Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2003
10/07/2003US6630836 CSP BGA test socket with insert
10/07/2003US6630737 Integrated circuit package, ball-grid array integrated circuit package
10/07/2003US6630686 Liquid crystal display having pad parts and method for manufacturing same
10/07/2003US6630631 Apparatus and method for interconnection between a component and a printed circuit board
10/07/2003US6630629 Wiring substrate
10/07/2003US6630628 High-performance laminate for integrated circuit interconnection
10/07/2003US6630627 Multilayered wiring substrate with dummy wirings in parallel to signal wirings and with
10/07/2003US6630417 Capable of being fired at low temperature; non-oxide ceramic filler and borosilicate glass having a glass transition temperature of 800 degrees C. or lower
10/07/2003US6630370 Process for manufacturing IC card
10/07/2003US6630365 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures
10/07/2003US6630287 Method for forming thick film pattern and photosensitive paste used therefor
10/07/2003US6630251 Containing tin and lead with copper and/or nickel
10/07/2003US6630009 For computerized production of three dimensional sintered bodies by solid freeform fabrication, including binding agent charged with metal powder
10/07/2003US6629850 Electrical connection box for a vehicle
10/07/2003US6629848 Method for providing uniform pressure
10/07/2003US6629765 Spread illuminating apparatus with printed circuit board having elastic force
10/07/2003US6629484 Cutter wheel for brittle sheets
10/07/2003US6629367 Punching apertures through alumina or zirconia layers, filling with curable and conductor pastes, then hardening and sintering to form monolithic structures; connecting electrical and electronic apparatus
10/07/2003US6629362 Method of manufacturing a circuit print board
10/07/2003US6629348 Etching polyimide surfaces than laminating and joining metal foils onto thin films comprising polyimides, polyesters, polyethers, polyanilines, copolymers or mixtures forming high density printed circuits having flexibility
10/02/2003WO2003081967A1 Flexible interconnect structures for electrical devices and light sources incorporating the same
10/02/2003WO2003081966A2 Process and apparatus for manufacturing printed circuit boards
10/02/2003WO2003081643A2 Apparatus for enhancing impedance-matching in a high-speed data communications system
10/02/2003WO2003081614A1 'a magnetic structure assembly'
10/02/2003WO2003037664A3 Motor fan system which is intended, in particular, for a motor vehicle heating and/or air-conditioning system
10/02/2003WO2002103789A3 Electronic assembly with laterally connected capacitors and manufacturing method
10/02/2003US20030188047 Systems and methods for processing I/O
10/02/2003US20030186674 High quality factor (Q) planar spiral inductor based CATV diplexer and telephony module
10/02/2003US20030186590 Card-edge connector
10/02/2003US20030186589 Electrical connector for interconnection of multiple printed circuit board ground planes
10/02/2003US20030186569 . Component mounting structure
10/02/2003US20030186473 Electrical print resolution test die
10/02/2003US20030186169 Disposing on a substrate surface a B-staged dielectric matrix comprising dielectric matrix materials and a removable porogen; curing; patterning the dielectric matrix material; depositing a metal layer; removing porogen
10/02/2003US20030186168 Disposing on a substrate surface a B-staged dielectric matrix comprising dielectric matrix materials and a removable porogen; curing; patterning the dielectric matrix material; depositing a metal layer; removing porogen
10/02/2003US20030186068 Suitable for an electronic part such as a flexible printed wiring board
10/02/2003US20030185572 Packaging for optical transceiver module
10/02/2003US20030184986 Circuit board and electronic device, and method of manufacturing same
10/02/2003US20030184985 Electronic device manufacturing method, electronic device and resin filling method
10/02/2003US20030184980 Circuit board with integrated circuit
10/02/2003US20030184976 Electromagnetic interference shield for overmolded packaging of an electronic assembly
10/02/2003US20030184970 Cooling arrangement and electrical apparatus with cooling arrangement
10/02/2003US20030184969 Electronic control unit
10/02/2003US20030184953 Structure of an interleaving striped capacitor substrate
10/02/2003US20030184880 Lens device and method of assembly of lens device
10/02/2003US20030183930 Semiconductor device and semiconductor module
10/02/2003US20030183925 Semiconductor module
10/02/2003US20030183918 Tape Carrier Package
10/02/2003US20030183421 Apparatus and method for interconnection between a component and a printed circuit board
10/02/2003US20030183420 Circuit board with via through surface mount device contact
10/02/2003US20030183419 Ball assignment for ball grid array package
10/02/2003US20030183418 Electrical circuit and method of formation
10/02/2003US20030183417 Method and arrangement for replacing a board-mounted electric circuit component
10/02/2003US20030183415 Method and arrangement for replacing a board-mounted electric circuit component
10/02/2003US20030183406 Micro-spring interconnect systems for low impedance high power applications
10/02/2003US20030183405 Electrical circuit and substrate therefor
10/02/2003US20030183318 Shrinkage inhibition, dimemsional accuracy
10/01/2003EP1349440A1 Backplane
10/01/2003EP1349418A2 Method and device for overvoltage protection at a bus interface of a time switch board in an exchange
10/01/2003EP1349271A2 Electronic device for supplying DC power comprising a noise filter
10/01/2003EP1349209A2 Surveying device for the temperature of electronic components
10/01/2003EP1348322A2 Interconnecting module for the base of electronic equipment casing
10/01/2003EP1348321A2 Manufacture of printed circuits using single layer processing techniques
10/01/2003EP1348234A1 A method and an arrangement for providing vias in printed circuit boards
10/01/2003EP1348224A1 A connection between a conductive substrate and a laminate
10/01/2003EP1348140A2 Layered circuit boards and methods of production thereof
10/01/2003EP1348044A1 Device and method for electrochemically treating a band-shaped product
10/01/2003EP1256144B1 Method for contacting a printed circuit board to a conductor arranged on a support, and device
10/01/2003EP1254494B1 Printed circuit board and connector assembly
10/01/2003EP1036489B1 Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method
10/01/2003CN2576028Y Flexible circuit luminous clothes
10/01/2003CN1446248A Heat resistant resin composition, its heat resistant film or sheet and laminated product containing the film or sheet as base material
10/01/2003CN1446041A Electronic device for supplying power source and noise filter which having high-efficient noise reducing
10/01/2003CN1446040A Method for fixation between electronic parts
10/01/2003CN1446019A Antenna and communication machine with the antenna
10/01/2003CN1445634A Temp. characteristic compensation device
10/01/2003CN1445474A Bar lamp structure
10/01/2003CN1123280C Composition and process for filling vias
10/01/2003CN1123279C Printed circuit board
10/01/2003CN1123029C Thermal release for fixing on circuit substrate
10/01/2003CN1122980C Optical pickup device with biaxial drive for objective lens
10/01/2003CN1122866C Flexible printing wiring substrate, electrooptics arrangement, and electronic device
10/01/2003CN1122787C Remote controller for air conditioner
09/2003
09/30/2003US6628925 Receiver/transmitter apparatus
09/30/2003US6628537 Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems
09/30/2003US6628533 DC-to-DC converter providing high current and low voltage
09/30/2003US6628531 Multi-layer and user-configurable micro-printed circuit board
09/30/2003US6628527 Mounting structure for electronic parts and manufacturing method thereof
09/30/2003US6628526 Electronic device manufacturing method, electronic device and resin filling method
09/30/2003US6628351 Liquid crystal display apparatus
09/30/2003US6628230 Radio frequency module, communication device, and radar device
09/30/2003US6628178 Radio frequency module parts including surface acoustic wave elements and manufacturing method thereof
09/30/2003US6628128 CSP BGA test socket with insert and method
09/30/2003US6627992 Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set
09/30/2003US6627823 Multilayered connection plate
09/30/2003US6627821 Circuit board and method of manufacturing therefor
09/30/2003US6627704 Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
09/30/2003US6627669 Low dielectric materials and methods of producing same
09/30/2003US6627091 Method for producing printed circuit boards with rough conducting structures and at least one area with fine conducting structures
09/30/2003US6627021 Method of manufacturing laminated ceramic electronic component and method of manufacturing laminated inductor
09/30/2003US6627020 Method for sinter distortion control
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