| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 09/09/2003 | US6618257 Wide data path stacking system and method |
| 09/09/2003 | US6618252 Heat sink of module with built-in IC |
| 09/09/2003 | US6618238 Parallel plate buried capacitor |
| 09/09/2003 | US6618117 Image sensing apparatus including a microcontroller |
| 09/09/2003 | US6618111 Liquid crystal display device |
| 09/09/2003 | US6618068 Printer device |
| 09/09/2003 | US6617947 Tuning circuit |
| 09/09/2003 | US6617946 Microwave package |
| 09/09/2003 | US6617939 Cable connector assembly with an equalization circuit board |
| 09/09/2003 | US6617919 RF amplifier |
| 09/09/2003 | US6617695 Semiconductor device and semiconductor module using the same |
| 09/09/2003 | US6617673 Memory card |
| 09/09/2003 | US6617671 High density stackable and flexible substrate-based semiconductor device modules |
| 09/09/2003 | US6617541 Laser etching method |
| 09/09/2003 | US6617529 Circuit board and electronic equipment using the same |
| 09/09/2003 | US6617527 Printed circuit board having a pair of grooves extending the entire length |
| 09/09/2003 | US6617526 UHF ground interconnects |
| 09/09/2003 | US6617521 Circuit board and display device using the same and electronic equipment |
| 09/09/2003 | US6617520 Circuit board |
| 09/09/2003 | US6617518 Enhanced flex cable |
| 09/09/2003 | US6617510 Stress relief bend useful in an integrated circuit redistribution patch |
| 09/09/2003 | US6617509 Arrangement relating to conductor carriers and methods for the manufacture of such carriers |
| 09/09/2003 | US6617398 Forming laminate; curing; cladding with copper; printed circuits |
| 09/09/2003 | US6617377 Polymer resin; carbon black, graphite, silver, copper, or nickel conductive particles; nanoparticles; and organic solvent, wherein the polymer resin, conductive particles and nanoparticles are dispersed in the organic solvent. |
| 09/09/2003 | US6617029 Nitrogen-containing flame retarding epoxy resin and an epoxy resin composition containing the same |
| 09/09/2003 | US6616864 Z-axis electrical contact for microelectronic devices |
| 09/09/2003 | US6616796 Press-bonding a thermotropic liquid crystal polymer film to a metal sheet between hot rolls while in a tense or non-tense state; and heating the laminate to not lower than the melting point of the polymer film. |
| 09/09/2003 | US6616794 Dispersing a hydrothermally prepared nanopowder in a solvent; preparing a composite mixture by mixing a bonding material with the slurry, forming composite mixture into a dielectric layer, covering it with a conductive layer; curing dielectric |
| 09/09/2003 | US6616467 Folding-type electronic apparatus comprising two base members hinge-connected by a hinge connector with an FPC |
| 09/09/2003 | US6616053 Memory card, and receptacle for same |
| 09/09/2003 | US6616041 Part marking method applicable to industrial parts |
| 09/09/2003 | US6615616 Glass fiber nonwoven fabric and printed wiring board |
| 09/09/2003 | US6615485 Probe card assembly and kit, and methods of making same |
| 09/09/2003 | US6615481 Utilizes laser machining to provide high resolution, dense coil wire patterns on both sides of a ceramic vane substrate. A firing operation is first performed that eutectically bonds the copper to the ceramic. |
| 09/04/2003 | WO2003073814A2 Laminated socket contacts |
| 09/04/2003 | WO2003073812A1 Method of fabricating a high-layer-count backplane |
| 09/04/2003 | WO2003073811A1 Solder interconnections for flat circuits |
| 09/04/2003 | WO2003073809A1 High-speed router backplane |
| 09/04/2003 | WO2003073808A1 Passive transmission line equalization using circuit-board thru-holes |
| 09/04/2003 | WO2003073807A1 Wired transmission path |
| 09/04/2003 | WO2003073805A2 Improved patching methods and apparatus for fabricating memory modules |
| 09/04/2003 | WO2003073596A1 Integrated magnetic buck converter with magnetically coupled synchronously rectified mosfet gate drive |
| 09/04/2003 | WO2003073506A2 A modular integrated circuit chip carrier |
| 09/04/2003 | WO2003073475A2 Heat sink for semiconductor die employing phase change cooling |
| 09/04/2003 | WO2003073373A1 Intermediate support for inserting into a support and support comprising an intermediate support |
| 09/04/2003 | WO2003073357A1 Methods and apparatus for fabricating chip-on-board modules |
| 09/04/2003 | WO2003073356A1 Memory module assembly using partially defective chips |
| 09/04/2003 | WO2003073251A2 Power delivery to base of processor |
| 09/04/2003 | WO2003073250A2 Electrical connector equipped with filter |
| 09/04/2003 | WO2003072861A1 Fabric woven with flat glass fibers and production method |
| 09/04/2003 | WO2003072639A1 Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board |
| 09/04/2003 | WO2003072527A1 Method for metallizing titanate-based ceramics |
| 09/04/2003 | WO2003072325A1 Ceramic multilayer substrate manufacturing method and unfired composite multilayer body |
| 09/04/2003 | WO2002103887A3 Power converters |
| 09/04/2003 | WO2002058152A3 Electronic circuit device and method for manufacturing the same |
| 09/04/2003 | WO2000015547A3 Metal-carbon composite powders, methods for producing powders and devices fabricated from same |
| 09/04/2003 | US20030166796 Epoxy resin composition and cured object obtained therefrom |
| 09/04/2003 | US20030166312 Methods for assembly and packaging of flip chip configured dice with interposer |
| 09/04/2003 | US20030165771 Blends of curable epoxy resins, polyepoxides, novolacs and photoinintiators, used to from films having high glass transition temperature and good flexibility used in printed circuits |
| 09/04/2003 | US20030165303 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC ( low-temperature co-fired ceramic ) technology |
| 09/04/2003 | US20030165252 Contacting arrangement for an electroacoustic microphone transducer |
| 09/04/2003 | US20030165051 Modular integrated circuit chip carrier |
| 09/04/2003 | US20030164919 Displaying substrate and liquid crystal display device having the same |
| 09/04/2003 | US20030164556 Composite interposer for BGA packages |
| 09/04/2003 | US20030164537 Semiconductor component comprising a surface metallization |
| 09/04/2003 | US20030164457 Non-destructive method for testing curing level of cured product of curable adhesive composition and manufacturing method of electronic devices |
| 09/04/2003 | US20030164247 Stacking multiple devices using direct soldering |
| 09/04/2003 | US20030164244 System for and method of interconnecting high-frequency transmission lines |
| 09/04/2003 | DE20309539U1 Printed circuit especially for controlling locking system of car doors consists of at least three circuit boards, one ferrite core and at least a winding around the core |
| 09/04/2003 | CA2477766A1 Improved patching methods and apparatus for fabricating memory modules |
| 09/04/2003 | CA2477763A1 Methods and apparatus for fabricating chip-on-board modules |
| 09/04/2003 | CA2477754A1 Memory module assembly using partially defective chips |
| 09/03/2003 | EP1341262A2 Binding device for multiple electrical cable |
| 09/03/2003 | EP1341254A2 System for and method of interconnecting high-frequency transmission lines |
| 09/03/2003 | EP1340289A2 Board integrated resilient contact elements array and method of fabrication |
| 09/03/2003 | EP1340255A2 Interposer for a semiconductor module, semiconductor produced using such an interposer and method for producing such an interposer |
| 09/03/2003 | EP1340234A1 System, printed circuit board, charger device, user device, and apparatus |
| 09/03/2003 | EP1340154A2 Topology for 66 mhz pci bus riser card system |
| 09/03/2003 | EP1196798B1 Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics |
| 09/03/2003 | EP1088470A4 Ic stack utilizing flexible circuits with bga contacts |
| 09/03/2003 | CN2571130Y Circuit board insulating sheet |
| 09/03/2003 | CN2571129Y Moisture protection and dust-proof wiring board with electronic component |
| 09/03/2003 | CN1440431A Thermosetting resins and laminates |
| 09/03/2003 | CN1440009A Checking marker and electronic machine |
| 09/03/2003 | CN1120542C Planar dielectric line and integrated circuit using the same |
| 09/03/2003 | CN1120504C Terminal instrallation structure |
| 09/03/2003 | CN1120460C Control and signaling device or signaling device with luminous element |
| 09/03/2003 | CN1120458C Display device, display panel assembly, flexible wiring plate and assembling method thereof |
| 09/03/2003 | CN1120399C Method and device for establishing heat transfer between integrated circuit and radiating sheets |
| 09/03/2003 | CN1120204C Flame retardant resin composition and laminate using the same |
| 09/02/2003 | US6614725 Timepiece comprising means for allowing electric access to electric or electronic components of this timepiece |
| 09/02/2003 | US6614664 Memory module having series-connected printed circuit boards |
| 09/02/2003 | US6614663 Reducing impedance of power supplying system in a circuit board by connecting two points in one of a power supply pattern and a ground pattern by a resistive member |
| 09/02/2003 | US6614662 Printed circuit board layout |
| 09/02/2003 | US6614659 De-mountable, solderless in-line lead module package with interface |
| 09/02/2003 | US6614658 Flexible cable stiffener for an optical transceiver |
| 09/02/2003 | US6614398 Antenna structure and communication apparatus including the same |
| 09/02/2003 | US6614341 Thick film circuit with fuse |
| 09/02/2003 | US6614325 RF/IF signal distribution network utilizing broadside coupled stripline |
| 09/02/2003 | US6614253 On-circuit board continuity tester |