Patents for H05K 1 - Printed circuits (98,583)
07/2003
07/29/2003US6600642 Method and apparatus for lightning suppression in a telecommunication printed circuit board
07/29/2003US6600404 Planar coil and planar transformer, and process of fabricating a high-aspect conductive device
07/29/2003US6600395 Embedded shielded stripline (ESS) structure using air channels within the ESS structure
07/29/2003US6600385 Front end module for mobile communications apparatus
07/29/2003US6600335 Method for ball grid array chip packages having improved testing and stacking characteristics
07/29/2003US6600222 Stacked microelectronic packages
07/29/2003US6600220 Power distribution in multi-chip modules
07/29/2003US6600101 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
07/29/2003US6599951 Antireflective porogens
07/29/2003US6599822 Methods of fabricating semiconductor substrate-based BGA interconnection
07/29/2003US6599681 Electromagnetic filter for display screens
07/29/2003US6599675 Useful for application of photoresist, as an insulation film; heat resistance, mechanical properties and adhesion property
07/29/2003US6599637 Power module; mechanical and thermal shock cracking resis-tance; excellent heat radiation property and heat cycle resistance
07/29/2003US6599619 Crosslinked polymer containg terminally unsaturated urethane, styrene, and brominated styrene monomers; flame retardant; low cost; printed circuit boards
07/29/2003US6599617 Adhesion strength between conductive paste and lands of printed wiring board, and manufacturing method thereof
07/29/2003US6599583 Applying ink containing magnetic particles to walls of hole and subjecting to energy field
07/29/2003US6599562 Rigid-printed wiring board and production method of the rigid-printed wiring board
07/29/2003US6599561 Impregnating woven fabric with resin and curing; inexpensive; mechanical stability
07/29/2003US6599444 Luminescent gel coats and moldable resins
07/29/2003US6599408 Thick film conductor composition for use in biosensors
07/29/2003US6599135 Vehicle power distributor and method of connecting control circuit board to vehicle power distributor
07/29/2003US6599134 Transverse backplane
07/29/2003US6599031 Optical/electrical interconnects and package for high speed signaling
07/29/2003US6598780 Method of connecting circuit boards
07/29/2003US6598291 Via connector and method of making same
07/29/2003CA2196379C Battery charger
07/24/2003WO2003061029A2 Organic compositions
07/24/2003WO2003060997A1 Circuit board, semiconductor device using that circuit board, and electronic device using that circuit board
07/24/2003WO2003060960A2 High density area array solder microjoining interconnect structure and fabrication method
07/24/2003WO2003059995A1 Biaxially oriented thermoplastic resin film
07/24/2003WO2003059984A1 Organic compositions
07/24/2003WO2003021672A3 An electronic package having a thermal stretching layer
07/24/2003WO2002099848A3 Formation of printed circuit board structures using piezo microdeposition
07/24/2003WO2002096124A3 Telecommunications chassis and card
07/24/2003US20030140184 Memory unit, a method of assembling a memory unit, a method of reconfiguring a system, and a memory device
07/24/2003US20030139513 Method for fabricating polybenzoxazole/clay nanocomposite materials
07/24/2003US20030139079 Printed circuit board and connector assembly
07/24/2003US20030139073 Portable electronic apparatus having external connector fixed at internal circuit board
07/24/2003US20030139072 Portable electronic apparatus having external connector fixed at internal circuit board
07/24/2003US20030139071 Thermally enhanced interposer and method
07/24/2003US20030139070 Surface mounted device type package using coaxial cable
07/24/2003US20030138992 Multilayered circuit substrate, semiconductor device and method of producing same
07/24/2003US20030138989 Opto-electric mounting apparatus
07/24/2003US20030138632 Heat-absorbing particle
07/24/2003US20030138568 A micro-capsulated dyed-heat absorbing material as pigment is added into a solvent and is coated onto the surface of heat dissipation article
07/24/2003US20030138553 Circuit board producing method and circuit board producing device
07/24/2003US20030137862 Reversed memory module socket, motherboard and test system including same, and method of modifying motherboard
07/24/2003US20030137860 Memory module with integrated bus termination
07/24/2003US20030137839 Lamp on sheet and manufacturing method thereof
07/24/2003US20030137817 Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other
07/24/2003US20030137814 Electrical noise protection
07/24/2003US20030137813 Circuit-constituting unit and method of producing the same
07/24/2003US20030137809 Module and surface-mounted module
07/24/2003US20030137808 Electronic module having canopy-type carriers
07/24/2003US20030137608 Tuner integrated circuit and television tuner using the same circuit
07/24/2003US20030137477 Glass substrate printed wiring board printhead for electric paper
07/24/2003US20030137080 Flip chip underfill system and method
07/24/2003US20030137059 High density 3-D integrated circuit package
07/24/2003US20030137058 High density area array solder microjoining interconnect structure and fabrication method
07/24/2003US20030137056 Circuit substrate and method for fabricating the same
07/24/2003US20030137048 Stacking system and method
07/24/2003US20030137046 Semiconductor device, method of fabricating the same, and printing mask
07/24/2003US20030137045 Circuit component built-in module and method of manufacturing the same
07/24/2003US20030137041 Vertically stacked memory chips in FBGA packages
07/24/2003US20030137035 For ball grid arrays; cleanliness is determined by color variation; improved adhesion of bonding wires and encapsulants
07/24/2003US20030136947 Having powdered silver and reinforcing agent of Mohs hardness 3.5 to 4.5 contained in binder resin; hardness, wear resistance
07/24/2003US20030136814 High density raised stud microjoining system and methods of fabricating the same
07/24/2003US20030136656 Switch assembly employing an external customizing printed circuit board
07/24/2003US20030136582 Substrate board structure
07/24/2003US20030136581 Apparatus and method for repairing electronic packages
07/24/2003US20030136580 Plane splits filled with lossy materials
07/24/2003US20030136579 Electronic assembly and a method of constructing an electronic assembly
07/24/2003US20030136578 Flexible wiring boards for double-side connection
07/24/2003US20030136577 Circuit board and method for fabricating the same, and electronic device
07/24/2003US20030136576 Printed circuit support having integrated connections and process for manufacturing such a support
07/24/2003US20030136503 RFID label technique
07/24/2003US20030135998 Plastic deformable substrate using embossing tool; forming recesses, electroconductive strips
07/24/2003US20030135997 Conductive material and method for filling via-hole
07/24/2003US20030135994 Printed circuit board and manufacturing method therefor
07/24/2003DE10152128C1 Electrical connection device for spaced electrode regions has contact pins projecting from bridge-shaped conductor structure
07/23/2003EP1330149A1 Circuit board unit and electronic equipment
07/23/2003EP1330148A2 Electrical apparatus
07/23/2003EP1330145A2 Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other
07/23/2003EP1330030A1 Integrated tuner circuit
07/23/2003EP1329990A1 Method of mounting terminal and terminal mounting structure
07/23/2003EP1329925A2 Mounting structure of fuse connection terminals on board
07/23/2003EP1329488A1 Ink-jet ink and process for producing the same
07/23/2003EP1329144A1 Module support for electrical/electronic components
07/23/2003EP1329143A2 Carrier-based electronic module
07/23/2003EP1329142A2 Manufacturing fire retardant circuit boards without the use of fire retardant resin additives
07/23/2003EP1328982A2 Device enclosures and devices with integrated battery
07/23/2003EP1328373A2 Method and materials for printing particle-enhanced electrical contacts
07/23/2003EP1268643A4 Screen printable flame retardant coating
07/23/2003EP1177614B1 Modular power supply for generating a high voltage dc output
07/23/2003EP0644227B1 Solid surface modifying method and apparatus
07/23/2003CN1432211A Appts. and method for reducing electromigration
07/23/2003CN1432195A Semiconductor component comprising surface metallization
07/23/2003CN1432182A Method for producing tag or chip card device for implementing said method and tag or chip carp produced according to said method
07/23/2003CN1431858A Printed circuit board with built-in passive device, its mfg. method and used substrate
07/23/2003CN1431857A Printed circuit board, radio wave receiving converter and antenna device