| Patents for H05K 1 - Printed circuits (98,583) |
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| 07/08/2003 | US6589663 Aromatic polyamide film |
| 07/08/2003 | US6589662 Polyimide membrane formed on at one surface of polyester or polyphenylene sulfide substrate; diamines component includes one of 3,5- diaminobenzoic acid and a diaminosiloxane derivative |
| 07/08/2003 | US6589656 Epoxy resin composition, prepreg and metal-clad laminate |
| 07/08/2003 | US6589639 Hole fill composition and method for filling holes in a substrate |
| 07/08/2003 | US6589594 Method for filling a wafer through-via with a conductive material |
| 07/08/2003 | US6589459 Method of forming conductive circuits |
| 07/08/2003 | US6589413 Method of making a copper on INVAR® composite |
| 07/08/2003 | US6589385 Resist mask for measuring the accuracy of overlaid layers |
| 07/08/2003 | US6589061 Printed circuit board for straddle mount electrical connector and method for pasting the same |
| 07/08/2003 | US6588097 Method of manufacturing multilayered ceramic substrate and green ceramic laminate |
| 07/08/2003 | US6588095 for processing an exposed conductive connection between an thermal inkjet head and a flexible tape circuit connectable to control signals for driving the inkjet device; plated with a polymer to protect it against corrosive damage |
| 07/08/2003 | CA2287707C Surface treatment of copper to prevent microcracking in flexible circuits |
| 07/08/2003 | CA2105681C Low noise optical probe |
| 07/07/2003 | CA2415979A1 Interconnection system |
| 07/07/2003 | CA2415810A1 Method of schematic-level ams topology optimization using direct representations |
| 07/03/2003 | WO2003055289A1 Housing system for an electric device |
| 07/03/2003 | WO2003055288A1 Method for making a multilayer module with high-density printed circuits |
| 07/03/2003 | WO2003055203A1 Apparatus and method for sharing signal control lines |
| 07/03/2003 | WO2003054959A2 Circuit arrangement comprising electronic components on a nonconducting supporting substrate |
| 07/03/2003 | WO2003054053A1 New 3,4-alkylenedioxythiophene compounds and polymers thereof |
| 07/03/2003 | WO2003028099A3 Arrangement of vias in a substrate to support a ball grid array |
| 07/03/2003 | WO2003023787B1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof |
| 07/03/2003 | WO2002028711A8 Dual mode light source for aircraft external lighting |
| 07/03/2003 | US20030126356 Memory system having synchronous-link DRAM (SLDRAM) devices and controller |
| 07/03/2003 | US20030124913 Electric circuit unit |
| 07/03/2003 | US20030124461 Finely divided particles of inorganic material comprising conductive particles selected from RuO2, ruthenium- based polynary oxides or mixtures thereof; inorganic binder having a glass transition temperature in the range of from 325 to 600 |
| 07/03/2003 | US20030124326 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
| 07/03/2003 | US20030124318 Phase change materials impregnating one or more of the regions surrounded by barrier layers to hinder migration |
| 07/03/2003 | US20030124260 Printing a conductive organic material, such as polyethylenedioxythiophene, on the substrate; and curing to form the metal pattern on the substrate |
| 07/03/2003 | US20030124259 Precursor compositions for the deposition of electrically conductive features |
| 07/03/2003 | US20030123864 Recyclable camera and method for assembling same |
| 07/03/2003 | US20030123818 Optical transceiver, connector, substrate unit, optical transmitter, optical receiver, and semiconductor device |
| 07/03/2003 | US20030123374 Pickup device and disk drive |
| 07/03/2003 | US20030123238 Enhanced PCB and stacked substrate structure |
| 07/03/2003 | US20030123236 High speed differential signal edge card connector and circuit board layouts therefor |
| 07/03/2003 | US20030123234 Printed wiring board having pads to solder circuit component, circuit module having the printed wiring board, and electronic apparatus equipped with the circuit module |
| 07/03/2003 | US20030123189 Magnetic head comprising slider and flexure bonded with conductive resin |
| 07/03/2003 | US20030122897 Structure of a flexible printed circuit for inkjet printheads and the manufacturing process therefor |
| 07/03/2003 | US20030122575 Circuit board configured to provide multiple interfaces |
| 07/03/2003 | US20030122573 Technique to reduce reflections and ringing on CMOS interconnections |
| 07/03/2003 | US20030122570 Method to prevent damage to probe card |
| 07/03/2003 | US20030122564 Apparatus to prevent damage to probe card |
| 07/03/2003 | US20030122452 Temperature compensated crystal oscillator and method of manufacturing the same |
| 07/03/2003 | US20030122263 Flip-chip opto-electronic circuit |
| 07/03/2003 | US20030122254 Device and method for including passive components in a chip scale package |
| 07/03/2003 | US20030122250 Thin high-frequency module having integrated circuit chip with little breakage |
| 07/03/2003 | US20030122240 Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
| 07/03/2003 | US20030122231 Chip package and method of manufacturing the same |
| 07/03/2003 | US20030122213 Semiconductor packaging substrate and method of producing the same |
| 07/03/2003 | US20030122173 Package for a non-volatile memory device including integrated passive devices and method for making the same |
| 07/03/2003 | US20030121953 Self-adhesive flexible repair circuit |
| 07/03/2003 | US20030121883 Resistive materials |
| 07/03/2003 | US20030121700 Method for fabricating electrical connecting element, and electrical connecting element |
| 07/03/2003 | US20030121699 Multi-layered printed wiring board having via holes, circuit module comprising circuit elements mounted on the multi-layered printed wiring board, and method of manufacturing the multi-layered printed wiring board |
| 07/03/2003 | US20030121698 Semiconductor device and printed wiring board having electrode pads |
| 07/03/2003 | US20030121697 Copper alloy foil |
| 07/03/2003 | US20030121146 Method for fabricating electrical connecting elements, and connecting element |
| 07/02/2003 | EP1324390A2 A high-frequency module |
| 07/02/2003 | EP1324111A1 Recyclable camera having cooperating circuit boards |
| 07/02/2003 | EP1323793A1 Metallic nanoparticle cluster ink and method for forming metal pattern using the same |
| 07/02/2003 | EP1323682A2 Dielectric material and dielectric sintered body, and wiring board |
| 07/02/2003 | EP1323589A1 Heating or cooling device for a vehicle with flexible flat cable |
| 07/02/2003 | EP1323189A2 Electronic device manufacture |
| 07/02/2003 | EP1323015A1 Security module |
| 07/02/2003 | EP1147070A4 Electrically conductive ceramics |
| 07/02/2003 | EP1011973B1 Viewing and imaging systems |
| 07/02/2003 | CN2559182Y Improvement on stack structure of multi-layer circuit boards |
| 07/02/2003 | CN2559181Y 印刷电路板 A printed circuit board |
| 07/02/2003 | CN1428069A Double-sided wiring board and its mfg. method |
| 07/02/2003 | CN1428068A Circuit card assembly having controlled vibrational properties |
| 07/02/2003 | CN1428067A Circuit card assembly having controlled expansion properties |
| 07/02/2003 | CN1428006A Electronic module having 3-D array of carrier-mounted IC packages |
| 07/02/2003 | CN1427663A Heat transfer substrate and method for mfg. same |
| 07/02/2003 | CN1427662A Flexible distributing board |
| 07/02/2003 | CN1427661A Manufacturing method of printed circuit board having stepped high density interconnection structure |
| 07/02/2003 | CN1427660A Test seat interface circuit board |
| 07/02/2003 | CN1427469A Manufacturing method of electroplated nickel/gold chip package base plate electric contact pad and its structure |
| 07/02/2003 | CN1427053A Laminate for PC board and process for preparing resin paint for mfg. laminate |
| 07/02/2003 | CN1427039A Laminate for PC board and resin composition for mfg. same |
| 07/02/2003 | CN1427038A Aqueous polyaminoresin composition |
| 07/02/2003 | CN1427034A Laminate for printed circuit board and resin composition for producing same |
| 07/02/2003 | CN1113587C 印刷电路板 A printed circuit board |
| 07/02/2003 | CN1113586C Conductive elastomer for grafting to elastic substrate |
| 07/02/2003 | CN1113585C Printed circuit board and mfg. method thereof |
| 07/02/2003 | CN1113584C Printed circuit board device |
| 07/02/2003 | CN1113119C Nonwoven fabric made of glass fibre and printed wiring boards |
| 07/02/2003 | CN1113111C Copper foil for printed wiring board, its producing method and electrolytic device |
| 07/01/2003 | US6587907 System and method for generating a clock delay within an interconnect cable assembly |
| 07/01/2003 | US6587580 Stencil printing process optimization for circuit pack assembly using neural network modeling |
| 07/01/2003 | US6587351 Surface mount standoff for printed circuit board assembly |
| 07/01/2003 | US6587346 Combination electrical power distribution and heat dissipating device |
| 07/01/2003 | US6587310 Magnetic head suspension with single layer preshaped trace interconnect |
| 07/01/2003 | US6587177 Connection structure of display device with a plurality of IC chips mounted thereon and wiring board |
| 07/01/2003 | US6587166 Liquid crystal display module and an assembly method therefor |
| 07/01/2003 | US6587164 Active matrix type liquid crystal display device having chromium alloy connecting portions which are other than the material of the data line or gate line |
| 07/01/2003 | US6587026 Embedded transformer |
| 07/01/2003 | US6586827 Wiring board and method for fabricating the same |
| 07/01/2003 | US6586826 Integrated circuit package having posts for connection to other packages and substrates |
| 07/01/2003 | US6586783 Substrate for an electronic power circuit, and an electronic power module using such a substrate |
| 07/01/2003 | US6586703 Laser machining method, laser machining apparatus, and its control method |