Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
05/2003
05/22/2003US20030096519 Microspring with conductive coating deposited on tip after release
05/22/2003US20030096517 Electrical connector
05/22/2003US20030096514 Pin grid array integrated circuit connecting device
05/22/2003US20030096513 Pin-grid-array electrical connector
05/22/2003US20030096512 Electrical interconnect device incorporating anisotropically conductive elastomer and flexible circuit
05/22/2003US20030096493 Perimeter anchored thick film pad
05/22/2003US20030096123 Poly (arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
05/22/2003US20030096113 Electrophoretic displays using nanoparticles
05/22/2003US20030096089 Substrate for accommodating passive component
05/22/2003US20030096085 Greensheet carriers and processing thereof
05/22/2003US20030096082 Copper alloy foil
05/22/2003US20030096081 Integrated microfluidic, optical and electronic devices and method for manufacturing
05/22/2003US20030095391 Electronic component assembly, and intermediate connector and unit body for the same
05/22/2003US20030095390 Rotatable hinge mechanism with enclosure for housing flexible printed circuit
05/22/2003US20030095389 Multilayered board comprising folded flexible circuits and method of manufacture
05/22/2003US20030095388 Using a multiple cure system adhesive, such as a B-stage epoxy.
05/22/2003US20030095227 Method of mounting flexible circuit boards, and display device
05/22/2003US20030095019 Tabless surface mount coaxial dielectric resonator
05/22/2003US20030094955 Device for transmitting electric current between two components, which twist in relation to one another, of a steering device for motor vehicles
05/22/2003US20030094707 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly
05/22/2003US20030094706 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly
05/22/2003US20030094704 Method of fabricating known good dies from packaged integrated circuits
05/22/2003US20030094697 Circuit substrate and its manufacturing method
05/22/2003US20030094687 Structure and method for wiring translation between grids with non-integral pitch ratios in chip carrier modules
05/22/2003US20030094685 Semiconductor device and module of the same
05/22/2003US20030094665 Solid-state imaging apparatus and manufacturing method thereof
05/22/2003US20030094628 Memory module structure
05/22/2003US20030094307 Multilayer ceramic substrate and method for manufacturing the same
05/22/2003US20030094305 Pressure-welded structure of flexible circuit boards
05/22/2003US20030093899 Copper-clad laminated sheet
05/22/2003US20030093898 Solder resist opening to define a combination pin one indicator and fiducial
05/22/2003US20030093897 Method and apparatus for shock and vibration isolation of a circuit component
05/21/2003EP1313358A2 Rotatable hinge mechanism with enclosure for housing flexible printed circuit
05/21/2003EP1313356A1 Low impedance/high density connectivity of surface mount components on a printed wiring board
05/21/2003EP1313226A1 Telecommunication device comprising a heat dissipation system
05/21/2003EP1313179A2 Press-fit bus bar for distributing power
05/21/2003EP1313173A2 Pin-grid-array electrical connector
05/21/2003EP1313144A2 Passive devices and modules for transceiver
05/21/2003EP1313143A2 Perimeter anchored thick film pad
05/21/2003EP1312895A1 Printed circuit for an analogue angular encoder
05/21/2003EP1312638A1 Halogen-free phosphorous-and nitrogen-containing flame-resistant epoxy resin compositions, and prepregs derived from thereof
05/21/2003EP1311616A2 Polyarylether-polyetherimide compositions
05/21/2003EP1311586A1 Polyimides for high-frequency applications
05/21/2003EP1201007B1 Antenna for contactless cards, hybrid cards and electronic labels
05/21/2003EP1197130B1 Circuitry with integrated passive components and method for producing same
05/21/2003EP1129050B1 Paste for screenprinting electric structures onto carrier substrates
05/21/2003EP0913075B1 Rectifier set for high voltage device
05/21/2003EP0819055B1 A laminate for sealing capsules
05/21/2003CN2552289Y Electronic circuit board for hand-held electronic speed regulating switch
05/21/2003CN1419803A Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
05/21/2003CN1419699A System, printed circuit board, charger device, user device, and apparatus
05/21/2003CN1419587A Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepreg made with these, and metal
05/21/2003CN1419581A Lowly-heat-expandable laminate
05/21/2003CN1419401A Welding pad for printed icrcuit board and forming method thereof
05/21/2003CN1419287A Device for shielding transmission line to ground or power supply
05/21/2003CN1419273A Process for making multiplayer wire distributed board having film capacitor
05/21/2003CN1419245A 电阻材料 Resistive material
05/21/2003CN1109482C Electroluminescent body and structure for shielding same
05/20/2003US6567713 Method and apparatus for registration control during processing of a workpiece, particularly during producing images on substrates in preparing printed circuit boards
05/20/2003US6567611 Electronic image recording apparatus
05/20/2003US6567542 Automatic training of inspection sites for paste inspection by using sample pads
05/20/2003US6567254 Methods and systems for reducing clamp voltages in surge protection circuitry
05/20/2003US6566975 Wiring board having parallel transmission lines to transmit equivalent signals in parallel
05/20/2003US6566974 Connection structure for noise reduction impedance element, noise reduction impedance element positioning method, and recording medium having noise reduction impedance element positioning program recorded therein
05/20/2003US6566962 Apparatus and method for tuning an inter-stage matching network of an integrated multistage amplifier
05/20/2003US6566746 Panel stacking of BGA devices to form three-dimensional modules
05/20/2003US6566669 Semiconductor parts and semiconductor mounting apparatus
05/20/2003US6566611 Anti-tombstoning structures and methods of manufacture
05/20/2003US6566610 Stacking multiple devices using direct soldering
05/20/2003US6566601 High frequency semiconductor device housing package and mounting structure for mounting the same
05/20/2003US6566448 Vinyl-terminated polybutadiene and butadiene-styrene copolymers containing urethane and/or ester residues, and the electrical laminates obtained therefrom
05/20/2003US6566291 Dielectric ceramic composition and method for designing dielectric ceramic composition
05/20/2003US6566288 Electrically insulating non-woven fabric, a prepreg and a laminate
05/20/2003US6566234 Semiconductor flip-chip package and method for the fabrication thereof
05/20/2003US6566165 Method for mounting a semiconductor chip to a semiconductor chip-mounting board
05/20/2003US6565977 Multilayer printed circuits
05/20/2003US6565956 Multilayer ceramic wiring board and process for producing same
05/20/2003US6565917 Depositing a paste in a via of a ceramic substrate and depositing the paste on the ceramic substrate; depositing, by a dry chemical vapor deposition (CVD) process, a nickel plating on paste, paste containing titania
05/20/2003US6565773 Conductive paste
05/20/2003US6565730 Self-aligned coaxial via capacitors
05/20/2003US6565496 Fully automated precision punch head loader for universal gang-punch tool
05/20/2003US6565384 Electro-optical connector with flexible circuit
05/20/2003US6565382 Core mounting assembly and clamp therefor
05/20/2003US6565380 Battery contact arrangement
05/20/2003US6565377 Electric connecting terminal
05/20/2003US6565365 High density wirebond connector assembly
05/20/2003US6565364 Wafer formed with CSP device and test socket of BGA device
05/20/2003US6565268 Optical connector and structure of optical connector-packaging/mounting portion
05/20/2003US6564986 Testing solder joint for response to heat cycles
05/20/2003US6564634 Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor
05/20/2003US6564450 Contacting-making system for two printed circuit boards
05/20/2003CA2411119A1 Pin-grid-array electrical connector
05/20/2003CA2363529A1 Press-fit bus bar for distributing power
05/20/2003CA2266158C Connecting devices and method for interconnecting circuit components
05/20/2003CA2070809C Crosslinkable fluorinated polymer compositions
05/15/2003WO2003041469A1 Method for the selective surface treatment of planar workpieces
05/15/2003WO2003041466A1 Field decoupling capacitor
05/15/2003WO2003041463A2 Method and apparatus for emi shielding
05/15/2003WO2003041227A1 Assembly comprised of a panel-like constructed module and of a connection unit, production method and device
05/15/2003WO2003041166A2 Substrate design and process for reducing electromagnetic emission
1 ... 642 643 644 645 646 647 648 649 650 651 652 653 654 655 656 657 658 659 660 661 662 ... 986