Patents for H05K 1 - Printed circuits (98,583)
08/2003
08/19/2003US6608663 Active matrix liquid-crystal display device having improved terminal connections
08/19/2003US6608535 Suspended transmission line with embedded signal channeling device
08/19/2003US6608385 Contact structure and production method thereof and probe contact assembly using same
08/19/2003US6608382 Metal bump
08/19/2003US6608376 Integrated circuit package substrate with high density routing mechanism
08/19/2003US6608375 Semiconductor apparatus with decoupling capacitor
08/19/2003US6608258 High data rate coaxial interconnect technology between printed wiring boards
08/19/2003US6608257 Direct plane attachment for capacitors
08/19/2003US6608256 Flat cable
08/19/2003US6608166 Three-dimensional copolymers of polyphenylene ether resinsand sytrenic resins
08/19/2003US6608161 Carboxylic acid catalysts comprising maleic acid, dihydroxyfumaric acid, acetylenedicarboxylic acid, 2,6-dihydroxybenzoic acid, salicylic acid, maleic anhydride, citraconic anhydride or chloromaleic anhydride
08/19/2003US6607981 Method for forming a Cu interconnect pattern
08/19/2003US6607939 Method of making a multi-layer interconnect
08/19/2003US6607937 Stacked microelectronic dies and methods for stacking microelectronic dies
08/19/2003US6607934 Micro-electromechanical process for fabrication of integrated multi-frequency communication passive components
08/19/2003US6607780 Forming opening by photolithography; filling opening with nonconductive paste; placing green sheet on support; filling through hole with conductive paste
08/19/2003US6607620 Greensheet carriers and processing thereof
08/19/2003US6607414 Method of making an ion reflectron comprising a flexible circuit board
08/19/2003US6607395 Card edge connector assembly with rotatable latch members
08/19/2003US6606926 Method for punching brittle material and punching die to be used therefor
08/19/2003US6606793 Printed circuit board comprising embedded capacitor and method of same
08/19/2003US6606792 Process to manufacturing tight tolerance embedded elements for printed circuit boards
08/19/2003US6606791 Component alignment methods
08/14/2003WO2003067947A1 Housing for electronic home entertainment devices
08/14/2003WO2003067946A1 Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
08/14/2003WO2003067944A1 High-speed electrical router backplane with noise-isolated power distribution
08/14/2003WO2003067943A2 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
08/14/2003WO2003067940A2 Circuit carrier and production thereof
08/14/2003WO2003067906A2 High-speed router with single backplane distributing both power and signaling
08/14/2003WO2003067711A2 High speed differential signal edge card connector circuit board layouts
08/14/2003WO2003067564A1 Compact display assembly
08/14/2003WO2003067296A1 Hybrid optical module employing integration of electronic circuitry with active optical devices
08/14/2003WO2003066741A1 Resin composition
08/14/2003WO2003066740A1 Resin composition
08/14/2003WO2003026009A3 Power electronics component
08/14/2003WO2003023428B1 Test fixture glass etch
08/14/2003WO2002082877A3 Telecommunications chassis and card
08/14/2003WO2002041154A3 Universal serial bus (usb) interface for mass storage device
08/14/2003WO2002015266A3 Direct build-up layer on an encapsulated die package
08/14/2003US20030154451 Method, system and computer program product for multidisciplinary design analysis of structural components
08/14/2003US20030154335 Encoding element for an electric module and electric module including such encoding element
08/14/2003US20030153834 Ultrasound probe wiring method and apparatus
08/14/2003US20030153683 Co-crosslinking agent is brominated bisphenol A, or brominated bisphenol A diglycidyl ether; use as laminates for electronics and printed wiring boards
08/14/2003US20030153476 Aliphatic alcohol having 4 or fewer carbons and having an amino group or an imino group and a hydroxyl group in a molecular thereof, and a tetraalkyl ammonium hydroxide aqueous solution
08/14/2003US20030153223 Connecting method for metal material and electric conductive plastic material and product thereby
08/14/2003US20030153204 Terminal structure having large peel strength of land portion and ball
08/14/2003US20030153120 Method for producing a contactless chip card using transfer paper
08/14/2003US20030153099 Method of making a flexible substrate with a filler material
08/14/2003US20030152863 Photostructured paste
08/14/2003US20030152309 Printed circuit board containing optical elements
08/14/2003US20030151915 LED flashlight and printed circuit board therefore
08/14/2003US20030151905 Electrical connections within substrates
08/14/2003US20030151902 Flexible printed circuit board
08/14/2003US20030151477 High-frequency module and its manufacturing method
08/14/2003US20030151476 Waveguide in multilayer structures
08/14/2003US20030151471 Multilayer ceramic device
08/14/2003US20030151147 Electrical assembly with vertical multiple layer structure
08/14/2003US20030151146 Vertical electronic circuit package and method of fabrication therefor
08/14/2003US20030151141 External connection terminal and semiconductor device
08/14/2003US20030151139 Semiconductor device
08/14/2003US20030151135 Circuit device and manufacturing method of circuit device
08/14/2003US20030151127 Semiconductor device
08/14/2003US20030151032 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof
08/14/2003US20030151031 Dielectric and porogen having at least two fused aromatic rings, each of which has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings
08/14/2003US20030151028 Conductive flexographic and gravure ink
08/14/2003US20030150840 For etching a nickel-chromium alloy, comprising: hydrochloric acid and thiourea.
08/14/2003US20030150645 Method and apparatus for coupling a microelectronic device package to a circuit board
08/14/2003US20030150644 Printed wiring board and method of manufacturing the same
08/14/2003US20030150643 Layout for noise reduction on a printed circuit board and connectors using it
08/14/2003US20030150642 Electromagnetic bus coupling
08/14/2003US20030150634 Undetachable electrical and mechnical connection, contact element for an undetachable electrical and mechanical connection, and method of producing such an electrical and mechanical connection
08/14/2003US20030150631 Flexible printed circuit with EMI protection
08/14/2003US20030150101 Printed circuit board with buried resistor and manufacturing method thereof
08/14/2003DE20308025U1 Pre-perforated, copper-plated circuit board for photochemical production of small series
08/14/2003DE20205339U1 Sensor circuit component group, for control of functions of household machine, includes circuit board, several sensors and relays
08/14/2003CA2474694A1 Resin composition_and products containing the same
08/14/2003CA2474693A1 Resin composition and products containing the same
08/13/2003EP1335643A2 Method for manufacturing double-sided circuit board
08/13/2003EP1335642A2 Flexible printed circuit with EMI protection
08/13/2003EP1335454A1 Connector with collapsible contact elements
08/13/2003EP1335393A1 Method of producing electronic parts, and member for production thereof
08/13/2003EP1335211A2 Applications for encapsulated electrophoretic displays
08/13/2003EP1334810A1 Circuit board production method and circuit board production data
08/13/2003EP1334647A1 An integrated circuit carrier
08/13/2003EP1334542A2 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
08/13/2003EP1334393A1 Transparent substrate and hinged optical assembly
08/13/2003EP1238444B1 Undetachable electrical and mechanical connection, contact element for an undetachable electrical and mechanical connection and method for producing such an electrical and mechanical connection
08/13/2003EP1116305B1 Removable connecting system
08/13/2003EP0829186B1 Composite materials
08/13/2003EP0642412B1 Printed circuit substrates
08/13/2003CN2566586Y Circuit board of network slot
08/13/2003CN2566581Y Grooved printed circuit board for electronic device
08/13/2003CN1436439A Transparent substrate provided with electroconductive strips
08/13/2003CN1436035A Apparatus and method for mfg. ceramic laminate
08/13/2003CN1436032A Ceramic laminate and making method thereof
08/13/2003CN1435448A Thermosetting polyimide resin composition and method for producing polyimide resin
08/13/2003CN1435319A Structure and making method of flexible circuit board for ink-jet printing head
08/13/2003CN1118099C Method for mounting intermediate connecting element to terminal of electronic module
08/13/2003CN1118039C Circuit unit with chip card module and coil connected therewith
08/13/2003CN1117783C Liquid crystalline polyesters and molding composition prepared therefrom