Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
08/2003
08/26/2003US6611057 Semiconductor device attaining both high speed processing and sufficient cooling capacity
08/26/2003US6611046 Flexible polyimide circuits having predetermined via angles
08/26/2003US6610934 Semiconductor module and method of making the device
08/26/2003US6610794 Polymide/polyarylate resin composition and molded product thereof
08/26/2003US6610621 Glass-ceramic composition for ceramic electronic part, ceramic electronic part, and method for manufacturing multilayer ceramic electronic part
08/26/2003US6610418 Electolytic copper foil with carrier foil and method for manufacturing the same
08/26/2003US6610417 Nickel coated copper as electrodes for embedded passive devices
08/26/2003US6609914 High speed and density circular connector for board-to-board interconnection systems
08/26/2003US6609458 Screen printing apparatus and method of the same
08/26/2003US6609297 Method of manufacturing multilayer printed wiring board
08/26/2003US6609296 Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means
08/21/2003WO2003069969A2 High density 3-d integrated circuit package
08/21/2003WO2003069966A1 Method for the production of a semi-finished product for a printed board, semi-finished product, and printed board
08/21/2003WO2003069862A1 Electromagnetic bus coupling
08/21/2003WO2003069734A1 Intermediate board
08/21/2003WO2003069723A1 Signal repeating device
08/21/2003WO2003069636A1 Etching solution for forming an embedded resistor
08/21/2003WO2003069218A1 Led flashlight and printed circuit board therefor
08/21/2003WO2003069023A1 Method for repairing fine pattern and apparatus for repairing fine pattern
08/21/2003WO2003068874A1 Conductive flexographic and gravure ink
08/21/2003WO2003068842A1 Polymerizable composition and cured resin composition
08/21/2003WO2003068837A1 Indole resins, epoxy resins and resin compositions containing the same
08/21/2003WO2003068599A1 Light source assembly for vehicle external lighting
08/21/2003WO2003068521A1 Method of tampoprinting an electrical leading circuit
08/21/2003WO2003068446A1 Method for determining the precision of processing machines
08/21/2003WO2003068138A1 Device for detecting the removal of a product from a packing system by an electronic unit
08/21/2003WO2003068137A1 Blister pack system
08/21/2003WO2003058677A3 System for the production of electric and integrated circuits
08/21/2003WO2003043747A3 Manufacture having double sided features in a metal-containing web formed by etching
08/21/2003WO2003036661A3 Resistor nanocomposite compoisitons
08/21/2003WO2003032084A3 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
08/21/2003WO2003031373A3 Thick film conductor compositions for use on aluminum nitride substrates
08/21/2003WO2003026008A3 Power electronics component
08/21/2003WO2003005444A3 Ceramic-filled polymer substrate for using in high frequency technology
08/21/2003WO2002061945A3 Method and device for equalisation of an oscillator for assembly on a circuit board
08/21/2003WO2002054122A3 Layered circuit boards and methods of production thereof
08/21/2003US20030159122 Semiconductor device having wide wiring pattern in outermost circuit
08/21/2003US20030158337 Thermosetting resin composition for high performance laminates
08/21/2003US20030157861 Method of manufacturing plasma display device
08/21/2003US20030157858 Prepegs and laminate having a high strength, reduced thickness, and light weight
08/21/2003US20030157816 Apparatus for connecting semiconductor modules
08/21/2003US20030157749 Electronic component, manufacturing method therefor, aggregate electronic component, mounting structure of electronic component, and electronic device
08/21/2003US20030157437 Semiconductor module substrate sheet, semiconductor module substrate sheet fabricating method and semiconductor module
08/21/2003US20030157399 Battery pack and method of producing the same
08/21/2003US20030157307 Circuit board and method for manufacturing the same
08/21/2003US20030157250 Hyrdrothermal treatment of nanostructured films
08/21/2003US20030156829 PTC heater with flexible printed circuit board
08/21/2003US20030156443 High capacity memory module with built-in performance enhancing features
08/21/2003US20030156430 Light source device for endoscope and assembly method for light source unit
08/21/2003US20030156402 Method for making a build-up package of a semiconductor die and structure formed from the same
08/21/2003US20030156400 Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
08/21/2003US20030156398 Processor and power supply circuit
08/21/2003US20030156394 System for reducing apparent height of a board system
08/21/2003US20030156393 Primary functional circuit board suitable for use in verifying chip function by alternative manner
08/21/2003US20030156391 Wiring board and soldering method therefor
08/21/2003US20030156390 Wireless LAN card with efficient productivity
08/21/2003US20030156386 Thermal solution for a mezzanine card
08/21/2003US20030156368 In-rush current controller
08/21/2003US20030155991 Miniature 180 degree power splitter
08/21/2003US20030155987 Interference signal decoupling using a board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
08/21/2003US20030155908 Test mark and electronic device incorporating the same
08/21/2003US20030155640 Integrated circuit package
08/21/2003US20030155638 Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device
08/21/2003US20030155455 Mixture of fine inrganic compound in thermosetting resin; heating, pressurization, curing
08/21/2003US20030155143 Electromagnetic wave absorption material and an associated device
08/21/2003US20030155064 Method for manufacturing laminated ceramic electronic component
08/21/2003US20030154599 Method for reducing apparent height of a board system
08/21/2003US20030154592 Method to embed thick film components
08/21/2003DE20309293U1 Connector strip for electronic circuits has connector strip formed from circuit board
08/21/2003DE10162637C1 Schaltungsanordnung mit elektronischen Bauelementen auf einem isolierenden Trägersubstrat Circuit arrangement having electronic components on an insulating support substrate
08/21/2003CA2474070A1 High density 3-d integrated circuit package
08/20/2003EP1337135A2 High frequency unit
08/20/2003EP1337134A2 Terminal structure having large peel strength of land portion and ball
08/20/2003EP1337007A1 Intermediate board
08/20/2003EP1336647A2 Fixing adhesive sheet for flexible printed circuit board and method for mounting electronic parts in flexible printed circuit board
08/20/2003EP1336329A1 Arrangement consisting of a circuit carrier and a printed circuit board, or a printed circuit board assembly
08/20/2003EP1336202A2 Device for protecting an electric and/or electronic component arranged on a carrier substrate against electrostatic discharges
08/20/2003EP1335831A1 A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article
08/20/2003EP0843621B1 Conductive via fill inks for ceramic multilayer circuit boards on support substrates
08/20/2003CN2567917Y Improved structure of circuit board
08/20/2003CN2567916Y Interlayer disposition structure of multi-layer circuit board
08/20/2003CN1437839A A printed circuit board assembly with improved bypass decoupling for BGA packages
08/20/2003CN1437838A Self-aligned coaxial via capacitors
08/20/2003CN1437775A Battery pack and method of producing the same
08/20/2003CN1437713A A method for individualised marking of circuit boards
08/20/2003CN1437628A Impregnated glass fiber strands and products including the same
08/20/2003CN1437438A Method for producing double-side distributing board
08/20/2003CN1437435A Flexible printed circuit with EMI protection
08/20/2003CN1437210A Terminal structure for high frequency signal transmitting parts
08/20/2003CN1436810A Synthetic resin applied as dielectric material in high-density printed circuti board
08/20/2003CN1436632A Integrated spark and switch apparatus for combustion power fastener driving tool
08/20/2003CN1119074C Combined electric conductor and optical wave guide edge contact parts
08/20/2003CN1119073C Printed circuit board for large current
08/20/2003CN1118522C Process for preparing green pigment composition without halogen
08/20/2003CN1118338C Impregnation method for substrate material and impregnated substrate material and articles produced thereby
08/19/2003US6608763 Stacking system and method
08/19/2003US6608762 Midplane for data processing apparatus
08/19/2003US6608760 Dielectric material including particulate filler
08/19/2003US6608757 Method for making a printed wiring board
08/19/2003US6608756 Bridging board
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