Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1982
08/17/1982US4344803 Photo cathode made from composite semiconductor/glass material
08/11/1982EP0057645A1 Electrically coded identification of integrated circuit devices
08/11/1982EP0057297A2 Clamping device for holding the disc-shaped semiconductor elements of a current rectifier in compression
08/11/1982EP0057253A2 System carrier tape with a plurality of system carriers for integrated circuits
08/10/1982US4344106 Transistor heat sink assembly
08/10/1982US4344064 Article carrying a distinctive mark
08/10/1982US4343877 System for design and production of integrated circuit photomasks and integrated circuit devices
08/05/1982WO1982002640A1 Universal interconnection substrate
08/05/1982WO1982002603A1 Wafer and method of testing networks thereon
08/04/1982EP0057085A2 Method for manufacturing a hybrid integrated circuit device
08/04/1982EP0056908A2 Semiconductor device
08/04/1982EP0056904A2 High electron mobility single heterojunction semiconductor devices and methods of production of such devices
08/03/1982US4342967 High voltage, high frequency amplifier
08/03/1982US4342151 Photopolymerizing the negative-working resist
07/1982
07/28/1982EP0056482A2 Glass passivation semiconductor device and method of manufacturing the same
07/27/1982US4342099 Electrically erasable programmable MNOS read only memory
07/27/1982US4342069 Integrated circuit package
07/27/1982US4342068 Mounting assembly for semiconductor devices and particularly power transistors
07/27/1982US4342045 Input protection device for integrated circuits
07/27/1982US4341432 Liquid cooled connector for integrated circuit packages
07/22/1982WO1982002458A1 Integrated circuit package
07/22/1982WO1982002457A1 Die attachment exhibiting enhanced quality and reliability
07/21/1982EP0056186A2 Integrated circuit device with interconnect-level logic diodes
07/20/1982US4340902 Semiconductor device
07/20/1982US4340901 Lead connecting structure for a semiconductor device
07/20/1982US4340900 Mesa epitaxial diode with oxide passivated junction and plated heat sink
07/20/1982US4340873 Periodic transmission structure for slow wave signals, for miniaturized monolithic circuit elements operating at microwave frequency
07/20/1982US4340635 Ceramic substrate for fine-line electrical circuitry
07/20/1982US4340436 Process for flattening glass-ceramic substrates
07/20/1982US4340266 Connector system
07/20/1982US4339870 Series-connected two-terminal semiconductor devices and their fabrication
07/20/1982CA1128185A1 Multi-component microcircuit packages
07/20/1982CA1128184A1 Solid state motor control universal assembly means and method
07/14/1982EP0055812A2 Impact pinner apparatus
07/14/1982EP0055811A2 Pinned substrate and method for pinning a substrate
07/14/1982EP0055744A1 Leadless integrated circuit package and connector receptacle therefor
07/13/1982US4339768 Transistors and manufacture thereof
07/13/1982US4339526 Acetylene terminated, branched polyphenylene resist and protective coating for integrated circuit devices
07/13/1982US4339296 Apparatus for adjustably forming pattern in a strip
07/07/1982EP0055640A1 Clamping device for stacked elements of aligned groups, particularly for the electrical connection of conducting elements
07/07/1982EP0055578A2 Integrated circuit package
07/07/1982EP0055451A2 Semiconductor memory device
07/07/1982EP0055376A2 Connection part for removably connecting a semiconductor chip to said part
07/06/1982US4338652 Stack module and stack loader therefor
07/06/1982US4338621 Hermetic integrated circuit package for high density high power applications
07/06/1982US4338620 Semiconductor devices having improved alignment marks
07/06/1982US4338486 Housing for electrical and electronic components
07/06/1982CA1127319A1 Lead frames
06/1982
06/30/1982EP0055161A1 Multilayer metal silicide interconnections for integrated circuits
06/30/1982EP0055038A2 Control of a signal voltage for a semiconductor device
06/30/1982EP0054740A2 Zener diode burn prom
06/30/1982EP0054597A1 Cooling device for module pins
06/29/1982US4337182 Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation
06/29/1982US4337115 Method of forming electrodes on the surface of a semiconductor substrate
06/29/1982US4337089 Phosphorus, melting, casting, rolling, annealing
06/29/1982CA1126874A1 Multi-layer dielectric structure
06/29/1982CA1126845A1 Electronic circuit module cooling
06/29/1982CA1126629A1 Hybrid process for sbd metallurgies
06/23/1982EP0054539A2 A semiconductor integrated circuit device with an improved heat sink
06/23/1982EP0054129A2 Method for forming a conductor line in an integrated semiconductor memory and an integrated semiconductor memory with cells including a capacitor and a field effect transistor
06/23/1982EP0054121A1 Method of manufacturing a one-transistor memory cell using the single silicon layer technique
06/23/1982EP0054102A2 Very high density cells comprising a ROM and method of manufacturing same
06/23/1982EP0054069A1 Heat pin integrated circuit packaging
06/22/1982US4336088 Method of fabricating an improved multi-layer ceramic substrate
06/22/1982US4335781 High power cooler and method thereof
06/22/1982US4335506 Method of forming aluminum/copper alloy conductors
06/16/1982EP0053967A1 Removable cooling device for an integrated-circuit mounting
06/16/1982EP0053966A1 Automatic machine for bending the connection leads for integrated-circuit chips
06/16/1982EP0053812A2 Thyristor stack
06/16/1982EP0053712A1 Method of improving the conductivity of a microelectronic conductive tungsten silicide film and semiconductor device comprising said film
06/15/1982US4335392 Semiconductor device with at least two semiconductor elements
06/15/1982US4334349 Method of producing semiconductor device
06/15/1982CA1125923A1 Process for forming glass-sealed multichip semiconductor devices
06/09/1982EP0053280A1 Sealing composition, method for preparing said composition, integrated circuit module sealed therewith, and process for sealing
06/08/1982US4334236 One-transistor dynamic ram with poly bit lines
06/08/1982CA1125439A1 Passivating composite for a semiconductor device comprising a silicon nitride (si.sub.3n.sub.4) layer and phosphosilicate glass (psg) layer and the method of manufacturing the same
06/02/1982EP0053030A2 Heatsink for integrated circuit device
06/02/1982EP0052920A2 Electronic circuit interconnection system
06/01/1982US4333102 High performance semiconductor component with heat dissipating discs connected by brushlike bundles of wires
06/01/1982US4333101 Semiconductor heat sink mounting assembly
06/01/1982US4333099 In mos semiconductor devices
06/01/1982US4332839 Method for making integrated semiconductor circuit structure with formation of Ti or Ta silicide
06/01/1982US4332837 Polycrystalline silicon doped with oxygen
06/01/1982US4332537 Encapsulation mold with removable cavity plates
06/01/1982US4332343 Process for in-situ modification of solder comopsition
06/01/1982US4332341 Fabrication of circuit packages using solid phase solder bonding
06/01/1982US4332078 Method of manufacturing a semiconductor device
06/01/1982CA1124789A1 Solid state fluid cooled power element
06/01/1982CA1124788A1 High current low voltage liquid cooled switching regulator dc power supply
05/1982
05/27/1982WO1982001803A1 Multiple terminal two conductor layer burn-in tape
05/27/1982WO1982001712A1 Transparent coating composition for antistatic use
05/26/1982EP0052475A2 Semiconductor device and method for manufacturing the same
05/26/1982EP0052450A1 Method of manufacturing a semiconductor device with polycrystalline semiconductor cum metal electrodes
05/26/1982EP0052309A1 Method of manufacturing a semiconductor element
05/26/1982EP0052277A2 Semiconductor device and process for producing same
05/25/1982US4331970 Rutile filled polyimides containing polysiloxane groups derived from bix(3-aminopropyl)tetramethylsiloxane
05/25/1982US4331948 High powered over-voltage protection
05/25/1982US4331831 Package for semiconductor integrated circuits
05/25/1982US4331758 Process for the preparation of large area TFT arrays
05/25/1982US4331740 Gang bonding interconnect tape process and structure for semiconductor device automatic assembly