Patents for H05K 1 - Printed circuits (98,583)
09/2003
09/30/2003US6626698 Holder for a flat circuit member
09/30/2003US6626690 Low profile NIC jumper solution using ZIF connector
09/30/2003US6626687 Low profile NIC jumper solution using ZIF connector
09/30/2003US6626518 Bending a tab flex circuit via cantilevered leads
09/30/2003US6625882 System and method for reinforcing a bond pad
09/30/2003US6625880 Method for producing printed wiring board
09/30/2003US6625857 Method of forming a capacitive element
09/30/2003CA2283150C Printed circuit board for electrical devices having rf components, particularly for mobile radio telecommunication devices
09/25/2003WO2003079743A2 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method
09/25/2003WO2003079599A2 A measurement arrangement and telecommunications assembly
09/25/2003WO2003079565A1 Millimeter wave (mmw) radio frequency transceiver module and method of forming same
09/25/2003WO2003079499A1 Plug for connection strips and method for the production thereof
09/25/2003WO2003078494A1 Curable resins and curable resin compositions containing the same
09/25/2003WO2003078481A1 Melt-processible poly(tetrafluoroethylene)
09/25/2003WO2003078353A1 Method for the production of a metal-ceramic substrate, preferably a copper-ceramic substrate
09/25/2003WO2003078153A2 Lamination of high-layer-count substrates
09/25/2003WO2003078115A1 Punching machine
09/25/2003WO2003078079A1 Silicone resin based composites interleaved for improved toughness
09/25/2003WO2003018507A3 Dielectric ceramic composition
09/25/2003WO2003007670B1 Method for manufacturing ceramic multilayer circuit board
09/25/2003US20030181560 Used for forming or sealing electrical, electronic and mechanical parts for industrial devices, such as communication devices and automotive devices; substrate film for printed circuit boards
09/25/2003US20030181537 Process for producing dielectric layers by using multifunctional carbosilanes
09/25/2003US20030181321 Composite particles for electrocatalytic applications
09/25/2003US20030181106 Power connector
09/25/2003US20030181104 Grouped element transmission channel link termination assemblies
09/25/2003US20030181080 Guide insert for PCI connector receptacle
09/25/2003US20030181075 Right-angle power interconnect electronic packaging assembly
09/25/2003US20030181072 Circuit card having recessed terminal array
09/25/2003US20030181038 Process and apparatus for manufacturing printed circuit boards
09/25/2003US20030180536 Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances
09/25/2003US20030180510 Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board
09/25/2003US20030180011 Apparatus for enhancing impedance-matching in a high-speed data communications system
09/25/2003US20030179978 Optical transmission sheet, optoelectric apparatus, and optical transmission method
09/25/2003US20030179741 High-speed router with single backplane distributing both power and signaling
09/25/2003US20030179558 Transmission line with integrated connection pads for circuit elements
09/25/2003US20030179557 Process and apparatus for manufacturing printed circuit boards
09/25/2003US20030179555 Rotary structure for relaying signals
09/25/2003US20030179552 Printed circuit board and method of producing the same
09/25/2003US20030179551 Circuit board connection structure, method for forming the same, and display device having the circuit board connection structure
09/25/2003US20030179548 Flexible interconnect structures for electrical devices and light sources incorporating the same
09/25/2003US20030179546 Electronic apparatus
09/25/2003US20030179532 High-speed electrical router backplane with noise-isolated power distribution
09/25/2003US20030179158 Wiring substrate connected structure, and display device
09/25/2003US20030179144 Antenna and communication equipment incorporating the antenna
09/25/2003US20030179055 System and method of providing highly isolated radio frequency interconnections
09/25/2003US20030179050 Grouped element transmission channel link with power delivery aspects
09/25/2003US20030179049 Passive transmission line equalization using circuit-board thru-holes
09/25/2003US20030178726 Semiconductor device built-in multilayer wiring board and method of manufacturing same
09/25/2003US20030178724 Film carrier tape for mounting electronic devices thereon and method of manufacturing the same
09/25/2003US20030178722 Molded substrate stiffener with embedded capacitors
09/25/2003US20030178713 Wiring board, method for manufacturing wiring board and electronic component using wiring board
09/25/2003US20030178657 Transimpedance amplifier assembly with separate ground leads and separate power leads for included circuits
09/25/2003US20030178477 Method and apparatus for securing an electrically conductive interconnect through a metallic substrate
09/25/2003US20030178470 Method of recovering lead-free solder from printed circuit boards
09/25/2003US20030178398 Machining device and machining method
09/25/2003US20030178396 Automated trim processing system
09/25/2003US20030178388 Inverted micro-vias
09/25/2003US20030178229 Multilayered printed wiring board
09/25/2003US20030178228 Method for scalable architectures in stackable three-dimentsional integrated circuits and electronics
09/25/2003US20030178227 Transfer sheet and production method of the same and wiring board and production method of the same
09/25/2003US20030177639 Process and apparatus for manufacturing printed circuit boards
09/25/2003US20030177638 Method of fabricating a high-layer-count backplane
09/25/2003US20030177637 Impedance matching connection scheme for high frequency circuits
09/25/2003US20030177634 Subtractive process for fabricating cylindrical printed circuit boards
09/25/2003DE20307468U1 Light emitting diode circuit on three-layer board, includes through-contacts for thermal dissipation at diode contact areas
09/25/2003DE10233318C1 Interference suppression device for electronic apparatus uses capacitor connected between plug element for apparatus circuit and housing potential
09/25/2003DE10211826C1 Terminal rail connector plug has contact elements cooperating with terminal rails provided by metallised structure within plastics lower half of connector plug
09/25/2003CA2478884A1 A measurement arrangement and telecommunications assembly
09/24/2003EP1347674A2 Technique for reducing the number of layers in a multilayer circuit board
09/24/2003EP1347475A1 Laminated circuit board and production method for electronic part, and laminated electronic part
09/24/2003EP1347474A1 Semiconductor device, and method and apparatus for manufacturing semiconductor device
09/24/2003EP1347470A1 Electrical devices comprising a conductive polymer
09/24/2003EP1346615A1 A multi-chip integrated circuit carrier
09/24/2003EP1346613A1 Via-in-pad with off-center geometry and methods of manufacture
09/24/2003EP1346410A1 Flexible electronic device
09/24/2003EP1183905B1 Mounting of the coil in an electroacoustic transducer
09/24/2003EP1090535A4 Flip chip devices with flexible conductive adhesive
09/24/2003EP0936231B1 Modified thermoplastic norbornene polymer and process for the production thereof
09/24/2003CN2575728Y Full-automatic crude oil electric dewatering power supply controller
09/24/2003CN1444838A Electronic supports and methods and apparatus for forming apertures in electronic supports
09/24/2003CN1444837A Wiring board
09/24/2003CN1444621A Dielectric resin foam and lens antenna comprising the same
09/24/2003CN1444436A Printed circuit board and making method thereof
09/24/2003CN1444435A Printed circuit board producing method
09/24/2003CN1444434A Method for making laminated plate covered with metal for printed circuit board
09/24/2003CN1444277A Semiconductor assembly
09/24/2003CN1444273A 电子装置 Electronic devices
09/24/2003CN1444270A COF flexible printed circuit board and method for making said circuit board
09/24/2003CN1444269A Multi-layer semiconductor device and its mfg. method
09/24/2003CN1444051A Low-intensity magnetic field and its mfg. method using printed circuit board mfg. technology
09/24/2003CN1444050A Low-intensity magnetic field and its mfg. method using printed circuit board mfg. technology
09/24/2003CN1444049A Low-intensity magnetic field sensor using printed circuit board mfg. thchnology and its mfg. method
09/24/2003CN1443805A Filling material composition for printing distributing board
09/24/2003CN1122310C Static electricity removing structure for portable electronic devices
09/24/2003CN1122084C Polyamide composition
09/24/2003CN1121942C Composite base laminated board covered with copper foil and its production method
09/23/2003US6625682 Electromagnetically-coupled bus system
09/23/2003US6625040 Shielded PC board for magnetically sensitive integrated circuits
09/23/2003US6625038 Functional asymmetrical circuit substrate assembly including a mirror-symmetrical component layout
09/23/2003US6625037 Printed circuit board and method manufacturing the same