Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
07/2003
07/23/2003CN1431667A Mfg. method of laminated ceramic electronic parts
07/23/2003CN1115740C Microwave oscilator and its mfg. method
07/23/2003CN1115654C Resonant tag and method and appts. of mfg. same
07/23/2003CN1115502C Power supply device of electromagnetic valve
07/23/2003CA2417025A1 Switch assembly employing an external customizing printed circuit board
07/22/2003US6598208 Design and assisting system and method using electromagnetic position
07/22/2003US6598109 Method and apparatus for connecting between standard mini PCI component and non-standard mini PCI component based on selected signal lines and signal pins
07/22/2003US6597757 Marking apparatus used in a process for producing multi-layered printed circuit board
07/22/2003US6597585 Power semiconductor module
07/22/2003US6597583 Multilayer circuit board having a capacitor and process for manufacturing same
07/22/2003US6597580 Flexible shielded circuit board interface
07/22/2003US6597578 Electrical connection box
07/22/2003US6597444 Determination of flux coverage
07/22/2003US6597277 Termination resistor in printed circuit board
07/22/2003US6597258 High performance diplexer and method
07/22/2003US6597189 Socketless/boardless test interposer card
07/22/2003US6597062 Short channel, memory module with stacked printed circuit boards
07/22/2003US6597061 Card manufacturing technique and resulting card
07/22/2003US6597056 Laminated chip component and manufacturing method
07/22/2003US6596968 Method of producing through-hole in aromatic polyimide film
07/22/2003US6596948 Processor and power supply circuit
07/22/2003US6596947 Low melting metal coating; pressing, heating, and softening films to adhere; connecting with ultrasonic wave
07/22/2003US6596937 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
07/22/2003US6596634 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
07/22/2003US6596620 BGA substrate via structure
07/22/2003US6596467 Integrated circuits of low dielectric material prepared using removable pore forming material
07/22/2003US6596405 Antireflective porogens
07/22/2003US6596391 Very ultra thin conductor layers for printed wiring boards
07/22/2003US6596384 Selectively roughening conductors for high frequency printed wiring boards
07/22/2003US6596382 Multilayered board and method for fabricating the same
07/22/2003US6596200 Electronic material composition, electronic parts and use of electronic material composition
07/22/2003US6596184 Non-homogeneous laminate materials for suspensions with conductor support blocks
07/22/2003US6595796 Flexible film circuit connector
07/22/2003US6595786 Electrical connecting structure of mounted part, computer apparatus, and electronic equipment
07/22/2003US6595784 Interposer member having apertures for relieving stress and increasing contact compliancy
07/22/2003US6594893 Method of making surface laminar circuit board
07/22/2003US6594892 Process for the production of composite ceramic printed wiring board
07/22/2003US6594891 Process for forming multi-layer electronic structures
07/18/2003CA2415934A1 Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other
07/17/2003WO2003059027A1 System for producing electrical and integrated circuits
07/17/2003WO2003059026A1 System for the manufacture of electric and integrated circuits
07/17/2003WO2003058752A1 Grouped element transmission channel link with power delivery aspects
07/17/2003WO2003058751A1 Grouped element transmission channel link termination assemblies
07/17/2003WO2003058750A1 Grouped element transmission channel link
07/17/2003WO2003058719A1 Monolithic interconnection interface for the stacking of electronic components and the production method thereof
07/17/2003WO2003058717A2 Package for a non-volatile memory device including integrated passive devices and method for making the same
07/17/2003WO2003058712A2 Method for assigning power and ground pins in array packages to enhance next level routing
07/17/2003WO2003058677A2 System for the production of electric and integrated circuits
07/17/2003WO2003058656A2 High power variable slide rf tuner
07/17/2003WO2003058369A2 Voltage regulator with voltage droop compensation
07/17/2003WO2003058326A2 Flip-chip mounted opto-electronic circuit
07/17/2003WO2003057749A1 Organic compositions
07/17/2003WO2003057474A1 Thermal barriers with reversible enhanced thermal properties
07/17/2003WO2002050949A9 Integrated dual function circuitry and antenna system
07/17/2003US20030134528 Method of mounting terminal and terminal mounting structure
07/17/2003US20030134450 Elimination of RDL using tape base flip chip on flex for die stacking
07/17/2003US20030133302 Led lamp apparatus
07/17/2003US20030133280 Electronic equipment having two circuit boards overlapping only partly
07/17/2003US20030133279 High-frequency wiring board
07/17/2003US20030133277 Multilayer printed wiring board and method of manufacturing the same
07/17/2003US20030133276 Arrangements to improve noise immunity of differential signals
07/17/2003US20030133275 Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board
07/17/2003US20030133273 Mounting structure of fuse connection terminals on board
07/17/2003US20030133249 Electronic component and method for manufacturing the same
07/17/2003US20030133246 Primary/secondary wireless protector
07/17/2003US20030132668 Programmable power supply to simultaneously power a plurality of electronic devices
07/17/2003US20030132544 Method for manufacturing electronic component and apparatus for manufacturing the same
07/17/2003US20030132273 Reflowing of solder joints
07/17/2003US20030132192 Flexible printed wiring board
07/17/2003US20030132026 Pad structure of semiconductor package
07/17/2003US20030132025 Printed circuit boards and method of producing the same
07/17/2003US20030131632 Glass fiber nonwoven fabric and printed wiring board
07/17/2003US20030131471 Manufacturing process of IC module
07/17/2003DE10158416C1 Multi-Kugelschalter-Anordnung in Schicht-/Plattenbauweise Multi-ball switch arrangement in stratum / bricks
07/17/2003CA2443846A1 Organic compositions
07/16/2003EP1328142A2 Circuit arrangement
07/16/2003EP1328141A2 Conductor from flexible material, assembly having such a flexible conductor and method for manufacturing such a conductor
07/16/2003EP1328140A2 Conductor from flexible material, assembly having such a flexible conductor and method for manufacturing such a conductor
07/16/2003EP1328043A1 A connector pin for an edge of a circuit board
07/16/2003EP1328039A2 Printed bandpass filter for a double conversion tuner
07/16/2003EP1327995A2 Resistor structure
07/16/2003EP1327928A1 Connector receptacle
07/16/2003EP1327653A1 Heat-resistant resin precursor, heat-resistant resin and insulating film and semiconductor device
07/16/2003EP1327517A2 Method of metal layer formation and metal foil-based layered product
07/16/2003EP1327515A1 Polyimide - metal foil wiring boards for high frequency use
07/16/2003EP1327265A2 Electronic module having canopy-type carriers
07/16/2003EP1327124A1 Ceramic resistor card assembly for fuel sensor
07/16/2003EP1326680A1 Implantable medical device employing integral housing for a formable flat battery
07/16/2003EP1188212A4 A multi-functional energy conditioner
07/16/2003EP1129520B1 Bus through termination circuit
07/16/2003CN1430811A Isolating energy conditioning shield assembly
07/16/2003CN1430463A Circuit board and its manufacturing method
07/16/2003CN1430276A Thin high-frequency module of less damaged IC chip
07/16/2003CN1430206A Magnetic head for conducting slider and bracket by conductivity resin
07/16/2003CN1115082C 电路部件和电路板 Circuit component and the circuit board
07/16/2003CN1115081C Printed circuit board for electrical apparatus with HF components, particularly for mobile radio communications equipment
07/16/2003CN1114664C Structure and its manufacturing method
07/15/2003US6594811 Routable high-density interfaces for integrated circuit devices
07/15/2003US6594556 Upgradeable voltage regulator modules
07/15/2003US6594153 Circuit package for electronic systems
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