Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1982
03/03/1982EP0046525A2 Planar multi-level metal-insulator structure comprising a substrate, a conductive interconnection pattern and a superposed conductive structure and a method to form such a structure
03/02/1982US4318169 Suspension-mounted static electrical converter
03/02/1982US4317275 Method for making a depletion controlled switch
03/02/1982US4317274 Method of producing a semiconductor device
03/02/1982US4317272 High density, electrically erasable, floating gate memory cell
02/1982
02/24/1982EP0046371A1 Method of manufacturing a semiconductor device
02/23/1982US4317125 Field effect devices and their fabrication
02/17/1982EP0046107A1 Semiconductor device utilizable at very high frequencies, and method of making the same
02/17/1982EP0045895A1 Device for changing the electrical configuration of integrated circuits
02/17/1982EP0045891A2 High powered over-voltage protection
02/17/1982EP0045877A1 Laminated ceramic sheet printed circuit components including capacitance means
02/16/1982US4316204 Optoelectronic semiconductor device
02/16/1982US4316200 Contact technique for electrical circuitry
02/16/1982US4315985 Fine-line circuit fabrication and photoresist application therefor
02/16/1982US4315782 Method of making semiconductor device with passivated rectifying junctions having hydrogenated amorphous regions
02/16/1982US4315591 Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer
02/16/1982US4315417 Borehole logging tool cryostat
02/10/1982EP0045644A2 Metallic contacts to compound semiconductor devices
02/10/1982EP0045561A2 Semiconductor device comprising memory circuits
02/10/1982EP0045405A2 Method of forming aluminum/copper alloy conductors
02/10/1982EP0045403A1 Method of producing a device to reduce the influence of radiation on MOS memory cells
02/04/1982WO1982000386A1 Leadless integrated circuit package and connector receptacle therefor
02/04/1982WO1982000385A1 Method and means of resistively contacting and interconnecting semiconductor devices
02/02/1982US4314271 Two semiconductor diode rectifier structure
02/02/1982US4314270 Hybrid thick film integrated circuit heat dissipating and grounding assembly
02/02/1982US4314268 Integrated circuit with shielded lead patterns
02/02/1982US4314225 Pressure sensor having semiconductor diaphragm
02/02/1982US4313900 Method of forming a ceramic article with a glassy surface
02/02/1982US4313809 Method of reducing edge current leakage in N channel silicon-on-sapphire devices
02/02/1982US4313492 Micro helix thermo capsule
02/02/1982US4313317 Borehole logging tool cryostat
02/02/1982US4313262 Molybdenum substrate thick film circuit
02/02/1982CA1117653A1 Wafer indexing system
01/1982
01/27/1982EP0044755A2 Encapsulating housing resistant against high external pressures for a hybrid circuit
01/26/1982US4313128 Compression bonded electronic device comprising a plurality of discrete semiconductor devices
01/26/1982US4313026 Borosilicate glass, alumina ceramic
01/26/1982US4312926 Automatic assembly tape
01/26/1982US4312680 Self-aligned process; lateral diffusion of etch limiting element
01/26/1982US4312192 Borehole logging tool cryostat
01/26/1982US4312117 Integrated test and assembly device
01/26/1982US4312116 Flowing an epoxy on back and around edges, gelation, outgasssing, curing without allowing decrease in temperature
01/26/1982CA1117221A1 Thermally isolated monolithic semiconductor die
01/20/1982EP0044136A1 Encapsulation of electronic device
01/20/1982EP0044048A1 Glass passivated high power semiconductor devices
01/20/1982EP0043955A1 Method of forming a glass-ceramic structure
01/20/1982EP0043943A2 Method for forming field effect transistor integrated circuits having a pattern of narrow dimensioned dielectric regions and resulting structures
01/20/1982EP0043930A2 Semiconductor device
01/20/1982EP0043818A1 Method of and apparatus for active electrochemical water and similar environmental contaminant elimination in semiconductor and other electronic and electrical devices and the like
01/19/1982US4312046 Vertical fuse and method of fabrication
01/19/1982US4312012 Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
01/19/1982US4311727 Method for multilayer circuits and methods for making the structure
01/19/1982CA1116708A1 Connector system for connection of leadless large scale integrated circuit devices to a printed circuit board
01/13/1982EP0043778A1 Method and apparatus for presoldering solder balls on contact strips
01/13/1982EP0043451A2 Process for selectively forming refractory metal silicide layers on semiconductor devices
01/13/1982EP0043404A2 Pin for brazing to a substrate
01/12/1982US4310569 Method of adhesion of passivation layer to gold metalization regions in a semiconductor device
01/12/1982US4310363 Insulative body or panel
01/12/1982US4309813 Mask alignment scheme for laterally and totally dielectrically isolated integrated circuits
01/12/1982CA1116308A1 Tape automated bonding test board
01/06/1982EP0043244A2 Single polycrystalline silicon static FET flip flop memory cell
01/06/1982EP0043136A1 Cutting disk provided with pigments
01/06/1982EP0043029A2 Sintered multi-layer ceramic substrate and method of making same
01/06/1982EP0043028A1 Process for the preparation of ceramic substrates with glazed surfaces
01/06/1982EP0043014A2 Integrated circuit chip transmission line
01/06/1982EP0042987A2 Electronic circuit chip carrier
01/06/1982EP0042947A1 Double polysilicon contact structure and process for making such structure
01/06/1982EP0042943A1 Multilayer integrated circuit substrate structure and process for making such structures
01/05/1982US4309485 Enameled steel plate
01/05/1982CA1115857A1 Semiconductor absolute pressure transducer assembly and method
01/05/1982CA1115853A1 Integrated circuit with built-in repair device
01/05/1982CA1115852A1 Mounting and packaging of silicon devices on ceramic substrates, and assemblies containing silicon devices
01/05/1982CA1115822A1 Cooling tunnels for semiconductor devices
01/05/1982CA1115820A1 Electrical connector for use in mounting an electronic device on a substrate
12/1981
12/30/1981EP0042693A2 Semi-conductor power device assembly and method of manufacture thereof
12/30/1981EP0042643A1 Method of manufacturing a semiconductor device and semiconductor device manufactured by using said method
12/30/1981EP0042581A2 Integrated circuit
12/30/1981EP0042417A1 Fabrication of circuit packages.
12/30/1981EP0042380A1 Method for achieving ideal impurity base profile in a transistor.
12/29/1981US4308339 Integrated circuit chips
12/29/1981US4308090 Method of manufacturing a semiconductor device
12/29/1981US4308089 Sputtering in an ammonia atmosphere followed by washing with a liquid
12/24/1981WO1981003734A1 Heat pin integrated circuit packaging
12/23/1981EP0042351A2 Supporting element for integrated circuit
12/22/1981US4307437 Semiconductor rectifier assembly, particularly for combination with an automotive-type alternator, and method of manufacture
12/22/1981US4307147 Highly thermal conductive and electrical insulating substrate
12/22/1981US4307132 Method for fabricating a contact on a semiconductor substrate by depositing an aluminum oxide diffusion barrier layer
12/22/1981US4306915 Method of making electrode wiring regions and impurity doped regions self-aligned therefrom
12/22/1981CA1114936A1 All metal flat package
12/16/1981EP0041844A2 Semiconductor integrated circuit devices
12/16/1981EP0041770A2 A programmable read-only-memory element and method of fabrication thereof
12/16/1981EP0041684A1 Method for preparing the following bonding of silicon devices provided with an aluminium layer
12/16/1981EP0041662A1 Resin encapsulation type semiconductor device
12/16/1981EP0041600A1 Method for passivating a semiconductor device
12/15/1981US4306275 Hybrid integrated circuit unit
12/15/1981US4306246 Method for trimming active semiconductor devices
12/15/1981US4305897 In thermoplastic molds
12/15/1981US4305767 Label system for making integrated circuit diagrams and printed circuit boards
12/15/1981CA1114485A1 All metal flat package having excellent heat transfer characteristics
12/15/1981CA1114483A1 Laminated photovoltaic generator panel
12/08/1981US4305088 Semiconductor device including means for alleviating stress caused by different coefficients of thermal expansion of the device components