Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
09/2003
09/02/2003US6614249 Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate
09/02/2003US6614110 Module with bumps for connection and support
09/02/2003US6613988 Circuit board system with raised interconnects of conductive circuit traces
09/02/2003US6613986 Multilayer build-up wiring board
09/02/2003US6613979 Electrical circuit suspension system
09/02/2003US6613947 High purity 4,4′-isopropylidene-bis-(2,6 dibromophenol) and process for the preparation of such high purity 4,4′-isopropylidene-bis-(2,6 dibromophenol)
09/02/2003US6613848 Phosphorus-containing phenolic, thiophenolic or aminophenyl flame-retardant hardener, and epoxy resins cured thereby
09/02/2003US6613599 Electro-optical device, method of manufacturing electro-optical device, liquid crystal device, method of manufacturing liquid crystal device and electronic apparatus
09/02/2003US6613597 Optical chip packaging via through hole
09/02/2003US6613495 Negative photoimageable mixture of a triazine or oxadiazole type acid generator, a reactive oligomer with crosslinking groups and a resin binder
09/02/2003US6613450 Metal/ceramic bonding article
09/02/2003US6613443 Silicon nitride ceramic substrate, silicon nitride ceramic circuit board using the substrate, and method of manufacturing the substrate
09/02/2003US6613413 Porous power and ground planes for reduced PCB delamination and better reliability
09/02/2003US6612866 Voltage isolator connector device for printed circuit board assembly
09/02/2003US6612863 Connecting structure for a connector-flexible cable and flexible cable with perforated slits
09/02/2003US6612850 Slot pinhole dual layout on a circuit board
09/02/2003US6612848 Electrical component system with rotatable electrical contacts
09/02/2003US6612290 Injector integrated module
09/02/2003US6612025 Method for creating a connection within a multilayer circuit board assembly
09/02/2003US6612023 Method for registering a component lead with a U-shaped metalized pad
09/02/2003US6612022 Printed circuit board including removable auxiliary area with test points
08/2003
08/28/2003WO2003071603A1 Module part
08/28/2003WO2003071378A2 High capacity memory module with built-in performance enhancing features
08/28/2003WO2003070524A1 Method for creating a conductor track on a carrier component and corresponding carrier component
08/28/2003WO2003038897A3 Electronic unit, circuit design for the same, and production method
08/28/2003WO2003031372A3 Method for the production of metal-ceramic composite materials, especially metal-ceramic substrates and ceramic composite material produced according to said method, especially a metal-ceramic substrate.
08/28/2003WO2002035672A3 Securing electrical conductors
08/28/2003WO2002011207A3 Electronic assembly comprising substrate with embedded capacitors and methods of manufacture
08/28/2003US20030163218 Patching methods and apparatus for fabricating memory modules
08/28/2003US20030162935 Halogen-free
08/28/2003US20030162442 Connector with included filtered power delivery
08/28/2003US20030162420 Laminated socket contacts
08/28/2003US20030162419 Laminated socket contacts
08/28/2003US20030162414 Shielded optical probe having an electrical connector
08/28/2003US20030162386 Semiconductor device and its manufacturing method
08/28/2003US20030162310 Characteristics evaluation of intermediate layer circuit
08/28/2003US20030162083 Battery pack
08/28/2003US20030162047 Electrically conductive filled through holes
08/28/2003US20030162006 Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof
08/28/2003US20030161959 Applying flowable precursor composition to organic substrate wherein precursor comprises molecular precursor to conductive phase and powder of insulating material, heating substrate to convert molecular precursor to conductive phase
08/28/2003US20030161941 Polymerization of thiophene by chemical oxidation, where oxidants employed are iron(III) salts of alicyclic sulphonic acids; for finishing plastic films for packaging of electronic components, for clean-room packaging
08/28/2003US20030161593 Thermal pads for surface mounting of optical devices
08/28/2003US20030161198 Method and apparatus for implementing a selectively operable clock booster for DDR memory or other logic modules which utilize partially-defective memory parts, or a combination of partially-defective and flawless memory parts
08/28/2003US20030161196 High-speed memory system
08/28/2003US20030161125 Adapter apparatus for memory modules
08/28/2003US20030161122 Electronic component and method of producing the same
08/28/2003US20030161121 Trimming of embedded structures
08/28/2003US20030161120 Wiring board, method of manufacturing the same, electronic component, and electronic instrument
08/28/2003US20030161111 Heat dissipation structure for use in combination with electronic circuit board
08/28/2003US20030161091 Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant vias
08/28/2003US20030161090 Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant vias
08/28/2003US20030161086 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
08/28/2003US20030160960 Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device
08/28/2003US20030160668 Tuning circuit
08/28/2003US20030160317 Forming channel in electroconductive foil; overcoating with dielectric
08/28/2003US20030159852 Multilayer wiring board, manufacturing method therefor and test apparatus thereof
08/28/2003US20030159851 Flexible circuit board
08/28/2003US20030159770 Composite laminate and method for manufacturing the same
08/28/2003US20030159282 Wiring board and method of fabricating the same, semiconductor device, and electronic instrument
08/28/2003US20030159278 Methods and apparatus for fabricating Chip-on-Board modules
08/28/2003DE20205637U1 Device for switching over electric circuits performs selective switch-over between two mains voltage networks for supplying electrical consumers
08/27/2003EP1339270A2 Method of manufacturing metal clad laminate for printed circuit board
08/27/2003EP1339269A1 Coding element for an electrical module and electrical module with such coding element
08/27/2003EP1339204A1 Contact device for electrostatic microphone
08/27/2003EP1339203A2 Rotary structure for relaying signals
08/27/2003EP1339073A1 Electroconductive metal paste and method for production thereof
08/27/2003EP1338624A1 Liquid thermosetting resin composition, printed wiring boards and process for their production
08/27/2003EP1338617A2 Transparant layers of Polythiophene having high conductivity
08/27/2003EP1338182A1 Electrical component, arrangement for said component and method for producing said arrangement
08/27/2003EP1337941A1 A prototyping system
08/27/2003EP1337494A2 Esd dissipative ceramics
08/27/2003EP0948879A4 Ceramic composite wiring structures for semiconductor devices and method of manufacture
08/27/2003EP0835046B1 Component mounting board, process for producing the board, and process for producing the module
08/27/2003EP0823096B1 Method of producing a smart card
08/27/2003CN2569525Y Fixing structureof circuit board
08/27/2003CN2569516Y Improved circuit base plate
08/27/2003CN2569515Y Soft circuit boardwith electromagnetic shield layer
08/27/2003CN1439236A Process for thick film circuit patterning
08/27/2003CN1439174A Process for the manufacture of printed circuit boards with plated resistors
08/27/2003CN1439038A Epoxyresin composition and cured object obtained therefrom
08/27/2003CN1439028A Insulating resin composition, adhesive resin composition and adhesive sheeting
08/27/2003CN1438834A Improved method for imlaying thick-film assembly
08/27/2003CN1438833A Circuit-board having internal electronic element and making method thereof
08/27/2003CN1438786A Wireless local network card
08/27/2003CN1438735A 连接装置 Connecting device
08/27/2003CN1438698A 半导体器件 Semiconductor devices
08/27/2003CN1438656A Transparent polythiofuran layer of high conductivity
08/27/2003CN1438286A Adhisive piece for fixing flexible printed circuit-board and method for fitting electronic element on flexible printed circuit board
08/27/2003CN1119851C Multi-deck power converter module
08/27/2003CN1119700C Use of etching solution in etching polyimide film
08/27/2003CN1119443C Woven fabric reinforcement to optimize dimensional stability of laminated composite structures, including products for electrical and electronic applications
08/27/2003CN1119215C Process for preparing metal powder
08/26/2003US6611635 Opto-electronic substrates with electrical and optical interconnections and methods for making
08/26/2003US6611435 voltage regulator with voltage droop compensation
08/26/2003US6611419 Electronic assembly comprising substrate with embedded capacitors
08/26/2003US6611280 Flexible cable, flexible cable mount method, semiconductor device with flexible cable, led array head with flexible cable, image forming apparatus with such led array head
08/26/2003US6611181 Electromagnetic coupler circuit board having at least one angled conductive trace
08/26/2003US6611137 Hall effect current sensor system packaging
08/26/2003US6611066 Power distributor for vehicle
08/26/2003US6611065 Connection material
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