Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
05/2003
05/30/2003CA2467716A1 Manufacture having double sided features in a metal-containing web formed by etching
05/29/2003US20030100653 Resistive nanocomposite compositions
05/29/2003US20030100287 Radiocommunication module in the form of an electronic macro-component , corresponding interface structure and transfer method onto a motherboard
05/29/2003US20030100212 Method and structure for tape ball grid array package
05/29/2003US20030100203 Low height USB interface connecting device and a memory storage apparatus thereof
05/29/2003US20030100200 Buried solder bumps for AC-coupled microelectronic interconnects
05/29/2003US20030100198 A connector for electrically coupling one or more devices in a processor- based system
05/29/2003US20030100197 Edge-plated well for circuit board components
05/29/2003US20030100146 Method of fabricating multilayer ceramic substrate
05/29/2003US20030099839 Free of halogen and diantimony trioxide; useful as an encapsulating material in the semiconductor industry
05/29/2003US20030099836 Thermal management device and method of making such a device
05/29/2003US20030099768 Method for selectively applying solder mask
05/29/2003US20030099190 Signal line routing to reduce crosstalk effects
05/29/2003US20030099099 Printed wiring board having connecting terminals for electrically connecting conductor layers, circuit module having printed wiring board, and manufacturing method for printed wiring board
05/29/2003US20030099093 Signal distribution to a plurality of circuit units
05/29/2003US20030098750 Oscillator module and electronic apparatus using the same
05/29/2003US20030098505 Semiconductor module
05/29/2003US20030098504 Semiconductor memory module having double-sided stacked memory chip layout
05/29/2003US20030098500 180 degree bump placement layout for an integrated circuit power grid
05/29/2003US20030098472 High-frequency module
05/29/2003US20030098179 Multi-layer wiring board and method of producing same
05/29/2003US20030098178 Printed circuit board having test points formed on sides thereof
05/29/2003US20030098177 Multi-layer circuit board
05/29/2003US20030097750 Manufacturing method of electronic circuit including multilayer circuit board
05/28/2003EP1315407A2 Dielectric structure
05/28/2003EP1315305A1 multiband high-frequency switching module
05/28/2003EP1315243A2 Connecting device for electronic component
05/28/2003EP1315231A2 Dielectric ceramic composition and laminated ceramic parts using the same
05/28/2003EP1315207A2 Semiconductor module
05/28/2003EP1315205A1 Power module and power module with heat sink
05/28/2003EP1315185A1 Flat capacitor and circuit board embedding it
05/28/2003EP1314760A1 Resin composition, molded object thereof, and use thereof
05/28/2003EP1314342A1 Method, apparatus and use of applying viscous medium on a substrate
05/28/2003EP1314341A1 Collective method for flush filling of through holes in a substrate
05/28/2003EP1314200A2 Hybrid substrate with embedded capacitors and methods of manufacture
05/28/2003EP1314172A1 Method for producing a large-mass ohmic resistor for protecting electronic assemblies from surges, and an electronic assembly
05/28/2003EP1313900A2 Polymer-wrapped single wall carbon nanotubes
05/28/2003EP1313795A2 Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
05/28/2003EP1313679A1 Dielectric ceramic material that contains silver, niobium and tantalate
05/28/2003EP1269505A4 Inverted board mounted electromechanical device
05/28/2003DE20300626U1 Chip card for Light Emitting Diode has heat bridges between top mounting surface and cooling baseplate and has central mounting for Light Emitting Diode
05/28/2003CN1420905A Impregnated glass fiber strands and products including same
05/28/2003CN1420904A Composite of powdered fillers and polymer matrix and process for preparing them
05/28/2003CN1420715A Insulation sheet, multilayer wiring base board and mfg. method thereof
05/28/2003CN1420714A Thin circuit board and method for mfg. same
05/28/2003CN1420675A Rotatable hinge mechanism with flexible printed circuit casing
05/28/2003CN1420643A Radio Communication apparatus comprising heat dissipation system
05/28/2003CN1420637A Passive device and module of transceiver
05/28/2003CN1420589A Press fit bus for distribution
05/28/2003CN1420537A Method and device for mfg. parts after installation of electronic element
05/28/2003CN1420021A Dielectric cylinder with printed circuit board using in printing system
05/28/2003CN1110231C Method for producing circuit substrate
05/28/2003CN1110088C Improved PTFE thin film chip carrier
05/28/2003CN1110079C Electronic part device
05/28/2003CN1110078C Method for mounting semiconductor element
05/28/2003CN1110063C Substrate with solder alloy for assembling electronic component
05/28/2003CN1109702C Epoxy resin compn. for printed wiring board and laminated board produced with use of same
05/27/2003US6571007 Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging method
05/27/2003US6570776 Shielded electronics package structure with enhanced mechanical reliability
05/27/2003US6570775 Circuit board assembly having a compact structure
05/27/2003US6570774 Capacitor module for use in inverter, inverter, and capacitor module
05/27/2003US6570773 Control apparatus for an automobile
05/27/2003US6570771 Single-piece molded module housing
05/27/2003US6570765 Over-voltage protection for electronic circuits
05/27/2003US6570561 Portable computer with low voltage differential signaling adapter
05/27/2003US6570484 Mounting structure for thermistor with positive resistance-to-temperature characteristic
05/27/2003US6570469 Multilayer ceramic device including two ceramic layers with multilayer circuit patterns that can support semiconductor and saw chips
05/27/2003US6570442 Radio frequency signal output module having radio-frequency power amplifier and isolator element
05/27/2003US6570332 Electrode-to-ballast interconnect of flat integral type compact fluorescent lamp
05/27/2003US6570280 Solder-bonding structure and brushless motor having the same
05/27/2003US6570271 Apparatus for routing signals
05/27/2003US6570263 All the plated wires utilizing the coverage of the solder mask can be entirely cut without the pulling problem from the cutter.
05/27/2003US6570262 Mother substrate and electronic component utilizing the mother substrate
05/27/2003US6570102 Structure for high speed printed wiring boards with multiple differential impedance-controlled layer
05/27/2003US6570100 Pad structure of semiconductor package
05/27/2003US6570099 Thermal conductive substrate and the method for manufacturing the same
05/27/2003US6569984 Method for making polyimide
05/27/2003US6569982 Reacting polyphenylene ether resin respresented by strong base, and containing strong base, and compound containing leaving group and vinyl group to obtain a curable polyphenylene vinyl group to obtain curable polyphenylene
05/27/2003US6569943 Vinyl-terminated polybutadiene and butadiene-styrene copolymers containing urethane and/or ester residues, and the electrical laminates obtained therefrom
05/27/2003US6569712 Structure of a ball-grid array package substrate and processes for producing thereof
05/27/2003US6569514 Ceramic circuit board and method of manufacturing the same
05/27/2003US6569513 Prepreg and process for manufacturing same
05/27/2003US6569367 Method for manufacturing electronic component
05/27/2003US6569278 Powder metal polymer organic sheet punching for substrate conductors
05/27/2003US6569248 Apparatus for selectively applying solder mask
05/27/2003US6568960 Dual circuit card connector
05/27/2003US6568947 Apparatus for routing a flexible circuit
05/27/2003US6568944 Circuit board with increased edge connection capacity
05/27/2003US6568600 Chip card equipped with a loop antenna, and associated micromodule
05/22/2003WO2003043393A1 Circuit board and its manufacturing method
05/22/2003WO2003043392A1 Method and assembly for producing a printed circuit board
05/22/2003WO2003043391A1 Multilayer flexible fr4 circuit
05/22/2003WO2003043085A2 Electronic device carrier adapted for transmitting high frequency signals
05/22/2003WO2003043035A1 Method of producing a multilayer microelectronic substrate
05/22/2003WO2003042291A1 Halogen-free phosphorous- and nitrogen-containing flame-resistant epoxy resin compositions, and prepregs derived from thereof
05/22/2003WO2003019651A3 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
05/22/2003WO2002103426A3 Optical power control system
05/22/2003WO2002054839A3 Layered circuit boards and methods of production thereof
05/22/2003US20030096585 Radiocommunications device including a heat dissipation system
05/22/2003US20030096520 Press-fit bus bar distributing power
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