Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1983
03/08/1983CA1142585A1 Semiconductor apparatus and method for rectifying
03/08/1983CA1142340A1 Conductive epoxy resin formulation and electrical devices in which said resin serves as a bonding medium
03/02/1983EP0073149A2 Semiconductor chip mounting module
03/02/1983EP0073075A2 Semiconductor device comprising polycrystalline silicon and method of producing the same
03/02/1983EP0072966A2 Integrated circuit structure and method for forming a recessed isolation structure for integrated circuits
03/01/1983US4375606 Microelectronic device
03/01/1983US4375578 Semiconductor device and method of making the same
03/01/1983US4375157 Downhole thermoelectric refrigerator
03/01/1983US4375125 Method of passivating pn-junction in a semiconductor device
03/01/1983CA1142275A1 Self-aligned method for making bipolar transistor having minimum base to emitter contact spacing
03/01/1983CA1142271A1 Field effect semiconductor device
03/01/1983CA1142270A1 Self-alignment method of depositing semiconductor metallization
03/01/1983CA1142264A1 Contact technique for electrical circuitry
03/01/1983CA1142262A1 Semiconductor contact shim and attachment method
03/01/1983CA1142261A1 Interconnection of opposite conductivity type semiconductor regions
03/01/1983CA1142260A1 Double cavity semiconductor chip carrier
02/1983
02/23/1983EP0072759A2 Electronic module for an automatic-transaction card, and card comprising such a module
02/23/1983EP0072673A2 Area tape for the electrical interconnection between electronic components and external circuitry
02/23/1983EP0072647A2 Varactor trimming for MMICS
02/23/1983EP0072644A2 Semiconductor chip carrier
02/23/1983EP0072545A2 Semiconductor module with a plurality of semiconductor elements
02/23/1983EP0072522A2 Process for manufacturing integrated MOS field effect transistors, particularly circuits having complementary MOS field effect transistors with an additional conductor level comprising metal silicides
02/23/1983EP0072492A2 Integrated-circuit module for an electronic apparatus with a plug-in device
02/23/1983EP0072478A2 High-voltage rectifier
02/22/1983US4375087 Electrically erasable programmable read only memory
02/22/1983US4375073 Dual-monitoring protection circuit for switching transistor
02/22/1983US4375008 Method for encapsulating components with cases and an encapsulation provided by the method
02/22/1983US4374457 Method of fabricating complex micro-circuit boards and substrates
02/22/1983US4374454 Multistage oxidation of a masked silicon surface
02/22/1983CA1141869A1 Method for manufacturing a semiconductor device
02/22/1983CA1141528A1 Conductive adhesive system including a conductivity enhancer
02/17/1983WO1983000585A1 Module mounting assembly
02/16/1983EP0072273A2 Low temperature integrated circuit die attachment process
02/16/1983EP0071827A2 Electronic device electrically connected to external contact elements
02/16/1983EP0071748A2 Thermal conduction element for semiconductor devices
02/16/1983EP0071709A2 Flexible thermal conduction element for cooling semiconductor devices
02/15/1983US4374394 Monolithic integrated circuit
02/15/1983US4374392 Monolithic integrated circuit interconnection and fabrication method
02/15/1983US4374316 Semiconductor integrated circuit supporter having a heating element
02/15/1983US4374179 Plasma polymerized ethane for interlayer dielectric
02/15/1983US4373974 Dispersion comprising fine metal particles, thixotropic agent, solvent, and rosin-type flux; printed circuits
02/15/1983US4373778 Connector implemented with fiber optic means and site therein for integrated circuit chips
02/15/1983US4373255 Forming a thermally crystallized pure silicon dioxide layer while preventing reaction of contact metals with environment
02/15/1983US4373251 Method of manufacturing a semiconductor device
02/15/1983US4373248 Method of making high density semiconductor device such as floating gate electrically programmable ROM or the like
02/09/1983EP0071423A2 Packages for enclosing semiconductor elements
02/09/1983EP0071314A2 Semiconductor devices and a solder for use in such devices
02/09/1983EP0071311A2 Method of producing contact elements mounted on the connection surfaces of an integrated component
02/09/1983EP0071255A2 Portable card for information processing
02/09/1983EP0071233A2 Electrical component, component group or integrated circuit put in a container
02/09/1983EP0071031A2 Carrier for an IC component
02/09/1983EP0071010A2 Method for planarizing an integrated circuit structure
02/09/1983EP0070862A1 Button rectifier package for non-planar die
02/09/1983EP0070861A1 Wafer and method of testing networks thereon.
02/09/1983EP0070859A1 Button rectifier package
02/08/1983US4372996 Immersion zinc bath of zinc sulfate, hydrofluoric acid, citric acid, ammonium hydroxide
02/01/1983US4371912 Method of mounting interrelated components
02/01/1983US4371744 Substrate for interconnecting electronic integrated circuit components having a repair arrangement enabling modification of connections to a mounted chip device
02/01/1983US4371231 Electrically conductive connection of the active portions of an electrical component or of an integrated circuit to terminals
02/01/1983US4371012 Apparatus for working leads of electrical components
02/01/1983US4370805 Circuit package handling apparatus
02/01/1983US4370798 Interlevel insulator for integrated circuit with implanted resistor element in second-level polycrystalline silicon
02/01/1983CA1140682A1 Intermetallic barrier region for gold conductor contacts
02/01/1983CA1140681A1 Slotted heat sinks for high powered air cooled modules
01/1983
01/26/1983EP0070737A2 Semiconductor device having an electrode, and method for producing the same
01/26/1983EP0070713A2 A semiconductor device comprising a bulk-defect region and a process for producing such a semiconductor device
01/26/1983EP0070691A1 Tape for tape-automated-bonding of integrated circuits and method of producing the tape
01/26/1983EP0070533A2 Substrate for semiconductor chips
01/26/1983EP0070435A2 Semiconductor device comprising a semiconductor substrate bonded to a mounting means
01/26/1983EP0070426A2 Dense dynamic memory cell structure and manufacturing process
01/25/1983US4370671 Semiconductor device
01/25/1983US4370292 Encapsulation of electronic device
01/25/1983US4369838 Device for releasing heat
01/25/1983US4369564 VMOS Memory cell and method for making same
01/20/1983WO1983000244A1 Means and method for disabling access to a memory
01/19/1983EP0070242A2 Tape automated bonding for integrated circuits
01/19/1983EP0070120A1 Dual-in-line package assembly
01/19/1983EP0070104A2 Circuit matching elements
01/19/1983EP0069985A2 Protection arrangement for semiconductor arrangements
01/19/1983EP0069963A1 Vitreous material and its use in a semiconducting component
01/19/1983EP0069903A2 Electrical connecting-link for semiconductor components
01/19/1983EP0069902A2 Current rectifier device
01/19/1983EP0069901A2 Current rectifier module
01/19/1983EP0069762A1 Universal interconnection substrate.
01/19/1983EP0069733A1 Integrated circuit package
01/18/1983US4369458 Self-aligned, flip-chip focal plane array configuration
01/18/1983US4369330 Housing for electrical components, component groups or integrated circuit
01/12/1983EP0069511A1 Fabricating integrated circuits
01/12/1983EP0069505A2 Semiconductor device connection lead formation
01/12/1983EP0069390A2 Lead frame for plastic encapsulated semiconductor device
01/11/1983US4368448 Water cooling apparatus for electric circuit elements
01/11/1983US4368106 For high-speed transfer of signals between integrated circuits
01/11/1983CA1139455A1 High cut-off frequency planar schottky diode in a transmission line
01/06/1983WO1983000074A1 Semiconductor rectifier
01/05/1983EP0068753A2 Hybrid integrated circuit device
01/05/1983EP0068414A2 Process for manufacturing components comprising semiconductor chips
01/05/1983EP0068156A2 Process for forming a protective coating on integrated circuit devices
01/05/1983EP0068154A2 Integrated circuit containing a semiconductive substrate having field isolation regions and electrically conductive regions
01/05/1983EP0068142A2 Gas cooled modules for electrical components
01/05/1983EP0068091A2 Method for connecting a semiconductor chip to a substrate and such connection