Patents for H05K 1 - Printed circuits (98,583)
10/2003
10/15/2003EP1171932B1 Memory module with offset notches for improved insertion and stability and memory module connector
10/15/2003EP1122274B1 Method for making pi-conjugated water soluble polymers
10/15/2003CN2580725Y Card connector having control chip
10/15/2003CN1449427A Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board
10/15/2003CN1449239A Cooling arrangement and electrical apparatus with cooling arrangement
10/15/2003CN1449236A Flexible base plate
10/15/2003CN1449232A Circuit component built-in module and method of manufacturing the same
10/15/2003CN1449030A Millimeter band module with built-in semiconductor
10/15/2003CN1449029A Circuit base plate, electronic machine, and and method of manufacture
10/15/2003CN1449005A Method for manufacturing semiconductor device
10/15/2003CN1448968A 陶瓷电子部件及其制造方法 The ceramic electronic component and its manufacturing method
10/15/2003CN1124652C Semiconductor device mount structure and semiconductor device mount method
10/15/2003CN1124631C High frequency switching device
10/15/2003CN1124576C Semiconductor equipment with multi-layered coductor configuration
10/15/2003CN1124203C Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
10/15/2003CA2425592A1 Isolating material element for the assembly of inductive electronic components
10/14/2003US6633490 Electronic board assembly including two elementary boards each carrying connectors on an edge thereof
10/14/2003US6633489 Dynamic isolating mount for processor packages
10/14/2003US6633488 Printed circuit board unit with correction member
10/14/2003US6633477 Conductive member
10/14/2003US6633361 LCD panel in which signal line terminals have slits to allow inspection of alignment of the terminals and the TCP leads
10/14/2003US6633207 Continuous transmission line with branch elements, resonator, filter, duplexer, and communication apparatus formed therefrom
10/14/2003US6633137 Electrical apparatus
10/14/2003US6633134 Active-matrix-driven organic EL display device
10/14/2003US6633079 Wafer level interconnection
10/14/2003US6633045 Assembly part with wiring and for manufacturing system, method of manufacturing such assembly part, and semiconductor manufacturing system constituted using assembly part
10/14/2003US6633005 Multilayer RF amplifier module
10/14/2003US6633002 Tape carrier having high flexibility with high density wiring patterns
10/14/2003US6632705 Memory modules and packages using different orientations and terminal assignments
10/14/2003US6632697 Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor
10/14/2003US6632591 Multi-layer laminate for forming thin layer capacitors, resistors or combinations thereof comprising layers of resistive material and dielectric material layer interposed between layers of resistive material
10/14/2003US6632575 Rapid, accurate alignment
10/14/2003US6632511 Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards
10/14/2003US6632343 Applying plating voltage to partially conductive printed circuit board substrate bearing metal traces, performing electrolytic plating operation on substrate, curing substrate thereby rendering it substantially nonconductive
10/14/2003US6632115 Method for forming transparent conductive film using chemically amplified resist
10/14/2003US6631675 Applying mask with recessed blind opening for protecting a previously screened feature
10/14/2003US6631559 Intermittently supplying flat cables in a common direction and transporting in parallel to heat bonding device; synchronization, cutting
10/14/2003US6631558 Blind via laser drilling system
10/14/2003US6631551 Method of forming integral passive electrical components on organic circuit board substrates
10/09/2003WO2003084297A1 Wiring structure and its manufacturing method
10/09/2003WO2003084296A1 Circuit transmission characteristic correcting method, correcting structure thereof, and holder used for the correcting structure
10/09/2003WO2003084295A2 Inductor and decoupling structures for filters and design method thereof
10/09/2003WO2003084026A1 Regulator and rectifier for an electric machine and electric machine
10/09/2003WO2003083940A1 Method of manufacturing heat conductive substrate
10/09/2003WO2003083811A1 Methods and apparatus relating to improved visual recognition and safety
10/09/2003WO2003083770A1 Communication device and package thereof
10/09/2003WO2003083543A1 Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method
10/09/2003WO2003082977A1 Resin containing dielectric filler for formation of built-in capacitor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler, and process for producing copper double clad laminate
10/09/2003WO2003082604A1 Inverted micro-vias
10/09/2003WO2003030247A3 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces
10/09/2003WO2003022020A3 Sheet material and its use in circuit boards
10/09/2003WO2003015482A3 A system and method for unveiling targets embedded in a multi-layered electrical circuit
10/09/2003WO2002052909A3 Flexible printed circuit board
10/09/2003US20030190769 Method of supporting a substrate film
10/09/2003US20030190498 Electromagnetic wave absorber, method of manufacturing the same and appliance using the same
10/09/2003US20030190071 Multi-layer printed circuit board fabrication system and method
10/09/2003US20030189831 Light irradiating unit , lighting unit and method for manufacturing lighting unit
10/09/2003US20030189816 Semiconductor module
10/09/2003US20030189814 Electronic device
10/09/2003US20030189246 Semiconductor built -in millimeter-wave band module
10/09/2003US20030189214 Techniques for joining an opto-electronic module to a semiconductor package
10/09/2003US20030188890 Printed wiring board
10/09/2003US20030188889 Printed circuit board and method for producing it
10/09/2003US20030188888 Multilayer printed wiring board and method for manufacturing same
10/09/2003US20030188887 Integrated lead suspension and method of construction
10/09/2003US20030188429 Method for producing a double-sided wiring board
10/09/2003DE10203151C1 Vorrichtung zum Anschließen von Halbleitermodulen, insbesondere Speicherbänken A device for connecting semiconductor modules, in particular memory banks
10/08/2003EP1351562A2 Electromagnetic interference shield for overmolded packaging of an electronic assembly
10/08/2003EP1351560A2 Electronic apparatus and method for making the same
10/08/2003EP1351302A2 Power semiconductor module
10/08/2003EP1351301A2 Semiconductor built-in millimeter-wave band module
10/08/2003EP1351299A2 Fexible and thin circuit construction
10/08/2003EP1351296A1 Electronic parts mounting substrate and process for manufacturing the same
10/08/2003EP1350815A1 Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film, film for tab, and prepreg
10/08/2003EP1350807A1 Etchant for thermoplastic polyimide resin
10/08/2003EP1350588A2 Method of manufacturing semiconductor device
10/08/2003EP1350417A2 Method for the production of an electronic component
10/08/2003EP1350318A1 Filtering circuit and power supply device equipped with same
10/08/2003EP1350140A2 Positive type photosensitive epoxy resin composition and printed circuit board using the same
10/08/2003EP1350117A2 Air data sensor
10/08/2003EP1350043A1 Plastic control plate for the gearbox control device of a hydraulic motor vehicle
10/08/2003EP1196830B1 A printed circuit production method
10/08/2003CN2579039Y Inputting and outputting devices
10/08/2003CN1447646A Method of producing plants, plant cultivating device, and light-emitting panel
10/08/2003CN1447637A Connection structure of distribution substrate and its display device
10/08/2003CN1447423A Diaphragm bearing belt for mounting electronic device and its mfg. method
10/08/2003CN1447408A Mfg. appts. of electronic device, its mfg. method and mfg. program
10/08/2003CN1447407A Mfg. appts. of electronic device, mfg. method of electronic device and mfg. program of electronic device
10/08/2003CN1447361A 电子设备 Electronic equipment
10/08/2003CN1447358A Nounting structure of two-terminal capacitor and three-terminal capacitor
10/08/2003CN1447293A Circuit board connection structure, method of forming, circuit board connection structure and display device
10/08/2003CN1446768A Dielectric material and dielectric material sintered body and wiring board using such ceramic
10/08/2003CN1123931C Electronic module
10/08/2003CN1123590C Polybenzoxazole resin and its precursor
10/07/2003US6631509 Computer aided design apparatus for aiding design of a printed wiring board to effectively reduce noise
10/07/2003US6631083 Systems with modules and clocking therefore
10/07/2003US6631078 Electronic package with thermally conductive standoff
10/07/2003US6631052 Head interconnect with support material carbonized shunt
10/07/2003US6630869 Very low phase noise temperature stable voltage controlled oscillator
10/07/2003US6630839 Contactor, a method of manufacturing the contactor and a device and method of testing electronic component using the contactor