| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/15/2003 | US6594152 Board-to-board electrical coupling with conductive band |
| 07/15/2003 | US6594136 Multi-layer capacitor, wiring board, and high-frequency circuit |
| 07/15/2003 | US6594128 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 07/15/2003 | US6593534 Printed wiring board structure with z-axis interconnections |
| 07/15/2003 | US6593533 Lattice-shaped circuit board |
| 07/15/2003 | US6593526 Mounting mechanism of metal plate on printed board |
| 07/15/2003 | US6593255 Impregnated glass fiber strands and products including the same |
| 07/15/2003 | US6593167 IC card indicating state of usage and system therefor |
| 07/15/2003 | US6592987 Wholly aromatic synthetic fiber produced by liquid-crystal spinning, process for producing the same, and use thereof |
| 07/15/2003 | US6592696 Method for fabricating a multilayered structure and the structures formed by the method |
| 07/15/2003 | US6592021 Thin and large-area dielectric substrate and an improved grounding condition |
| 07/15/2003 | US6591754 Pyrotechnical ignition system with integrated ignition circuit |
| 07/15/2003 | US6591495 Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating |
| 07/15/2003 | US6591491 Method for producing multilayer circuit board |
| 07/15/2003 | US6591490 Method of constructing a multilayer electric apparatus |
| 07/15/2003 | CA2195038C Integrated circuit packaging structure |
| 07/10/2003 | WO2003056888A1 Method of soldering the constituent layers of a multilayer printed circuit and the machine used for same |
| 07/10/2003 | WO2003056654A1 Filter circuit apparatus and manufacturing method thereof |
| 07/10/2003 | WO2003056574A1 Electroconductive composition, electroconductive coating and method for forming electroconductive coating |
| 07/10/2003 | US20030131323 Method of schematic-level AMS topology optimization using direct representations |
| 07/10/2003 | US20030130826 Model for modifying drill data to predict hole locations in a panel structure |
| 07/10/2003 | US20030130475 Active energy ray-curable polyimide resin composition |
| 07/10/2003 | US20030130439 Hybrid materials employing PPE/polystyrene/curable epoxy mixtures |
| 07/10/2003 | US20030130438 Bifunctional phenylene ether oligomer, its derivatives its use and process for the production thereof |
| 07/10/2003 | US20030130423 Thermosetting component, oligomer or polymer with cage structure, adhesion promoter; for use as dielectric substrate material, etch stop, hardmask, or air bridge in microchips, wafer coating; polyadamantanes |
| 07/10/2003 | US20030130412 A polycyanurates comprising a cyanatephenyl group and a phenol group, and inorganic filler modified by a silicon compounds or a polysiloxanes; printed-wiring boards for wireless communications, electronics |
| 07/10/2003 | US20030130114 Method for the deposition of an electrocatalyst layer |
| 07/10/2003 | US20030130017 Printed circuit board including EMI reducing circuits, an information processing apparatus having the board and a method to select the circuits |
| 07/10/2003 | US20030129905 Methods and systems for selectively connecting and disconnecting conductors in a fabric |
| 07/10/2003 | US20030129863 Electronic package with thermally conductive standoff |
| 07/10/2003 | US20030129646 Monolithic structure formed from a plurality of green-sheet layers sintered together. |
| 07/10/2003 | US20030129536 Method of fabricating circuitized structures |
| 07/10/2003 | US20030129440 Method of metal layer formation and metal foil-based layered product |
| 07/10/2003 | US20030129383 Liquid thermosetting resin composition, printed wiring boards and process for their production |
| 07/10/2003 | US20030129379 Porous insulating film and its laminates |
| 07/10/2003 | US20030129371 Circuit board and method of producing the same |
| 07/10/2003 | US20030128907 Method of manufacturing optical waveguide and method of manufacturing OPTO-electric wiring board |
| 07/10/2003 | US20030128532 Printed circuit board, radio wave receiving converter, and antenna device |
| 07/10/2003 | US20030128531 Removable visual indication structure for a printed circuit board |
| 07/10/2003 | US20030128526 Multilayer ceramic electronic component and manufacturing method thereof |
| 07/10/2003 | US20030128522 Radio frequency module |
| 07/10/2003 | US20030128497 Dielectric structure |
| 07/10/2003 | US20030128496 Dielectric structure |
| 07/10/2003 | US20030128495 High power variable slide RF tuner |
| 07/10/2003 | US20030128085 Printed bandpass filter for a double conversion tuner |
| 07/10/2003 | US20030128084 Compact bandpass filter for double conversion tuner |
| 07/10/2003 | US20030128041 Apparatus to prevent damage to probe card |
| 07/10/2003 | US20030128020 Programmable power supply |
| 07/10/2003 | US20030128017 Voltage regulator with voltage droop compensation |
| 07/10/2003 | US20030127749 Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
| 07/10/2003 | US20030127746 Panel stacking of BGA devices to form three-dimensional modules |
| 07/10/2003 | US20030127745 Low capacitance wiring layout and method for making same |
| 07/10/2003 | US20030127729 Stacked semiconductor device structure |
| 07/10/2003 | US20030127728 Concurrent electrical signal wiring optimization for an electronic package |
| 07/10/2003 | US20030127721 Semiconductor device |
| 07/10/2003 | US20030127712 Semiconductor device |
| 07/10/2003 | US20030127445 Heater for heating waveguide and waveguide with heater |
| 07/10/2003 | US20030127249 Vents with signal image for signal return path |
| 07/10/2003 | US20030127245 Printed circuit board with wiring pattern formed thereon by screen printing and process for manufacturing the same |
| 07/10/2003 | US20030126834 Orienting and stacking parts |
| 07/10/2003 | DE20304703U1 Structure for carrying off heat in a circuit board has a heat-conductive base board with an insulating heat-conductive layer to support contact connection surfaces that never interconnect. |
| 07/10/2003 | DE10213879C1 Electronic component has semiconductor chips fitted into respective recesses in surface of electronic circuit board |
| 07/09/2003 | EP1326306A2 Connecting member for flat circuit member and method of connecting the connecting member and the flat circuit member |
| 07/09/2003 | EP1326275A2 Power electronic module |
| 07/09/2003 | EP1326137A1 Photosensitive insulating paste and thick-film multi-layer circuit substrate |
| 07/09/2003 | EP1326079A2 Probe card |
| 07/09/2003 | EP1325673A1 Printed circuit board and method for producing a printed circuit board of this type and for producing a laminar composite material for such a printed circuit board |
| 07/09/2003 | EP1325545A2 Electronic transformer/inductor devices and methods for making same |
| 07/09/2003 | EP1325533A1 Self-aligned transition between a transmission line and a module |
| 07/09/2003 | EP1325372A1 Printed circuit board with optical layers consisting of glass |
| 07/09/2003 | EP1268054A4 Electrocatalyst powders, methods for producing powders and devices fabricated from same |
| 07/09/2003 | EP1192841B1 Intelligent power module |
| 07/09/2003 | EP0957664B1 Resin-carrying metal foil for multilayered wiring board, process for manufacturing the same, multilayered wiring board, and electronic device |
| 07/09/2003 | CN1429470A Method for shielding at least upper part of radiocommunication module, and corresponding radiocommunication module |
| 07/09/2003 | CN1429407A Embedded capacitors for assembly |
| 07/09/2003 | CN1429251A Red phosphorus fire retardant for epoxy, red phosphorus fire retardant composition for epoxy, their mfg. method, epoxy composition for semiconductor sealing materials |
| 07/09/2003 | CN1429065A Method for making multi-layer circuit board with internal inserted passive component |
| 07/09/2003 | CN1429063A Multilayer printed wiring board and mfg. method, electronic equipment |
| 07/09/2003 | CN1429060A Printed wiring board, printed circuit board and electronic equipment |
| 07/09/2003 | CN1428927A Temp. compensating crystal oscillator and its mfg. method |
| 07/09/2003 | CN1428800A Semiconductor device package and its mfg. method, and semiconductor |
| 07/09/2003 | CN1428772A Pickup device and optical disk device using the same |
| 07/09/2003 | CN1114338C Method for mfg. printed circuit board heat sink and radiating fin |
| 07/09/2003 | CN1114253C Socket for pin grid array component |
| 07/09/2003 | CN1114251C 电缆组件 Cable Assemblies |
| 07/09/2003 | CN1113980C High fatigue ductility electrodeposited copper foil |
| 07/08/2003 | US6590788 Intrinsically safe universal switching power supply |
| 07/08/2003 | US6590782 Telecommunications chassis and card |
| 07/08/2003 | US6590781 Clock routing in multiple channel modules and bus systems |
| 07/08/2003 | US6590780 Operating mechanism |
| 07/08/2003 | US6590629 Liquid crystal display having a plurality of mounting substrates with common connection lines connecting the mounting substrates |
| 07/08/2003 | US6590491 Structure for composite materials of positive temperature coefficient thermistor devices and method of making the same |
| 07/08/2003 | US6590478 Short coaxial transmission line and method for use thereof |
| 07/08/2003 | US6590466 Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time of differential transmission lines |
| 07/08/2003 | US6590314 Piezoelectric resonator container, piezoelectric resonator using the same, circuit board mounting piezoelectric resonator thereon, and method for manufacturing piezoelectric resonator |
| 07/08/2003 | US6590291 Semiconductor device and manufacturing method therefor |
| 07/08/2003 | US6590287 Packaging method and packaging structures of semiconductor devices |
| 07/08/2003 | US6590286 Land grid array semiconductor device |
| 07/08/2003 | US6590165 Printed wiring board having throughole and annular lands |
| 07/08/2003 | US6589870 Inter-layer connection structure, multilayer printed circuit board and production processes therefor |