Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
08/2003
08/05/2003US6603323 Closed-grid bus architecture for wafer interconnect structure
08/05/2003US6603319 Water immersion detecting circuit
08/05/2003US6603210 Semiconductor module and producing method therefor
08/05/2003US6603202 Circuit board-providing article, circuit board, semiconductor device and process for the production of the same
08/05/2003US6603201 Electronic substrate
08/05/2003US6603182 Packaging micromechanical devices
08/05/2003US6603080 Circuit board having ferrite powder containing layer
08/05/2003US6603079 Printed circuit board electrical interconnects
08/05/2003US6603077 Cable connection structure and electronic apparatus having the same
08/05/2003US6603071 Flexible printed circuit board, integrated circuit chip mounting flexible printed circuit board, display apparatus incorporating, integrated circuit chip mounted structure, and bonding method of integrated circuit chip mounting flexible printed circuit board
08/05/2003US6602946 Photosensitive insulating paste and thick film multi-layer circuit substrate
08/05/2003US6602804 Dielectric, polymer blend
08/05/2003US6602739 Method for making multichip module substrates by encapsulating electrical conductors and filling gaps
08/05/2003US6602730 Method for gravitation-assisted control of spread of viscous material applied to a substrate
08/05/2003US6602623 Strontium, magnesium, silicon, aluminum, boron and alkali metal oxide; degreasing; low dielectric constant and loss; high thermal expansion
08/05/2003US6602616 Multilayer; layers of varrious dielectric
08/05/2003US6602584 Multilayer; electroconductive plate, dielectric and metal hydroxide adhesive
08/05/2003US6602446 Electrically conductive filler and a heating element adapted to generate heat on electromagnetic induction compounded with resin
08/05/2003US6602370 Method of manufacturing ceramic electronic components
08/05/2003US6602362 Copper-alloy foil to be used for suspension member of hard-disc drive
08/05/2003US6602097 High frequency electrical connector
08/05/2003US6602078 Electrical interconnect having a multi-layer circuit board structure and including a conductive spacer for impedance matching
08/05/2003US6601963 FPC for mounting components and spread illuminating apparatus using the same
08/05/2003US6601768 Imaging module for optical reader comprising refractive diffuser
08/05/2003US6601754 Method of connecting circuit boards
08/05/2003US6601296 Metal conductors supported and mechanically interlocked with substrate
08/05/2003US6601292 Method for the connection and repair of flex and other circuits
08/05/2003CA2305854C Transmission line, resonator, filter, duplexer, and communication apparatus
07/2003
07/31/2003WO2003063571A1 High-precision laminated electronic component support device
07/31/2003WO2003063568A1 Thermally enhanced interposer and method
07/31/2003WO2003063563A1 Circuit board and electronic device
07/31/2003WO2003063561A1 Printed-circuit board, electronic part having shield structure, and radio communication apparatus
07/31/2003WO2003063238A1 High-frequency module and its manufacturing method
07/31/2003WO2003063237A1 Substrate for high-frequency module and high-frequency module
07/31/2003WO2003062876A2 Electric-optical circuit carrier and method for the production thereof
07/31/2003WO2003062866A2 Flex board interface to an optical module
07/31/2003WO2003062311A2 Material for the production of functional elements comprising at least one foamable area and use of said functional elements for positioning and mounting objects
07/31/2003WO2003041166A3 Substrate design and process for reducing electromagnetic emission
07/31/2003WO2003038896A3 Ball grid array with x-ray alignment mark
07/31/2003WO2003025976A3 Embedded inductor for semiconductor device circuit
07/31/2003WO2002099490A3 Housing and mounting structure for optical connectors
07/31/2003US20030144430 Printed circuits; high density; heat and solvent resistance
07/31/2003US20030144134 Method for the fabrication of an electrocatalyst layer
07/31/2003US20030143971 Radio transmitting/receiving device
07/31/2003US20030143873 Connector with movable contact elements
07/31/2003US20030143871 Electronic device in which a circuit board and an electric connector are electrically connected by a flexible printed wiring board
07/31/2003US20030143766 Flat panel display module and method of manufacturing the same
07/31/2003US20030143486 Photoreactive resin composition and Method of manufacturing circuit board and ceramic multilayer substrate using the resin composition
07/31/2003US20030142929 Flex board interface to an optical module
07/31/2003US20030142483 Switching device and a method for the configuration thereof
07/31/2003US20030142460 Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board
07/31/2003US20030141942 Dielectric loss compensation methods and apparatus
07/31/2003US20030141885 Interposer and methods for fabricating same
07/31/2003US20030141600 Apparatus and method of manufacturing printed circuit boards
07/31/2003US20030141596 Wiring board, semiconductor device, and method of manufacturing wiring board
07/31/2003US20030141589 Encapsulated high-frequency electrical circuit
07/31/2003US20030141585 Efficiency
07/31/2003US20030141580 Electronic card
07/31/2003US20030141488 Conductive via composition
07/31/2003US20030141348 Method of manufacturing a joint between metal and a ceramic substrate for a high temperature sensor
07/31/2003US20030141107 Apparatus and method for routing electrical signals
07/31/2003US20030141105 Circuit component built-in module, radio device having the same, and method for producing the same
07/31/2003US20030141104 Electronic printed-circuit board for electronic devices, especially communications terminals
07/31/2003US20030141103 PCB solder pad geometry including patterns improving solder coverage
07/31/2003US20030141007 Apparatus and method for manufacturing ceramic laminate
07/31/2003US20030141006 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board
07/31/2003US20030140490 Multi-layer circuit assembly and process for preparing the same
07/31/2003US20030140489 Semiconductor module and producing method therefor
07/30/2003EP1331695A2 Electronic component
07/30/2003EP1331687A1 Composite high frequency apparatus
07/30/2003EP1331681A2 Arrangement of electrochemical cells and circuit board
07/30/2003EP1331622A1 Display module
07/30/2003EP1331602A2 Hybrid card with antenna and manufacturing equipment
07/30/2003EP1330947A1 Electronic device for a motor vehicle
07/30/2003EP1330883A1 Electronic device
07/30/2003EP1330670A1 Position fixing in printed circuit boards
07/30/2003EP1175712B1 Printed circuit board connector
07/30/2003EP1151485B1 Arrangement of electrochemical cells and circuit board
07/30/2003EP0844899B1 Hermetically sealed electrical feedthrough for use with implantable electronic devices
07/30/2003CN2563885Y Wiring improving structure for circuit board test wire
07/30/2003CN2563884Y Design structure of signal transmission line in high frequency circuit board
07/30/2003CN1433662A Electromechanical transducer
07/30/2003CN1433575A Method and apparatus for encoding information in IC package
07/30/2003CN1433436A Glyoxal-phenolic condensates with enhanced fluorescence
07/30/2003CN1433256A Printed circuit board and its making process
07/30/2003CN1433254A Electric connection system for two printed circuit boards in some angle
07/30/2003CN1433110A Wiring pin for use in edge of circuit board
07/30/2003CN1433070A Chip package and its making process
07/30/2003CN1433002A 软性印刷电路板 Flexible printed circuit board
07/30/2003CN1432661A Metal layer forming process and laminated metal foil-based product
07/30/2003CN1432468A Metal foil-base laminated product and its production process
07/30/2003CN1116790C Printed circuit board and electronic element assembly and manufacture thereof
07/30/2003CN1116789C Copper foil for printed circuit board and its manufacture, and stacked body and printed circuit board using the copper foil
07/30/2003CN1116697C Film carrier, its manufacture and mask used for the method
07/30/2003CN1116621C Liquid-crystal display panel and method of inspecting liquid-crystal display panel
07/29/2003US6601007 Method and system to increase the performance of high-speed backplanes
07/29/2003US6600879 Camera with electronic flash device
07/29/2003US6600790 Gap-coupling bus system
07/29/2003US6600658 Electrical junction box
07/29/2003US6600645 Dielectric composite materials and method for preparing
1 ... 632 633 634 635 636 637 638 639 640 641 642 643 644 645 646 647 648 649 650 651 652 ... 986