Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
08/2003
08/12/2003US6606402 System and method for in-line inspection of stencil aperture blockage
08/12/2003US6606252 Fastener detection for encased electrical assembly
08/12/2003US6606249 Connection structure for display module and printed substrate, semiconductor device, display module, and electronic component
08/12/2003US6606247 Multi-feature-size electronic structures
08/12/2003US6606237 Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same
08/12/2003US6606014 Filter structures for integrated circuit interfaces
08/12/2003US6606012 Wideband bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure
08/12/2003US6606011 Energy conditioning circuit assembly
08/12/2003US6605958 Precision on-chip transmission line termination
08/12/2003US6605868 Insulating substrate including multilevel insulative ceramic layers joined with an intermediate layer
08/12/2003US6605780 Connection box
08/12/2003US6605778 Circuit carrier, in particular printed circuit board
08/12/2003US6605551 Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance
08/12/2003US6605369 Printed wiring boards; anticorrosion zinc or zinc alloy layer on foil and an electrodeposited chromate layer on the zinc layer and a silane coupling agent-adsorbed layer on chromate layer; drying conditions after coupling treatment; adhesion
08/12/2003US6605366 Metal film/aromatic polymide film laminate
08/12/2003US6605354 High nitrogen containing triazine-phenol-aldehyde condensate
08/12/2003US6605324 Liquid crystal resin laminated film, method for manufacturing the same, and circuit board comprising liquid crystal resin laminated film
08/12/2003US6604970 Methods for producing electron source, image-forming apparatus, and wiring substrate having a stack of insulating layers; and electron source, image-forming apparatus, and wiring substrate produced using the methods
08/12/2003US6604952 Printed circuit board connector
08/12/2003US6604948 Double-double (2×2) tester paddle board AKA 2×2 paddle board
08/12/2003US6604815 Ink jet recording apparatus utilizing printhead cartridges with asymmetrical contacts
08/07/2003WO2003065779A1 Method for embedding a component in a base
08/07/2003WO2003065778A1 Method for embedding a component in a base and forming a contact
08/07/2003WO2003065777A1 Control device
08/07/2003WO2003065580A1 Television tuner and printed circuit board used therein
08/07/2003WO2003065510A1 Apparatus and method of manufacturing printed circuit boards
08/07/2003WO2003065469A2 Power module
08/07/2003WO2003065449A2 Power semiconductor, and method for producing the same
08/07/2003WO2003065446A1 Multi-layer ceramic substrate, and method and device for producing the same
08/07/2003WO2003065412A2 Dielectric loss compensation methods and apparatus
08/07/2003WO2003064985A1 Infrared apparatus
08/07/2003WO2003064506A1 High adhesive liquid crystalline polymer film
08/07/2003WO2003064495A2 Planarized microelectronic substrates
08/07/2003WO2002059411A3 Non-woven sheet of aramid floc
08/07/2003US20030149942 Voltage reference circuit layout inside multi-layered substrate
08/07/2003US20030149222 Polyimide resin produced by reacting a prepolymer with an isocyanate group at the end obtained by reacting a polyisocyanate compound with a polyol compound having a linear hydrocarbon structure with an anhydride
08/07/2003US20030148872 Dielectric ceramic composition and method for designing dielectric ceramic composition
08/07/2003US20030148739 High-frequency module device
08/07/2003US20030148662 Terminal structure of high frequency signal transmitting part
08/07/2003US20030148653 Power electronics unit
08/07/2003US20030148138 First step of preparing a lower layer paste with the use of a first mixture comprising nickel, tungsten and molybdenum, applying the lower layer paste to a surface of a ceramic base which is a sintered ceramic, and drying the resultant coating
08/07/2003US20030148136 Surface treated copper foil, electrodeposited copper foil with carrier, manufacture method for the electrodeposited copper foil with carrier, and copper clad laminate
08/07/2003US20030148112 Layered product which can eliminate the problems caused by etchant infiltration, can be produced easily, and is sufficiently effective in reducing the permittivity of the whole insulating layer; and a process for producing the same
08/07/2003US20030148109 Novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance. Printed circuits
08/07/2003US20030148107 Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board, prepreg, copper-clad laminate, printed wiring board, copper foil-attached resin film, carrier-attached resin film, build-up type laminate, and build-up type multi-layer board
08/07/2003US20030148079 Thermal conductive substrate and the method for manufacturing the same
08/07/2003US20030148078 Polyimide film which has undergone surface roughening treatment to produce a surface Ra value of 2 to 10 nm, an intermediate layer 2 formed from one, or two or more elements selected from a group consisting of molybdenum, silicon and
08/07/2003US20030148077 High-performance laminate for integrated circuit interconnection
08/07/2003US20030148070 Carrier plate for micro-hybrid circuits
08/07/2003US20030147601 Hybrid optical module employing integration of electronic circuitry with active optical devices
08/07/2003US20030147375 High-speed router backplane
08/07/2003US20030147253 Curved warning light device for attaching to vehicle
08/07/2003US20030147226 Method and structure for reduction of impedance using decoupling capacitor
08/07/2003US20030147222 Circuit board having an integrated circuit for high-speed data processing
08/07/2003US20030147221 Integral high current stamped metal circuit for printed circuit board bussed electrical center
08/07/2003US20030147196 Electronic component and manufacturing method thereof
08/07/2003US20030146705 Ultra-high pressure discharge lamp
08/07/2003US20030146505 Sperical core of high melting metal; connector of low melting eutectic
08/07/2003US20030146482 Layered circuit boards and methods of production thereof
08/07/2003US20030146451 Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials
08/07/2003US20030146434 Semiconductor memory device
08/07/2003US20030146421 Addition-condensation copolymer containing aromatic polyethers
08/07/2003US20030146418 Resistive film
08/07/2003US20030146259 Integrated spark and switch unit for combustion fastener driving tool
08/07/2003US20030146020 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
08/07/2003US20030146019 Board and ink used for forming conductive pattern, and method using thereof
08/07/2003US20030146017 A Method of Forming A HiGH RELIABILITY INTERPOSER FOR LOW COST HIGH RELIABILITY APPLICATIONS
08/07/2003US20030145947 Semiconductor device, method of manufacturing the same, manufacturing apparatus for the same, and electronic instrument
08/07/2003US20030145460 Standoff arrangements to control distance and provide electrical function
08/07/2003DE20210025U1 Flat flexible multi-conductor device, e.g. ribbon cable, has additional condition diagnosis facility built in to indicate possible damage
08/06/2003EP1333708A1 CIRCUIT BOARD, CIRCUIT BOARD−USE MEMBER AND PRODUCTION METHOD THEREFOR AND METHOD OF LAMINATING FEXIBLE FILM
08/06/2003EP1333588A1 High-frequency switch module
08/06/2003EP1333461A2 Method of manufacturing plasma display device
08/06/2003EP1333443A1 Memory system
08/06/2003EP1333077A1 Varnish containing polyamide resin and use thereof
08/06/2003EP1333061A1 Thermosetting polymide resin composition and process for producing polymide resin
08/06/2003EP1333050A1 Material for insulating film, coating varnish for insulating film, and insulating film and semiconductor device using the same
08/06/2003EP1332836A2 Integrated spark and switch unit for combustion fastener driving tool and said fastener driving tool
08/06/2003EP1332654A2 Methods of positioning components using liquid prime movers and related structures
08/06/2003EP1332653A1 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production
08/06/2003EP1155602B1 Electrical connection method and connection site
08/06/2003EP1115567A4 Resin/copper/metal laminate and method of producing same
08/06/2003CN2565234Y Bus connecting structure for printed circuit board
08/06/2003CN2565233Y 印刷电路板 A printed circuit board
08/06/2003CN1434992A Reduced-size board-to-board connector
08/06/2003CN1434848A Luminescent gel coats and moldable resins
08/06/2003CN1434676A Method for making layer increased circuit board with inner embedded film shape resistor assembly
08/06/2003CN1434675A Method for making stacking type multilayer board with inner embeded film shape resistor element
08/06/2003CN1434672A Multi-layer heap circuit board and making method thereof
08/06/2003CN1434504A Semiconductor device and making method, and printing mask
08/06/2003CN1434350A Photoreactive resin composition and circuit board and method for making multilayer ceramic base material
08/06/2003CN1434330A LCD device
08/06/2003CN1117342C LCD module
08/05/2003US6603710 Method for making a display module including a liquid crystal and a single-face printed circuit, and module obtained via said method
08/05/2003US6603668 Interlayer structure with multiple insulative layers with different frequency characteristics
08/05/2003US6603667 Electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic
08/05/2003US6603663 Electronic unit
08/05/2003US6603646 Multi-functional energy conditioner
08/05/2003US6603467 Power up test panel is used to perform the power up test on a LCD panel which greatly simplifies the test and reduces cost. The power up test panel includes a plurality of test electrodes formed on a substrate. The plurality of test
08/05/2003US6603376 Suspended stripline structures to reduce skin effect and dielectric loss to provide low loss transmission of signals with high data rates or high frequencies
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