Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
05/2003
05/15/2003WO2003041096A1 Thin film capacitor using conductive polymers
05/15/2003WO2003041092A1 Thin flexible conductors
05/15/2003WO2003039974A2 Package enclosing multiple packaged chips
05/15/2003WO2003039830A1 Manufacture of varnish impregnated webs and laminate boards made therefrom
05/15/2003WO2002058411A3 System and method for on-line insertion of line replaceable units in wireless and wireline access systems
05/15/2003WO2002047148A3 Electrically isolated via in a multilayer ceramic package
05/15/2003US20030093735 Apparatus and method for random pattern built in self-test
05/15/2003US20030092871 Method and apparatus of producing high-density polyidimide (HPI) film
05/15/2003US20030092396 Wireless network card with antenna selection option
05/15/2003US20030092295 Method for providing uniform pressure
05/15/2003US20030092291 High speed electrical connector
05/15/2003US20030091800 Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards
05/15/2003US20030091787 Circuit forming board producing method, circuit forming board, and material for circuit forming board
05/15/2003US20030091751 Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact id and production method thereof
05/15/2003US20030091730 Via shielding for power/ground layers on printed circuit board
05/15/2003US20030091457 Wherein molybdenum encapsulates copper; may be sintered without copper leakage
05/15/2003US20030090910 Light emitting diode lamp
05/15/2003US20030090883 Component built-in module and method for producing the same
05/15/2003US20030090882 Passive devices and modules for transceiver
05/15/2003US20030090879 Dual inline memory module
05/15/2003US20030090858 Planar polymer capacitor
05/15/2003US20030090819 External mirror on a motor vehicle
05/15/2003US20030090291 Electronic device
05/15/2003US20030090255 Serial bus control method and apparatus for a microelectronic power regulation system
05/15/2003US20030089984 Multilayer flexible wiring boards
05/15/2003US20030089982 Sharing of multiple-access signal line in a printed circuit board
05/15/2003US20030089978 Memory-module and a method of manufacturing the same
05/15/2003US20030089977 Package enclosing multiple packaged chips
05/15/2003US20030089776 Optical reader comprising support post
05/15/2003US20030089524 Resin substrate
05/15/2003US20030089523 Sash for land grid arrays
05/15/2003US20030089522 Low impedance / high density connectivity of surface mount components on a printed wiring board
05/15/2003US20030089521 Bonding pad(s) for a printed circuit board and a method for forming bonding pad(s)
05/15/2003US20030089520 Wired circuit board
05/15/2003US20030089519 Flexible printed circuit
05/15/2003US20030089514 Power supply terminal and back board
05/15/2003US20030089199 Copper powder for electrically conductive paste
05/15/2003US20030088978 Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated
05/15/2003US20030088970 A process for manufacturing a flat coil
05/15/2003DE10124766C1 Circuit board for holding antenna has circuit board foil laminated onto core layer, covering core layer, with first area overlapping core layer and with at least part of structure acting as antenna
05/15/2003CA2465269A1 Thin film capacitor using conductive polymers
05/14/2003EP1311144A2 Printed circuit board having integrated connections and method for manufacturing such a board
05/14/2003EP1311072A1 Transmitter and receiver module
05/14/2003EP1311025A2 Electronic-part mounting structure and mounting method therefor
05/14/2003EP1310995A2 Device for shielding the signal lines by the ground or power lines
05/14/2003EP1310593A1 Heat-resistant fibrous paper
05/14/2003EP1310525A1 Copper foil with resin and printed wiring boards made by using the same
05/14/2003EP1310518A1 Dielectric resin foam and lens antenna comprising the same
05/14/2003EP1310036A1 Energy supply unit for transmitting auxiliary energy to an electrical device
05/14/2003EP1233935B1 Method for attaching a body, which is comprised of a metal matrix composite (mmc) material, to a ceramic body
05/14/2003EP1133902B1 Electromechanical component
05/14/2003EP1060142B1 Glass fiber strands coated with thermally conductive inorganic particles and products including the same
05/14/2003EP0815622B1 Cross-connect method and apparatus
05/14/2003CN2550990Y Wiring improving device for circuit board TRL test line
05/14/2003CN1418241A Melt-processible poly (tetrafluoroethylene)
05/14/2003CN1418050A Manufacture of wiring substrate
05/14/2003CN1418049A Multilayer ceramic substrate and its production process
05/14/2003CN1418048A Built-in module in element and its making process
05/14/2003CN1418047A Mainboard supporting different connectros of various pins and its design method
05/14/2003CN1417888A Circuit board and surface mount antenna device on it
05/14/2003CN1417856A Semiconductor package and its manufacture
05/14/2003CN1417855A Multilayer substrate for semiconductor device
05/14/2003CN1417777A Fixed disk drive including flexible printed circuit board with damping material
05/14/2003CN1108736C Method of producing metallic layer on surface of detail for shielding against electromagnetic radiation
05/14/2003CN1108733C Printed circuit board of reducing of electromagnetic noise
05/14/2003CN1108267C Transport system with integrated transport carrier and directors
05/14/2003CN1108214C Method for preparation of golden powder by decomposing aerosol
05/13/2003US6563905 Ball grid array X-ray orientation mark
05/13/2003US6563696 Solderless laser assembly
05/13/2003US6563691 Mounting structure for capacitors
05/13/2003US6563688 Isolating energy conditioning shield assembly
05/13/2003US6563223 Interconnection component for facilitating testing of packaged integrated circuits
05/13/2003US6563214 Electronic component and method of manufacturing the same
05/13/2003US6563058 Multilayered circuit board and method for producing the same
05/13/2003US6563057 Printed circuit board and method for manufacturing same
05/13/2003US6563056 Insulation barrier on a printed circuit board
05/13/2003US6563044 Non-silicone conductive paste for the electrical industry, and its use
05/13/2003US6562661 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
05/13/2003US6562660 Method of manufacturing the circuit device and circuit device
05/13/2003US6562654 Tented plated through-holes and method for fabrication thereof
05/13/2003US6562641 Apparatus and methods of semiconductor packages having circuit-bearing interconnect components
05/13/2003US6562545 Method of making a socket assembly for use with a solder ball
05/13/2003US6562188 Resist mask for measuring the accuracy of overlaid layers
05/13/2003US6562179 High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of these
05/13/2003US6562169 Multi-level web structure in use for thin sheet processing
05/13/2003US6562147 Soldered product
05/13/2003US6561666 Organic electroluminescent (EL) device
05/13/2003US6561410 Low cost and high speed 3 load printed wiring board bus topology
05/13/2003US6560864 Process for manufacturing a flat coil
05/13/2003US6560861 Microspring with conductive coating deposited on tip after release
05/13/2003US6560860 Providing multilayered low temperature co-fired ceramic assembly with constraining core to minimize shrinkage of outer ceramic layers having high density circuit features patterned thereon during firing
05/08/2003WO2003039216A1 Carrier arrangement for carrying optical components and connecting optical signals and method of manufacturing the same
05/08/2003WO2003038897A2 Electronic unit, circuit design for the same, and production method
05/08/2003WO2003038896A2 Ball grid array with x-ray alignment mark
05/08/2003WO2003038865A2 Stacking multiple devices using direct soldering
05/08/2003WO2003038576A2 Module and connector having multiple contact rows
05/08/2003WO2003038524A1 Methods of producing photosensitive ceramic composition and multi-layer substrate using it
05/08/2003WO2003038158A2 Electroplating device and electroplating system for coating already conductive structures
05/08/2003WO2003038002A1 Ink-jet inks containing metal nanoparticles
05/08/2003WO2003037953A1 Resin composition
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