Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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03/03/1982 | EP0046525A2 Planar multi-level metal-insulator structure comprising a substrate, a conductive interconnection pattern and a superposed conductive structure and a method to form such a structure |
03/02/1982 | US4318169 Suspension-mounted static electrical converter |
03/02/1982 | US4317275 Method for making a depletion controlled switch |
03/02/1982 | US4317274 Method of producing a semiconductor device |
03/02/1982 | US4317272 High density, electrically erasable, floating gate memory cell |
02/24/1982 | EP0046371A1 Method of manufacturing a semiconductor device |
02/23/1982 | US4317125 Field effect devices and their fabrication |
02/17/1982 | EP0046107A1 Semiconductor device utilizable at very high frequencies, and method of making the same |
02/17/1982 | EP0045895A1 Device for changing the electrical configuration of integrated circuits |
02/17/1982 | EP0045891A2 High powered over-voltage protection |
02/17/1982 | EP0045877A1 Laminated ceramic sheet printed circuit components including capacitance means |
02/16/1982 | US4316204 Optoelectronic semiconductor device |
02/16/1982 | US4316200 Contact technique for electrical circuitry |
02/16/1982 | US4315985 Fine-line circuit fabrication and photoresist application therefor |
02/16/1982 | US4315782 Method of making semiconductor device with passivated rectifying junctions having hydrogenated amorphous regions |
02/16/1982 | US4315591 Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer |
02/16/1982 | US4315417 Borehole logging tool cryostat |
02/10/1982 | EP0045644A2 Metallic contacts to compound semiconductor devices |
02/10/1982 | EP0045561A2 Semiconductor device comprising memory circuits |
02/10/1982 | EP0045405A2 Method of forming aluminum/copper alloy conductors |
02/10/1982 | EP0045403A1 Method of producing a device to reduce the influence of radiation on MOS memory cells |
02/04/1982 | WO1982000386A1 Leadless integrated circuit package and connector receptacle therefor |
02/04/1982 | WO1982000385A1 Method and means of resistively contacting and interconnecting semiconductor devices |
02/02/1982 | US4314271 Two semiconductor diode rectifier structure |
02/02/1982 | US4314270 Hybrid thick film integrated circuit heat dissipating and grounding assembly |
02/02/1982 | US4314268 Integrated circuit with shielded lead patterns |
02/02/1982 | US4314225 Pressure sensor having semiconductor diaphragm |
02/02/1982 | US4313900 Method of forming a ceramic article with a glassy surface |
02/02/1982 | US4313809 Method of reducing edge current leakage in N channel silicon-on-sapphire devices |
02/02/1982 | US4313492 Micro helix thermo capsule |
02/02/1982 | US4313317 Borehole logging tool cryostat |
02/02/1982 | US4313262 Molybdenum substrate thick film circuit |
02/02/1982 | CA1117653A1 Wafer indexing system |
01/27/1982 | EP0044755A2 Encapsulating housing resistant against high external pressures for a hybrid circuit |
01/26/1982 | US4313128 Compression bonded electronic device comprising a plurality of discrete semiconductor devices |
01/26/1982 | US4313026 Borosilicate glass, alumina ceramic |
01/26/1982 | US4312926 Automatic assembly tape |
01/26/1982 | US4312680 Self-aligned process; lateral diffusion of etch limiting element |
01/26/1982 | US4312192 Borehole logging tool cryostat |
01/26/1982 | US4312117 Integrated test and assembly device |
01/26/1982 | US4312116 Flowing an epoxy on back and around edges, gelation, outgasssing, curing without allowing decrease in temperature |
01/26/1982 | CA1117221A1 Thermally isolated monolithic semiconductor die |
01/20/1982 | EP0044136A1 Encapsulation of electronic device |
01/20/1982 | EP0044048A1 Glass passivated high power semiconductor devices |
01/20/1982 | EP0043955A1 Method of forming a glass-ceramic structure |
01/20/1982 | EP0043943A2 Method for forming field effect transistor integrated circuits having a pattern of narrow dimensioned dielectric regions and resulting structures |
01/20/1982 | EP0043930A2 Semiconductor device |
01/20/1982 | EP0043818A1 Method of and apparatus for active electrochemical water and similar environmental contaminant elimination in semiconductor and other electronic and electrical devices and the like |
01/19/1982 | US4312046 Vertical fuse and method of fabrication |
01/19/1982 | US4312012 Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant |
01/19/1982 | US4311727 Method for multilayer circuits and methods for making the structure |
01/19/1982 | CA1116708A1 Connector system for connection of leadless large scale integrated circuit devices to a printed circuit board |
01/13/1982 | EP0043778A1 Method and apparatus for presoldering solder balls on contact strips |
01/13/1982 | EP0043451A2 Process for selectively forming refractory metal silicide layers on semiconductor devices |
01/13/1982 | EP0043404A2 Pin for brazing to a substrate |
01/12/1982 | US4310569 Method of adhesion of passivation layer to gold metalization regions in a semiconductor device |
01/12/1982 | US4310363 Insulative body or panel |
01/12/1982 | US4309813 Mask alignment scheme for laterally and totally dielectrically isolated integrated circuits |
01/12/1982 | CA1116308A1 Tape automated bonding test board |
01/06/1982 | EP0043244A2 Single polycrystalline silicon static FET flip flop memory cell |
01/06/1982 | EP0043136A1 Cutting disk provided with pigments |
01/06/1982 | EP0043029A2 Sintered multi-layer ceramic substrate and method of making same |
01/06/1982 | EP0043028A1 Process for the preparation of ceramic substrates with glazed surfaces |
01/06/1982 | EP0043014A2 Integrated circuit chip transmission line |
01/06/1982 | EP0042987A2 Electronic circuit chip carrier |
01/06/1982 | EP0042947A1 Double polysilicon contact structure and process for making such structure |
01/06/1982 | EP0042943A1 Multilayer integrated circuit substrate structure and process for making such structures |
01/05/1982 | US4309485 Enameled steel plate |
01/05/1982 | CA1115857A1 Semiconductor absolute pressure transducer assembly and method |
01/05/1982 | CA1115853A1 Integrated circuit with built-in repair device |
01/05/1982 | CA1115852A1 Mounting and packaging of silicon devices on ceramic substrates, and assemblies containing silicon devices |
01/05/1982 | CA1115822A1 Cooling tunnels for semiconductor devices |
01/05/1982 | CA1115820A1 Electrical connector for use in mounting an electronic device on a substrate |
12/30/1981 | EP0042693A2 Semi-conductor power device assembly and method of manufacture thereof |
12/30/1981 | EP0042643A1 Method of manufacturing a semiconductor device and semiconductor device manufactured by using said method |
12/30/1981 | EP0042581A2 Integrated circuit |
12/30/1981 | EP0042417A1 Fabrication of circuit packages. |
12/30/1981 | EP0042380A1 Method for achieving ideal impurity base profile in a transistor. |
12/29/1981 | US4308339 Integrated circuit chips |
12/29/1981 | US4308090 Method of manufacturing a semiconductor device |
12/29/1981 | US4308089 Sputtering in an ammonia atmosphere followed by washing with a liquid |
12/24/1981 | WO1981003734A1 Heat pin integrated circuit packaging |
12/23/1981 | EP0042351A2 Supporting element for integrated circuit |
12/22/1981 | US4307437 Semiconductor rectifier assembly, particularly for combination with an automotive-type alternator, and method of manufacture |
12/22/1981 | US4307147 Highly thermal conductive and electrical insulating substrate |
12/22/1981 | US4307132 Method for fabricating a contact on a semiconductor substrate by depositing an aluminum oxide diffusion barrier layer |
12/22/1981 | US4306915 Method of making electrode wiring regions and impurity doped regions self-aligned therefrom |
12/22/1981 | CA1114936A1 All metal flat package |
12/16/1981 | EP0041844A2 Semiconductor integrated circuit devices |
12/16/1981 | EP0041770A2 A programmable read-only-memory element and method of fabrication thereof |
12/16/1981 | EP0041684A1 Method for preparing the following bonding of silicon devices provided with an aluminium layer |
12/16/1981 | EP0041662A1 Resin encapsulation type semiconductor device |
12/16/1981 | EP0041600A1 Method for passivating a semiconductor device |
12/15/1981 | US4306275 Hybrid integrated circuit unit |
12/15/1981 | US4306246 Method for trimming active semiconductor devices |
12/15/1981 | US4305897 In thermoplastic molds |
12/15/1981 | US4305767 Label system for making integrated circuit diagrams and printed circuit boards |
12/15/1981 | CA1114485A1 All metal flat package having excellent heat transfer characteristics |
12/15/1981 | CA1114483A1 Laminated photovoltaic generator panel |
12/08/1981 | US4305088 Semiconductor device including means for alleviating stress caused by different coefficients of thermal expansion of the device components |