Patents for H05K 1 - Printed circuits (98,583)
05/2003
05/08/2003WO2003037687A1 Integrated and flexible power distribution assembly
05/08/2003WO2003037664A2 Motor fan system which is intended, in particular, for a motor vehicle heating and/or air-conditioning system
05/08/2003WO2003037620A1 Polyimide-metal layered products and polyamideimide-metal layered product
05/08/2003US20030088802 Method and apparatus for reducing signal timing skew on a printed circuit board
05/08/2003US20030087999 Thermosetting resin compositions containing maleimide and/or vinyl compounds
05/08/2003US20030087538 Wiring board with built-in electronic component and method for producing the same
05/08/2003US20030087498 Via components for integrated passive components
05/08/2003US20030087483 Semiconductor device and method for manufacturing substrate of the same
05/08/2003US20030087470 Electronic module and method for its production
05/08/2003US20030087170 Fine particle sizes; silver particles overcoated with surfactant in binder
05/08/2003US20030087136 Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same
05/08/2003US20030087101 Resin-coated copper foil, and printed wiring board using resin-coated copper foil
05/08/2003US20030087077 Sheet material especially useful for circuit boards
05/08/2003US20030086600 Multi-layer printed circuit board fabrication system and method
05/08/2003US20030086248 Interposer for semiconductor, method for manufacturing same, and semiconductor device using same
05/08/2003US20030086244 Flexible cable stiffener for an optical transceiver
05/08/2003US20030086232 Fuse housing
05/08/2003US20030086214 Hard disk drive comprising flexible printed circuit with damping material
05/08/2003US20030086213 Hard disk drive comprising a flexible printed circuit with a hole
05/08/2003US20030086049 Liquid crystal display device
05/08/2003US20030086047 Method for cutting tape carrier packages of a LCD and LCD structure
05/08/2003US20030085836 Radio frequency module, communication device, and radar device
05/08/2003US20030085774 High frequency switch and radio communication apparatus
05/08/2003US20030085471 Semiconductor package and method of production thereof
05/08/2003US20030085454 Chip card and production process
05/08/2003US20030085452 Packaging architecture for a multiple array transceiver using a continuous flexible circuit
05/08/2003US20030085451 Wet etched insulator and electronic circuit component
05/08/2003US20030085403 Layered wiring line of silver or silver alloy and method for forming the same and display panel substrate using the same
05/08/2003US20030085384 Heat curable thermosetting luminescent resins
05/08/2003US20030085383 For use as gel coat, laminating resin, casting resin or moldable resin; photoluminescent, thermoluminescent and electroluminescent properties
05/08/2003US20030085058 Wherein electroconductive paste fills in via holes, formed by heat pressing; dielectrics; integrated circuits; semiconductors
05/08/2003US20030085057 Method for forming a line pattern, line pattern, and electro-optic device
05/08/2003US20030085055 Substrate design and process for reducing electromagnetic emission
05/08/2003US20030085054 Enhanced flex cable
05/08/2003US20030084938 Level control system for sheet casting process
05/08/2003US20030084796 Method for forming pattern using printing process
05/08/2003CA2465124A1 Ink-jet inks containing metal nanoparticles
05/08/2003CA2433488A1 Ball grid array with x-ray alignment mark
05/07/2003EP1309042A2 Contact spring for a component to a print board
05/07/2003EP1308978A2 Fuse casing
05/07/2003EP1308933A2 Hard disk drive comprising flexible printed circuit with damping material
05/07/2003EP1308697A2 Position sensor
05/07/2003EP1308072A1 Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors
05/07/2003EP1308071A2 Low inductance transistor module with distributed bus
05/07/2003EP1307788A1 Drug delivery management system
05/07/2003EP1278806A4 Adhesive bonding laminates
05/07/2003EP1010037B1 Applications for encapsulated electrophoretic displays
05/07/2003EP0629217B1 Rigid-rod polymers
05/07/2003CN2549687Y PCB power supply layer with smooth boundary of power area
05/07/2003CN1416595A Wiring beard, semiconductor device, and method of mfg. wiring board
05/07/2003CN1416588A Circuit assembly for inclusion within fluorescent lamp
05/07/2003CN1416310A Method for quick resistance trimming by using laser on printed circuit board directly
05/07/2003CN1416309A Panel display and printed circuit board
05/07/2003CN1416195A Bayonet connector,its mfg. method, electronic insertion sheet and electronic appliance
05/07/2003CN1415642A P or si modified flame vesistant ether resin
05/07/2003CN1415474A Method for manufacturing copper foil in transfer printing back glue type with carrier
05/07/2003CN1415473A Method for manufacturing copper foil in transfer printing type with carrier
05/07/2003CN1108088C Coating for structured prodn. of conductors on surface of electrically insulating substrates
05/07/2003CN1107959C Fitting structure of thermo-sensitive resistance with positive resistance temp characters
05/06/2003US6560121 Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method
05/06/2003US6560108 Chip scale packaging on CTE matched printed wiring boards
05/06/2003US6559803 Portable communication terminal with reduced specific absorption rate
05/06/2003US6559777 Dual mode light source for aircraft external lighting
05/06/2003US6559733 Reducing effects of electrical impedance
05/06/2003US6559729 Oscillator, method for producing oscillator, and communication apparatus incorporating same
05/06/2003US6559728 Miniature ovenized crystal oscillator
05/06/2003US6559541 Connection structure for semiconductor electrode terminals
05/06/2003US6559522 Tape carrier package and an LCD module using the same
05/06/2003US6559521 Chip carrier with magnetic shielding
05/06/2003US6559390 Solder connect assembly and method of connecting a semiconductor package and a printed wiring board
05/06/2003US6559389 High-density cable and method therefor
05/06/2003US6559388 Strain relief for substrates having a low coefficient of thermal expansion
05/06/2003US6559377 Grounded flexible printed circuitry with improved impedance characteristics
05/06/2003US6559063 Method for manufacturing semiconductor wafer having resist mask with measurement marks for measuring the accuracy of overlay of a photomask
05/06/2003US6558874 For forming an electrode arrangement for a plasma display panel device
05/06/2003US6558783 Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom, and laminated structure
05/06/2003US6558780 Circuit board and method for manufacturing the same
05/06/2003US6558746 Coating composition for producing electrically conductive coatings
05/06/2003US6558738 Circuit forming method
05/06/2003US6558578 Conductive paste for the electrical industry and its use
05/06/2003US6558576 Luminescent electroconductive adhesive
05/06/2003US6558512 Base material for laminate and process for producing the same
05/06/2003US6558181 System and method for package socket with embedded power and ground planes
05/06/2003US6558169 Shunt power connection for an integrated circuit package
05/06/2003US6558168 Probe card
05/06/2003US6558046 Optical wavelength division multiplexer and/or demultiplexer with mechanical strain relief
05/06/2003US6557925 Vehicle inner circuit panel, vehicle panel assembly and vehicle panel assembly wiring construction
05/06/2003US6557767 Antenna frame for IC card and process for manufacturing the same or IC card using the same
05/06/2003US6557250 Multilayer board compound and method for the manufacture thereof
05/05/2003CA2409447A1 Fuse housing
05/02/2003WO2002035672A2 Securing electrical conductors
05/02/2003EP1307080A2 Electronic module and method for its production
05/02/2003EP1307079A1 Marking apparatus used in a process for producing multi-layered printed circuit board
05/02/2003EP1307078A2 High frequency circuit module
05/02/2003EP1307075A2 Prepreg and circuit board and method for manufacturing the same
05/02/2003EP1306953A1 Leadthrough arrangement
05/02/2003EP1306902A1 High-frequency module and its manufacturing method
05/02/2003EP1306900A2 Chip-scale packages stacked on folded interconnector for vertical assembly on substrates
05/02/2003EP1306400A1 Flame retardant epoxy resin modified with phosphorus and silicon
05/02/2003EP1305989A2 Circuit board protection method and apparatus