Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
06/2003
06/05/2003US20030104738 Energy absorbent laminate
06/05/2003US20030104715 Signal-transmitting device
06/05/2003US20030104687 Temporary chip attach structure with thin films
06/05/2003US20030104184 Multiple wiring board
06/05/2003US20030104182 Method for manufacturing a printed circuit board substrate
06/05/2003US20030103641 Device for sound conversion
06/05/2003US20030103341 Shielding structure for resonant circuit
06/05/2003US20030103322 Flexible shielded circuit board interface
06/05/2003US20030103319 Thin film capacitor using conductive polymers
06/05/2003US20030103309 Spark gap device
06/05/2003US20030103134 Light source device and image recording apparatus
06/05/2003US20030103027 Tape carrier package
06/05/2003US20030103006 Radio communication device with integrated antenna, transmitter, and receiver
06/05/2003US20030102873 Balance high density 110 IDC terminal block
06/05/2003US20030102820 Lamps
06/05/2003US20030102574 Semiconductor device
06/05/2003US20030102572 Integrated assembly protocol
06/05/2003US20030102560 Wafer level package and method for manufacturing the same
06/05/2003US20030102553 Member for electronic circuit, method for manufacturing the member, and electronic part
06/05/2003US20030102547 Semiconductor device and production method thereof
06/05/2003US20030102536 Device for shielding transmission lines from ground or power supply
06/05/2003US20030102465 Mixture of silver powder, molybdenum silicide or boride, glass frit and solvent
06/05/2003US20030102224 Multilayer laminated structure
06/05/2003US20030102159 Optimum power and ground bump pad and bump patterns for flip chip packaging
06/05/2003US20030102158 Laminate having plated microvia interconnects and method for forming the same
06/05/2003US20030102157 Circuit interconnect for optoelectronic device for controlled impedance at high frequencies
06/05/2003US20030102156 Ball grid array package
06/05/2003US20030102155 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder
06/05/2003US20030102153 Transfer material method for producing the same and wiring substrate produced by using the same
06/05/2003US20030102151 Multilayer build-up wiring board
06/05/2003US20030102150 Printed circuit board with wiring pattern formed thereon by screen printing and process for manufacturing the same
06/05/2003US20030101585 Methods of manufacturing via intersect pad for electronic components
06/05/2003US20030101581 Strain relief for substrates having a low coefficient of thermal expansion
06/04/2003EP1317170A2 Shielding structure for resonant circuit
06/04/2003EP1317168A1 Data bus connection for memory device
06/04/2003EP1316981A1 Vibration sensor made from laminated substrates with conductive ball
06/04/2003EP1316976A1 Dielectric structure for solid capacitor and method for making it
06/04/2003EP1316420A1 Energy absorbant laminate for mechanical composite joints
06/04/2003EP1315679A1 Glass ceramic mass and use thereof
06/04/2003EP1166353A4 Laminate for multi-layer printed circuit
06/04/2003EP1155348B1 Printed circuit board for electrical and optical signals and method for producing the same
06/04/2003EP1135693B1 Probe card for probing wafers with raised contact elements
06/04/2003EP1090538B1 Surface mount technology compatible emi gasket and a method of installing an emi gasket on a ground trace
06/04/2003EP0812258B1 Electrical feedthroughs for ceramic circuit board support substrates
06/04/2003EP0779772B1 Printed wiring board, method of producing the same and electronic devices
06/04/2003EP0463105B2 High capacitance laminates
06/04/2003CN2554895Y Mounting base for printed circuit board and anti-electromagnetic interference device
06/04/2003CN2554893Y High integrated level stack material
06/04/2003CN1422440A Contactless interconnection system
06/04/2003CN1422108A Printed circuit board with testing point formed at side
06/04/2003CN1422107A Method of sharing the identical printed circuit board in different connector and detecting
06/04/2003CN1422071A Solid imaging apparatus and producing method thereof
06/04/2003CN1421964A Electronic elements assembly and electric connector therein and unit
06/04/2003CN1421963A Grid array pin connector
06/04/2003CN1421926A 多重布线板 Multiple wiring board
06/04/2003CN1421925A Semiconductor assembly
06/04/2003CN1110946C High-frequency modulator built-in TV tuner
06/04/2003CN1110821C Flat resistor-capacitor and making method thereof
06/04/2003CN1110771C Carrier structural element
06/04/2003CN1110408C Cladding laminated products for producing printed circuit board and the producing method of the same products
06/03/2003US6574726 Modular architecture for high bandwidth computers
06/03/2003US6574166 Drug delivery management system
06/03/2003US6574116 Inverter capacitor module and inverter
06/03/2003US6574115 Computer system, electronic circuit board, and card
06/03/2003US6574108 Selective PCB via location to enhance cooling
06/03/2003US6574090 Printed circuit board capacitor structure and method
06/03/2003US6574087 Electrode layers (1, 2) are arranged on both sides of a dielectric layer (3) facing each other so as to configure a capacitor. Lead electrodes (4, 5) are formed in the electrode layers (1, 2). A penetrating electrode (6) that is insulated
06/03/2003US6573821 System, printed circuit board, charger device, user device, and apparatus
06/03/2003US6573804 Electronic apparatus having a printed circuit board with multi-point grounding
06/03/2003US6573801 Electromagnetic coupler
06/03/2003US6573757 Signal line matching technique for ICS/PCBS
06/03/2003US6573740 Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate
06/03/2003US6573704 Method and apparatus for isolating an ambient air temperature sensor
06/03/2003US6573620 Method and apparatus for automatically identifying a central processing unit
06/03/2003US6573610 Substrate of semiconductor package for flip chip package
06/03/2003US6573600 Multilayer wiring substrate having differential signal wires and a general signal wire in different planes
06/03/2003US6573597 Cross-over for quasi-coaxial transmission lines fabricated on a substrate
06/03/2003US6573584 Thin film electronic device and circuit board mounting the same
06/03/2003US6573458 Printed circuit board
06/03/2003US6573447 Electric device having a housing made of solidified polymeric material
06/03/2003US6573322 Resin composition contains a zinc- based metal powder, low melting metal which melts upon molding, and thermoplastic resin
06/03/2003US6573121 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
06/03/2003US6573028 Reducing number of fabricating steps
06/03/2003US6572968 Treating glass fiber base material with silicon oligomer with one functional end group reactive to hydroxyl group, impregnating the treated base matrial with a resin varnish, drying the impregnated base material
06/03/2003US6572963 Process of forming a pattern on a substrate
06/03/2003US6572955 Mixed oxides of silicone, aluminum, magnesium, zinc and boron ,(30-50% by weight, crystal phase containing oxides of zinc and aluminum, 5-15% of crystal phase of silica and magnesium oxide, 40 to 60% amorphous silica or silica and boron oxide)
06/03/2003US6572954 Electromechanical component
06/03/2003US6572830 Integrated multilayered microfludic devices and methods for making the same
06/03/2003US6572412 Control device and soldering method
06/03/2003US6572278 Opto-electronic device having staked connection between parts to prevent differential thermal expansion
06/03/2003US6571469 Method for manufacturing modular board
06/03/2003US6571467 Thermal curing of insulating layer and reducing oxidized layer on printed circuits
06/03/2003CA2123083C Uses of 1,1,1,3,3,3-hexafluoropropane
05/2003
05/30/2003WO2003045121A1 Multilayered board comprising folded flexible circuits and method of manufacture
05/30/2003WO2003045120A1 Method and apparatus for securing a circuit board to a rigid surface
05/30/2003WO2003045073A2 Telecommunications patch panel
05/30/2003WO2003044891A1 Dielectric antenna module
05/30/2003WO2003043747A2 Manufacture having double sided features in a metal-containing web formed by etching
05/30/2003WO2002093649A3 Electronic module and method for assembling same
05/30/2003WO2002067325A3 High-density flip-chip interconnect
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