| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 06/24/2003 | US6583035 Semiconductor package with a controlled impedance bus and method of forming same |
| 06/24/2003 | US6583019 Perimeter anchored thick film pad |
| 06/24/2003 | US6582991 Semiconductor device and method for fabricating the same |
| 06/24/2003 | US6582887 Electrically conductive patterns, antennas and methods of manufacture |
| 06/24/2003 | US6582879 Reactive photo acid-generating agent and heat-resistant photoresist composition with polyamide precursor |
| 06/24/2003 | US6582820 Composite plate-like metal titanate and production method thereof |
| 06/24/2003 | US6582581 Comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement. |
| 06/24/2003 | US6582541 Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device |
| 06/24/2003 | US6582371 Ultrasound probe wiring method and apparatus |
| 06/24/2003 | US6582238 Printed circuit board with ground corner regions |
| 06/24/2003 | US6581281 Component alignment methods |
| 06/24/2003 | US6581278 Process and support carrier for flexible substrates |
| 06/24/2003 | CA2222602C Electronic modules manufacturing |
| 06/24/2003 | CA2218581C Multifunction sensor and network sensor system |
| 06/19/2003 | WO2003050919A1 Method for producing contact terminal with textured surface and use thereof |
| 06/19/2003 | WO2003050909A1 Circuit board device and its manufacturing method |
| 06/19/2003 | WO2003032087A3 Aqueous developable photoimageable thick film compositions |
| 06/19/2003 | WO2003020527A3 Screen printing process |
| 06/19/2003 | WO2003003757A3 Splitter assembly with high density backplane board |
| 06/19/2003 | WO2002061833A3 Substrate for an electric component and method for the production thereof |
| 06/19/2003 | US20030114606 A phosphazene compound or polyphosphazenes; fireproofing |
| 06/19/2003 | US20030114598 A thermosetting resin contains an acetylenic oligomer or polymer with multi-phenyl adamantane ring, and bonded with porogen which can decompose to form pore; use as dielectric substrate in microchips, circuit boards |
| 06/19/2003 | US20030114041 Connecting member for flat circuit member and method of connecting the connecting member and the flat circuit member |
| 06/19/2003 | US20030114033 Connector, electronic equipment and control method for electronic equipment |
| 06/19/2003 | US20030114028 Solder-bearing lead |
| 06/19/2003 | US20030114026 Fluted signal pin, cap, membrane, and stanchion for a ball grid array |
| 06/19/2003 | US20030114024 Printed wiring board having plurality of conductive patterns passing through adjacent pads, circuit component mounted on printed wiring board and circuit module containing wiring board with circuit component mounted thereon |
| 06/19/2003 | US20030114023 Electrical connection device |
| 06/19/2003 | US20030114022 Method for contacting a flexible circuit board with a contact partner and arrangement comprising flexible circuit board and contact partner |
| 06/19/2003 | US20030114021 Circuit card package |
| 06/19/2003 | US20030113669 Method of fabricating passive device on printed circuit board |
| 06/19/2003 | US20030113554 Glass ceramic laminate becoming relatively high in bending strength after fired |
| 06/19/2003 | US20030113522 Circuit board and production method therefor |
| 06/19/2003 | US20030113521 Metal layer laminated on a synthetic polyimide film obtained by immersing a partially imidized or dried poly(amide acid) film; dielectrics for printed circuits |
| 06/19/2003 | US20030113510 Multi-layers with vias in filled holes |
| 06/19/2003 | US20030113443 Multi-layer conductor-dielectric oxide structure |
| 06/19/2003 | US20030113073 Electrical sub-assembly design for parallel optics modules |
| 06/19/2003 | US20030113008 Process and device for generating test patterns when applying solder paste by a screen process on printed circuit boards |
| 06/19/2003 | US20030112710 Reducing thermal drift in electronic components |
| 06/19/2003 | US20030112627 Flexible sign illumination apparatus, system and method |
| 06/19/2003 | US20030112617 Wiring boards |
| 06/19/2003 | US20030112616 Layered circuit boards and methods of production thereof |
| 06/19/2003 | US20030112615 Method and apparatus for adding inductance to printed circuits |
| 06/19/2003 | US20030112614 Ball grid array chip packages having improved testing and stacking characteristics |
| 06/19/2003 | US20030112609 PCB structure for scope unit of electronic endoscope |
| 06/19/2003 | US20030112608 PCB structure for scope unit of electronic endoscope |
| 06/19/2003 | US20030112607 Method and apparatus for connecting circuit boards for a sensor assembly |
| 06/19/2003 | US20030112375 Apparatus and method for sharing signal control lines |
| 06/19/2003 | US20030112202 Method for producing a tag or a chip card, device for implementing said method and tag or chip card produced according to said method |
| 06/19/2003 | US20030112115 Multi-layered inductance element |
| 06/19/2003 | US20030112110 Embedded inductor for semiconductor device circuit |
| 06/19/2003 | US20030112091 High speed, controlled impedance air dielectric circuit modules for electronic backplane systems |
| 06/19/2003 | US20030112087 Cross talk compensation circuit |
| 06/19/2003 | US20030112084 Low electromagnetic interference clock oscillator module |
| 06/19/2003 | US20030111959 Method and apparatus for the reduction of electromagnetic radiation from display screens |
| 06/19/2003 | US20030111727 Semiconductor integrated circuit device and printed wired board for mounting the same |
| 06/19/2003 | US20030111477 Power control for instrumented medication package |
| 06/19/2003 | US20030111262 Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device |
| 06/19/2003 | US20030111261 Circuit within a circuit board |
| 06/19/2003 | US20030111243 Feedthrough interconnection assembly |
| 06/19/2003 | US20030111242 Emi-shielding riser card for a computer chassis |
| 06/19/2003 | US20030110978 Independently dispersed metal ultrafine particles-containing liquid dispersion |
| 06/19/2003 | US20030110630 Insulating material, method for producing insulating material, method for manufacturing multilayer cicuit board |
| 06/19/2003 | US20030110629 Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package |
| 06/19/2003 | US20030110627 Substrate for receiving a circuit configuration and method for producing the substrate |
| 06/19/2003 | US20030110624 Solder resist opening to define a combination pin one indicator and fiducial |
| 06/19/2003 | US20030110622 Semiconductor device and method for producing the same, and anisotropic conductive circuit board |
| 06/19/2003 | US20030110621 Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods |
| 06/18/2003 | EP1320288A2 Printing wiring board device and method of manufacture thereof |
| 06/18/2003 | EP1320287A1 Electrical connecting element and semi-finished product |
| 06/18/2003 | EP1320286A2 Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods |
| 06/18/2003 | EP1320112A1 Relay device and relay device mounting structure |
| 06/18/2003 | EP1320109A1 Multi-layered inductance element |
| 06/18/2003 | EP1319325A1 Power module for high intensity discharge lamp |
| 06/18/2003 | EP1319324A2 Dual mode light source for aircraft external lighting |
| 06/18/2003 | EP1319236A2 Method and apparatus for forming a magnetic component on a printed circuit board |
| 06/18/2003 | EP1319119A1 Connecting device for routing control and power signals to an internal combustion engine valve actuators |
| 06/18/2003 | EP1319095A1 Multi-component fibers having reversible thermal properties |
| 06/18/2003 | CN1425269A Flanged terminal pins for DC/DC converters |
| 06/18/2003 | CN1425268A Electronic supports and methods and apparatus for forming apertures in electronic supports |
| 06/18/2003 | CN1425034A Process for producing novel silicone polymer, silicone polymer produced by the process, thermosetting resin composition resin film, metal foil with insulating. material, insulating film with metal |
| 06/18/2003 | CN1424868A Method for producing basalt fiber reinforced copper coated boards |
| 06/18/2003 | CN1424781A Batteries |
| 06/18/2003 | CN1424736A Fuse cases |
| 06/18/2003 | CN1424733A Dielectric structure |
| 06/18/2003 | CN1424732A Dielectric structure |
| 06/18/2003 | CN1424729A Medium sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate |
| 06/18/2003 | CN1424728A Conductive sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate |
| 06/18/2003 | CN1424727A Resistance sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate |
| 06/18/2003 | CN1112088C Method for manufacture of certain equipment containing printed-circuit board |
| 06/18/2003 | CN1111875C Flat resistor and capacitor and making method thereof |
| 06/18/2003 | CN1111785C Programmable controller system and method for switching functions of main boards therein |
| 06/18/2003 | CN1111574C Conducting resin composition for filling small hole, and double-face and multi-layer board made of same and producing method thereof |
| 06/17/2003 | US6580961 Circuit production method |
| 06/17/2003 | US6580931 Printed circuit board including EMI reducing circuits, an information processing apparatus having the board and a method to select the circuits |
| 06/17/2003 | US6580865 Optical fiber systems |
| 06/17/2003 | US6580615 Memory card |
| 06/17/2003 | US6580611 Dual-sided heat removal system |
| 06/17/2003 | US6580595 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
| 06/17/2003 | US6580491 Apparatus and method for compensating for distortion of a printed circuit workpiece substrate |