Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
09/2003
09/23/2003US6625032 Aqueous dispersion forming conductive layer, conductive layer, electronic compent, circuit board and method for manufacturing the same, and multilayer wiring board and method for manufacturing the same
09/23/2003US6625031 Module part and electronic device
09/23/2003US6625030 Wireless terminal assembly
09/23/2003US6624729 Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board
09/23/2003US6624718 Signal transmission unit
09/23/2003US6624717 Impedance matched bus traces over de-gassing holes
09/23/2003US6624703 Terminal arrangement for an electrical device
09/23/2003US6624648 Probe card assembly
09/23/2003US6624512 Semiconductor integrated circuit device and printed wired board for mounting the same
09/23/2003US6624511 Hybrid integrated circuit device
09/23/2003US6624503 Electromagnetic filtering structure
09/23/2003US6624500 Thin-film electronic component and motherboard
09/23/2003US6623906 Photosensitive glass paste and method for manufacturing multilayered interconnected circuit board using the same
09/23/2003US6623843 Resin composition for wiring circuit board, substrate for wiring circuit board, and wiring circuit board
09/23/2003US6623803 Copper interconnect stamping
09/23/2003US6623663 Contains copper; for forming via hole conductors to be converted to external electrode terminals
09/23/2003US6623306 Solder mask configuration for a printed circuit board of a modular jack
09/23/2003US6623302 Electrical connector having printed substrates therein electrically contacting conductive contacts thereof by solderless
09/23/2003US6623281 Mounting electronic components on circuit boards
09/23/2003US6623279 Separable power delivery connector
09/23/2003US6622905 Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to vias
09/23/2003US6622711 Ignition coil cassette assembly
09/23/2003US6622603 Linear via punch
09/23/2003US6622374 Resistor component with multiple layers of resistive material
09/23/2003US6622370 Method for fabricating suspended transmission line
09/23/2003CA2267492C Formation of thin film resistors
09/23/2003CA2057744C Multichip module
09/18/2003WO2003077620A1 Method of manufacturing thin functional copper foils from a continuous copper foil and the manufactured product
09/18/2003WO2003077317A1 Integrated circuit device and method for manufacturing the same
09/18/2003WO2003077316A1 Impedance matching
09/18/2003WO2003077313A2 Multilayered ceramic substrate for integrated power components and method for the production of said substrate
09/18/2003WO2003077308A1 Mold release layer transferring film and laminate film
09/18/2003WO2003077272A1 Plasma display
09/18/2003WO2003077264A2 Emi shielded module
09/18/2003WO2003077132A1 Arrangement of integrated circuits in a memory module
09/18/2003WO2003076515A1 Thermosetting resin composition and laminates and circuit board substrates made by using the same
09/18/2003WO2003076499A1 Continuous filament mat binder system
09/18/2003WO2003076495A1 Low molecular weight polyphenylene ether
09/18/2003WO2003076477A1 Molding material and electrical components
09/18/2003WO2003047328A3 Method and devices for qualifying substrate-processing production processes
09/18/2003WO2003010813A3 Grid interposer
09/18/2003WO2003003456A3 Electronic assembly with vertically connected capacitors and manufacturing method
09/18/2003WO2002049103A3 Microelectronic package having bumpless laminated interconnection layer
09/18/2003WO2002035903A3 Electronic component, component mounting equipment, and component mounting method
09/18/2003US20030176628 Polythiophenes formed form monomers such as (2,3-dihydro-thieno(3,4-b)(1,4)dioxin-2-yl-methoxy)-acetic acid, for use as coatings, printable pastes or electroconductive layers
09/18/2003US20030176585 Insulating resin composition, adhesive resin composition and adhesive sheeting
09/18/2003US20030176109 Connecting member
09/18/2003US20030176021 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
09/18/2003US20030176013 Integrated circuit capable of operating in multiple orientations
09/18/2003US20030175625 Method for individualised marketing of circuit boards
09/18/2003US20030175621 Photopolymerizable bonding agent; photoinitiator; controlling temperature; heating cycles
09/18/2003US20030175533 Silicone resin based composites interleaved for improved toughness
09/18/2003US20030175515 Chopped strand for glass paper
09/18/2003US20030175411 Precursor compositions and methods for the deposition of passive electrical components on a substrate
09/18/2003US20030174501 LED symbol signal
09/18/2003US20030174484 Lamination of high-layer-count substrates
09/18/2003US20030174483 Wiring board and method of fabricating tape-like wiring substrate
09/18/2003US20030174481 Semiconductor module
09/18/2003US20030174480 Electronic device
09/18/2003US20030174479 High-frequency integrated circuit module
09/18/2003US20030174477 Circuit board with lead frame
09/18/2003US20030174469 Electronics assembly with improved heatsink configuration
09/18/2003US20030174038 Flex circuit relay
09/18/2003US20030174037 Packaging techniques for a high-density power converter
09/18/2003US20030173719 Process for the production of electrical circuits
09/18/2003US20030173676 Multi-layered semiconductor device and method of manufacturing same
09/18/2003US20030173666 Semiconductor device
09/18/2003US20030173661 Contact structure and production method thereof and probe contact assembly using same
09/18/2003US20030173660 Ceramic circuit board and power module
09/18/2003US20030173640 Semiconductor device
09/18/2003US20030173634 Solid image pickup apparatus
09/18/2003US20030173579 Power semiconductor device
09/18/2003US20030173111 Printed circuit board housing clamp
09/18/2003US20030173109 Printed circuit board unit with detachment mechanism for electronic component
09/18/2003US20030173105 Manufacturing method of rigid-flexible printed circuit board and structure thereof
09/18/2003US20030172527 Automated trim processing system
09/18/2003US20030172526 Production method of printed circuit board
09/18/2003US20030172525 Interconnect structure and method of making same
09/17/2003EP1345480A2 Ceramic circuit board and power module
09/17/2003EP1345271A1 Process for manufacturing electric circuits
09/17/2003EP1345265A2 Electronics assembly with improved heatsink configuration
09/17/2003EP1345264A1 Integral-type ceramic circuit board and method of producing same
09/17/2003EP1345241A1 Electrical insulating plate, prepreg laminate and method for producing them
09/17/2003EP1344433A1 Interconnect
09/17/2003EP1344396A1 Folder type multi display device
09/17/2003EP1195082B1 Printed circuit fabrication
09/17/2003EP1186213B1 Method and apparatus for reducing electrical resonances and noise propagation in power distribution circuits employing plane conductors
09/17/2003EP1097616B1 Method for producing printed circuit boards with rough conducting structures and at least one area with fine conducting structures
09/17/2003EP0868838B1 Passive component
09/17/2003CN1442773A Connection component
09/17/2003CN1442729A Integrated circuit chip, electronic device and its manufacturing method and electronic machine
09/17/2003CN1121513C Copper zinc electroplating bath copper foil for printed wiring board and method of surface treatment thereof
09/17/2003CN1121460C Water cleanable silver composition
09/16/2003US6622054 Method monitoring a quality of electronic circuits and its manufacturing condition and system for it
09/16/2003US6621705 Miniature surface mount heatsink element and method of use
09/16/2003US6621572 Optical inspection of laser vias
09/16/2003US6621517 Viewing and imaging systems
09/16/2003US6621384 Technology implementation of suspended stripline within multi-layer substrate used to vary time delay and to maximize the reach of signals with high data rates or high frequencies
09/16/2003US6621373 Apparatus and method for utilizing a lossy dielectric substrate in a high speed digital system
09/16/2003US6621371 System board and impedance control method thereof
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