Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
06/2003
06/17/2003US6580316 Power transistor module, power amplifier and methods in the fabrication thereof
06/17/2003US6580174 Vented vias for via in pad technology yield improvements
06/17/2003US6580036 Multi-layer printed circuit board and a BGA semiconductor package using the multi-layer printed circuit board
06/17/2003US6579818 Crystal phases of gahnite, celsian containing needle-like crystals with aspect ratio >/= 3, and at least one selected from silicon or aluminum nitride, silicon carbide and aluminum, zirconium, silicon or magnesium silicon oxides
06/17/2003US6579817 Containing aluminum and magnesium oxide
06/17/2003US6579744 Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive
06/17/2003US6579623 Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member
06/17/2003US6579437 Acid resistance
06/17/2003US6579392 Preparing a green composite laminate comprising first green sheet layers each comprising a first particulate aggregate and second green sheet layers each comprising a second particulate aggregate unsinterable at a temperature for
06/17/2003US6579174 Arcade game having interchangeable features
06/17/2003US6579121 Double row modular gang jack for board edge application
06/17/2003US6579107 Connector pin for an edge of a circuit board
06/17/2003US6578986 Modular mounting arrangement and method for light emitting diodes
06/17/2003US6578260 Method for assembling a multi-deck power supply device
06/13/2003CA2413369A1 Electronic module including a low temperature co-fired ceramic (ltcc) substrate with a capacitive structure embedded therein and related methods
06/12/2003WO2003049513A1 Electric circuit module and method for its assembly
06/12/2003WO2003049512A1 Ball grid array package
06/12/2003WO2003049511A1 High speed multi-layer printed circuit board via
06/12/2003WO2003049183A2 Optimum power and ground bump pad and bump patterns for flip chip packaging
06/12/2003WO2003048981A2 Improving integrated circuit performance and reliability using a patterned bump layout on a power grid
06/12/2003WO2003048879A1 Ballast control card
06/12/2003WO2003048674A2 Guided munitions electronics package and method
06/12/2003WO2003048641A1 Quartz glass single hole nozzle and quartz glass multi-hole burner head for feeding fluid
06/12/2003WO2003048251A1 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s)
06/12/2003WO2003048249A1 Thermosetting resin composition for high performance laminates
06/12/2003WO2001061732A3 Device for protecting an electric and/or electronic component arranged on a carrier substrate against electrostatic discharges
06/12/2003US20030110452 Electronic package design with improved power delivery performance
06/12/2003US20030109666 Thermosetting resin compositions containing maleimide and/or vinyl compounds
06/12/2003US20030109182 Contact module, connector and method of producing said contact module
06/12/2003US20030109170 Relay device and relay device mounting structure
06/12/2003US20030109151 Electrical connector having terminal inserts
06/12/2003US20030108766 Copper alloy foil
06/12/2003US20030108748 Method for preparing substrate for flexible print wiring board, and substrate for flexible print wiring board
06/12/2003US20030108746 Halogen free flame retardant adhesive resin coated composite
06/12/2003US20030108727 Transfer sheet
06/12/2003US20030108664 Depositing silver metal precursor into portion of recessed feature, heating to temperature of not greater than 400 degrees C to convert precursor to conductor having resistivity of not greater than 10 times resistivity of metal
06/12/2003US20030107876 Structure for mounting an electronic circuit unit
06/12/2003US20030107874 De-mountable, solderless in-line lead module package with interface
06/12/2003US20030107869 Capacitor employing both fringe and plate capacitance and method of manufacture thereof
06/12/2003US20030107465 Passive element component and substrate with built-in passive element
06/12/2003US20030107455 Integrated ceramic module and microwave dielectric composition
06/12/2003US20030107452 Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conductors of an electrical power distribution structure
06/12/2003US20030107444 Oscillator and electronic apparatus using the same
06/12/2003US20030107365 Reversed memory module socket, motherboard and test system including same, and method of modifying motherboard
06/12/2003US20030107331 Ballast control card
06/12/2003US20030107056 Substrate pads with reduced impedance mismatch and methods to fabricate substrate pads
06/12/2003US20030107026 Electroconductive particles in curable polymer
06/12/2003US20030106924 Electronic circuit device and method for manufacturing the same
06/12/2003US20030106711 Solder resist opening to define a combination pin one indicator and fiducial
06/12/2003US20030106706 Flat cable and a manufacturing method therefor
06/12/2003US20030106204 Method of making radio frequency identification tags
06/12/2003DE10136514C1 Verfahren zur Herstellung einer elektrisch leitenden Bondverbindung, sowie Bondverbindung A process for producing an electrically conductive bond, as well as bond
06/11/2003EP1318704A1 Printed circuit board micro hole processing method
06/11/2003EP1318532A1 Coil assembly and manufacturing thereof
06/11/2003EP1317875A1 Method for producing an electrically conductive structure on a non-planar surface and the use of said method
06/11/2003EP1317801A2 Thick film millimeter wave transceiver module
06/11/2003EP1317769A2 Connection for conducting high frequency signal between a circuit and a discrete electrical component
06/11/2003EP1240809B1 Multilayer printed board
06/11/2003EP1218202B1 Method and compositions for printing substrates
06/11/2003EP1080247B1 Method for producing metallized substrate materials
06/11/2003EP0789878A4 Hierarchical crossbar switch
06/11/2003CN1423678A Flame retardant phosphorus element-containing epoxy resin compositions
06/11/2003CN1423517A Printed circuit board with built-in resistor and its making method
06/11/2003CN1423288A Method for making ceramic laminate product, laminate electronic element and making method
06/11/2003CN1422721A Method for producing metal-ceramic composite lining and solder material used for same
06/10/2003US6577508 Multilayer circuit board
06/10/2003US6577503 Vertical surface mount apparatus with thermal carrier
06/10/2003US6577492 Use of 9,9-bis(aminophenyl)fluorene curing agents reduces water adsorption in the dielectric layer
06/10/2003US6577490 Wiring board
06/10/2003US6577225 Array resistor network
06/10/2003US6577211 Transmission line, filter, duplexer and communication device
06/10/2003US6577016 Semiconductor device having adhesive inflow preventing means
06/10/2003US6577002 180 degree bump placement layout for an integrated circuit power grid
06/10/2003US6576999 Mounting structure for an electronic component having an external terminal electrode
06/10/2003US6576992 Chip scale stacking system and method
06/10/2003US6576847 Clamp to secure carrier to device for electromagnetic coupler
06/10/2003US6576690 Phosphorous-containing flame retarding epoxy resin and an epoxy resin composition containing the same
06/10/2003US6576681 Antireflective porogens
06/10/2003US6576409 Photosensitive resin composition and method for formation of resist pattern by use thereof
06/10/2003US6576402 Method for producing wiring configurations having coarse conductor structures and at least one region having fine conductor structures
06/10/2003US6576148 Non-homogeneous laminate material for suspension with electrostatic discharge shunting
06/10/2003US6576081 Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A
06/10/2003US6575790 Detachable connecting system
06/10/2003US6575766 Laminated socket contacts
06/10/2003US6575762 Connection of coaxial cable to a circuit board
06/10/2003US6575548 System and method for controlling energy characteristics of an inkjet printhead
06/10/2003US6575411 Flat conductor folding and fixing device
06/10/2003US6574862 Method for coupling PCB sheet
06/05/2003WO2003047328A2 Method and devices for qualifying substrate-processing production processes
06/05/2003WO2003047325A1 High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method
06/05/2003WO2003047323A1 Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer
06/05/2003WO2003047322A1 Data bus connection for memory device
06/05/2003WO2003046981A1 Module structure and module comprising it
06/05/2003WO2003046938A1 Improvements in keyboards
06/05/2003WO2003045584A1 Hot melt conductor paste composition
06/05/2003WO2003023388A8 Sensor substrate and method of fabricating same
06/05/2003WO2003007375A3 Single package containing multiple integrated circuit devices
06/05/2003WO2002071695A3 Wireless access using multiple modulation formats according to subscriber type
06/05/2003US20030104924 High dielectric constant;low loss over a frequency range of 1 kHz-1MHz; useful in capacitors in electronic devices
06/05/2003US20030104917 Glass and (Zn2TiO4)x (ZnTiO3)(1-x) (TiO2)y, wherein x is between 0 and 1 and y is between 0 and .5, including 0; ceramic capacitors; LC filters.
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