Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
05/2003
05/02/2003EP1305988A1 Method for contacting a flexible circuit board with a contact partner and arrangement comprising flexible circuit board and contact partner
05/02/2003EP1305987A1 Adhesive bonding of printed circuit boards to heat sinks
05/02/2003EP1305838A2 Low-temperature fabrication of thin-film energy-storage devices
05/02/2003EP1305830A2 Electronic assembly comprising interposer with embedded capacitors and methods of manufacture
05/02/2003EP1305258A2 Ceramic microelectromechanical structure
05/02/2003EP1205005B1 Microstrip for microwave applications
05/02/2003EP1115563A4 Phenol-novolacs with improved optical properties
05/02/2003EP1095547B1 Yarn treatment system
05/02/2003EP1078437B1 Embedded backup energy storage unit
05/02/2003EP1007596B1 Contact Printable Adhesive Composition and Methods of Making Thereof
05/02/2003EP0857402A4 High performance flexible laminate
05/02/2003EP0710177B1 Circuit board material with barrier layer
05/02/2003CA2426866A1 Securing electrical conductors
05/01/2003WO2003037057A1 Element for electromagnetic shielding and method for manufacturing thereof
05/01/2003WO2003037053A1 Chip scale stacking system and method
05/01/2003WO2003037050A1 Wiring board sheet and its manufacturing method, multilayer board, and its manufacturng method
05/01/2003WO2003037048A1 Multilayer rf amplifier module
05/01/2003WO2003036763A2 Bending a tab flex circuit via cantilevered leads
05/01/2003WO2003036689A2 Anti-tombstoning structures and methods of manufacture
05/01/2003WO2003036685A2 Method and apparatus for applying conductive ink onto semiconductor substrates
05/01/2003WO2003036664A1 Multilayer circuit and method of manufacturing
05/01/2003WO2003036663A1 Fully automatic process for magnetic circuit assembly
05/01/2003WO2003036661A2 Resistor nanocomposite compoisitons
05/01/2003WO2003035719A1 Polyaryletherketone polymer blends
05/01/2003WO2003035392A1 Fluoropolymer laminates and a process for manufacture thereof
05/01/2003WO2003035386A1 Integrated microfluidic, optical and electronic devices and method for manufacturing
05/01/2003WO2003035281A2 Ultrasonic printed circuit board transducer
05/01/2003WO2002069649A3 Telecommunications chassis and card with flame spread containment
05/01/2003US20030084415 System and method for evaluation of electric characteristics of printed-circuit boards
05/01/2003US20030083458 Method and apparatus of producing high-density polyidimide (HPI) film
05/01/2003US20030083129 Controller
05/01/2003US20030082974 Solid sheet material especially useful for circuit boards
05/01/2003US20030082938 Circuit board connector with improved terminal tails
05/01/2003US20030082937 Integrated and flexible power distribution assembly
05/01/2003US20030082935 Circuit board-to-board interconnection device
05/01/2003US20030082898 Ball grid array X-ray orientation mark
05/01/2003US20030082850 Methods of fabricating semiconductor substrate-based BGA interconnections
05/01/2003US20030082846 Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
05/01/2003US20030082363 Prepreg and circuit board and method for manufacturing the same
05/01/2003US20030081719 Marking apparatus used in a process for producing multi-layered printed circuit board
05/01/2003US20030081394 Electronic-part mounting structure and mounting method therefor
05/01/2003US20030081393 Resin-formed substrate and resin-formed substrate unit
05/01/2003US20030081392 Integrated circuit stacking system and method
05/01/2003US20030081388 Electronic signal adapter module of flash memory card
05/01/2003US20030081387 Module and connector having multiple contact rows
05/01/2003US20030081066 Bending a tab flex circuit via cantilevered leads
05/01/2003US20030081065 Limiting unwanted ink penetration of flexible circuits of fluid ejection devices
05/01/2003US20030080836 High frequency circuit module
05/01/2003US20030080835 High frequency printed circuit board via
05/01/2003US20030080826 Method of shortening a microwave circuit and the printed circuit board made by using said method
05/01/2003US20030080819 Cavity design printed circuit board for a temperature compensated crystal oscillator and a temperature compensated crystal oscillator employing the same
05/01/2003US20030080438 Semiconductor module
05/01/2003US20030080417 Semiconductor device, semiconductor package, electronic device, and method for establishing information processing environment
05/01/2003US20030080415 Cross-over for quasi-coaxial transmission lines fabricated on a substrate
05/01/2003US20030080409 Multilayered substrate for semiconductor device
05/01/2003US20030080408 Method for fabricating semiconductor components and interconnects with contacts on opposing sides
05/01/2003US20030079910 Current carrying structure using voltage switchable dielectric material
05/01/2003US20030079909 Stacking multiple devices using direct soldering
05/01/2003US20030079907 Card edge connector, method of manufacturing same, electronic card and electronic equipment
05/01/2003US20030079900 Adjustable line length
05/01/2003US20030079680 Method for mounting a semiconductor device
05/01/2003US20030079627 Screening apparatus with trailing squeegee and method of screening
05/01/2003US20030079369 Process and apparatus for drying drying a thick film layer
04/2003
04/30/2003CN2548389Y 印刷电路板元件 A printed circuit board element
04/30/2003CN1414828A Electronic module and its producing method
04/30/2003CN1414826A Surface mounting base for printed circuit board assembly
04/30/2003CN1414823A Substrate detecting device
04/30/2003CN1414822A Preimpregnation material block and circuit substrate and their manufacture method
04/30/2003CN1414821A Circuit base board having high quality rate
04/30/2003CN1414431A Marking equipment used in manufacturing process of multi-layer printed circuit board
04/30/2003CN1413754A 控制器 Controller
04/30/2003CN1107421C Matrix patch board and its producing method
04/30/2003CN1107336C Multi-layer circuit substrate and mfg. method thereof
04/30/2003CN1106945C Cable clamping terminal lead wire
04/29/2003US6557154 Printed circuit board design support system, printed circuit board design method and storage medium storing control program for same
04/29/2003US6556847 Battery-powered radio frequency communication apparatus
04/29/2003US6556455 Ultra-low impedance power interconnection system for electronic packages
04/29/2003US6556453 Electronic circuit housing with trench vias and method of fabrication therefor
04/29/2003US6556420 Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board
04/29/2003US6556419 Electronic component and method for producing same
04/29/2003US6556416 Variable capacitor and a variable inductor
04/29/2003US6556293 Optical inspection of laser vias
04/29/2003US6556269 Connection assembly for reflective liquid crystal display and method
04/29/2003US6556268 Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB
04/29/2003US6555920 Vertical electronic circuit package
04/29/2003US6555914 Comprises reduced parasitic capacitance; constructed as electroconductive laminated layers
04/29/2003US6555913 Electronic component having a coil conductor with photosensitive conductive paste
04/29/2003US6555906 Microelectronic package having a bumpless laminated interconnection layer
04/29/2003US6555782 Laser machining method, laser machining apparatus, and its control method
04/29/2003US6555763 Multilayered circuit board for semiconductor chip module, and method of manufacturing the same
04/29/2003US6555762 Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition
04/29/2003US6555758 Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the like
04/29/2003US6555756 Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof
04/29/2003US6555755 Flexible interconnecting substrate and method of manufacturing the same, film carrier, tape-shaped semiconductor device, semiconductor device, circuit board, and electronic equipment
04/29/2003US6555745 Electrical interconnect between an articulating display and a PC based planar board
04/29/2003US6555462 Semiconductor device having stress reducing laminate and method for manufacturing the same
04/29/2003US6555238 Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
04/29/2003US6555227 Heat curing; adhesives
04/29/2003US6555208 Printed wiring board and method of manufacturing the same
04/29/2003US6555174 Impregnating a glass fiber substrate; curing; heating
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