780 Apparatus having contacts made from carbon tracks and method of producing them |
| 06/26/2003 | US20030117543 Structure of a display device |
| 06/26/2003 | US20030117477 Image forming apparatus |
| 06/26/2003 | US20030117183 Methods, apparatus, and systems for reducing interference on nearby conductors |
| 06/26/2003 | US20030116868 Method and apparatus for encoding information in an ic package |
| 06/26/2003 | US20030116863 Bonding strength between semiconductor chip and support; microstructure circuits |
| 06/26/2003 | US20030116857 Circuit substrate and method for fabricating the same |
| 06/26/2003 | US20030116856 Resistive vias for controlling impedance and terminating I/O signals at the package level |
| 06/26/2003 | US20030116843 Semiconductor device package and method of production and semiconductor device of same |
| 06/26/2003 | US20030116835 Memory-module and a method of manufacturing the same |
| 06/26/2003 | US20030116831 Impedance compensation for curcuit board breakout region |
| 06/26/2003 | US20030116776 Substrate stack |
| 06/26/2003 | US20030116428 Apparatus for cleaning residual material from an article |
| 06/26/2003 | US20030116350 Flexible wiring boards and manufacturing processes thereof |
| 06/26/2003 | US20030116348 Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same |
| 06/26/2003 | US20030116343 Flexible printed wiring board |
| 06/26/2003 | US20030116173 Electrolysis cleaning using aqueous solution of tetramethylammonium hydroxide |
| 06/26/2003 | US20030115752 Method of making an interposer with contact structures |
| 06/26/2003 | DE20304000U1 Electrical lighting panel has light emitting diode matrix in thin structure |
| 06/26/2003 | DE10018931C2 Schaltkreisverbindungsanordnung für einen Kabelstrang in einem Fahrzeug Circuit connection structure for a wire harness in a vehicle |
| 06/25/2003 | EP1322001A1 Connector, electronic equipment and control method for electronic equipment |
| 06/25/2003 | EP1321998A1 Waveguide-microstrip transition and application to HF circuit |
| 06/25/2003 | EP1321980A1 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 06/25/2003 | EP1321483A1 3,4-alkylenedioxythiophene compounds and polymers thereof |
| 06/25/2003 | EP1320863A1 Lamp base comprising an electronic component and a method for producing a lamp base |
| 06/25/2003 | EP1165870B1 Woven fabric reinforcement to optimize dimensional stability of laminated composite structures, including products for electrical and electronic applications |
| 06/25/2003 | CN2558188Y Combination device for printed circuit base board with printed circuit board |
| 06/25/2003 | CN1426271A Circuit board device and its mounting method |
| 06/25/2003 | CN1426103A Chip support capable of setting passive element |
| 06/25/2003 | CN1112839C Three dimensional composite circuit board |
| 06/25/2003 | CN1112838C Ceramic base with composite wiring structure and its method of manufacture |
| 06/25/2003 | CN1112746C Electrical coupler for detachable interconnection between main unit and external unit |
| 06/25/2003 | CN1112703C Static memory device having compatibility with disk drive in electronic apparatus |
| 06/25/2003 | CN1112395C Laminated material, resin paint and resin composition for printed circuit board and laminated board for printed circuit board made thereby |
| 06/24/2003 | US6584152 Computer system and process for capture, editing and playback of motion video compressed using interframe and intraframe techniques |
| 06/24/2003 | US6583990 Flexible circuit board and connect structure thereof |
| 06/24/2003 | US6583981 Ceramic condenser module |
| 06/24/2003 | US6583904 Method and apparatus for aligning optical interconnections between printed circuit boards |
| 06/24/2003 | US6583843 LCD module |
| 06/24/2003 | US6583703 Electrical apparatus having an electromagnetic device operable at multiple inductance values |
| 06/24/2003 | US6583677 Oscillator and an oscillator characteristic adjustment method |
| 06/24/2003 | US6583612 Static event detection/protection device |
| 06/24/2003 | US6583517 Method and structure for joining two substrates with a low melt solder joint |
| 06/24/2003 | US6583513 Integrated circuit package with an IC chip and pads that dissipate heat away from the chip |
| 06/24/2003 | US6583503 Semiconductor package with stacked substrates and multiple semiconductor dice |
| 06/24/2003 | US6583498 Integrated circuit packaging with tapered striplines of constant impedance |
| 06/24/2003 | US6583402 Semiconductor parts and semiconductor mounting apparatus |
| 06/24/2003 | US6583380 Device and method for marking copper-clad laminates |
| 06/24/2003 | US6583365 Conductive pads layout for BGA packaging structure |
| 06/24/2003 | US6583364 Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
| 06/24/2003 | US6583224 Vinyl-terminated polybutadiene and butadiene-styrene copolymers containing urethane and/or ester residues, and the electrical laminates obtained therefrom |
| 06/24/2003 | US6583201 Polymeric resin, a conductive filler, a curing agent, an optional (reactive) diluent, and as corrosion inhibitor, one of 6-hydroxyquinoline, 2-hydroxyquinoline or piperidene to improve contact resistance in harsh conditions |
| 06/24/2003 | US6583073 Drying process for woven glass fabric intended for use as a reinforcing laminate in printed circuit boards |