Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1983
05/17/1983US4383355 Method for the production of a sealed housing for a disk shaped semiconductor body which exhibits at least one pn-transition
05/17/1983CA1146674A1 Semiconductor high frequency amplifier device
05/11/1983EP0078684A2 A semiconductor device having a leadless chip carrier
05/11/1983EP0078679A2 An electrode connection structure in a semiconductor device
05/11/1983EP0078606A2 A semiconductor assembly with wire support
05/11/1983EP0078582A2 Electrical circuits
05/11/1983EP0078480A2 Method for fusing and connecting solder of IC chip
05/11/1983EP0078459A1 Component enveloped by insulating material
05/11/1983EP0078370A1 Method of detecting residual glass during fabrication of ceramic substrates for semiconductors
05/11/1983EP0078337A2 Contact device for the detachable connection of electrical components
05/10/1983US4383270 Structure for mounting a semiconductor chip to a metal core substrate
05/10/1983US4383165 Method for aligning laser beam with fuses in integrated circuit
05/10/1983US4382509 Method and apparatus for assembling, shipping and testing sensitive electronic components
05/10/1983US4382327 Method for particle entrapment within an electrical device package
05/10/1983CA1146282A1 Cooling capsule for disc-shaped semiconductor components
05/10/1983CA1146272A1 Memory cards
05/10/1983CA1146208A1 Alternator with built-in voltage regulator
05/04/1983EP0078220A2 Polycrystalline silicon interconnections for bipolar transistor flip-flop
05/04/1983EP0078194A1 Method of manufacturing a housing having at least two integrated circuits
05/04/1983EP0078165A2 A semiconductor device having a control wiring layer
05/04/1983EP0078075A1 Electrical contact for a silicon semiconductor
05/04/1983EP0077922A2 Pressure-applied type semiconductor device
05/04/1983EP0077813A1 Low resistivity composite metallization for semiconductor devices and method therefor.
05/03/1983US4382289 Semiconductor memory device
05/03/1983US4381956 Self-aligned buried channel fabrication process
05/03/1983US4381818 Porous film heat transfer
05/03/1983CA1145877A1 Inhibited curable solventless organopolysiloxane compositions
05/03/1983CA1145860A1 Leadframe for leaded semiconductor chip carriers
05/03/1983CA1145521A1 Encapsulation mold with removable cavity plates
04/1983
04/28/1983WO1983001442A1 Lower temperature glass and hermetic seal means and method
04/26/1983US4381518 Semiconductor component with several semiconductor elements
04/26/1983US4381458 Back-up electrical power supplies
04/26/1983US4381341 Two stage etching process for through the substrate contacts
04/26/1983US4381215 Method of fabricating a misaligned, composite electrical contact on a semiconductor substrate
04/26/1983US4381032 Apparatus for cooling high-density integrated circuit packages
04/26/1983US4380867 Method for making electrically conductive penetrations into thin films
04/26/1983CA1145481A2 Generation of electrical resistance variation in a sensor element
04/26/1983CA1145468A1 Electrical connection system
04/20/1983EP0077276A2 Method for fabricating a hybrid circuit module
04/20/1983EP0076967A2 Semiconductor device having a fuse element
04/20/1983EP0076856A1 Method of making a semiconductor device having a projecting, plated electrode
04/20/1983EP0076802A1 High current package with multi-level leads
04/19/1983US4380775 Semiconductor unit with connecting wires
04/19/1983US4380699 Portable, identifying element constructed as a lamination of sheets
04/19/1983US4380566 Insulating substrate of polyimide film such as kapton, or polyparabanic acid film such as tradlon
04/19/1983US4380357 System and method for effecting electrical interconnections using a flexible media with radially extending electrical conductors
04/19/1983US4380115 Insulative layer of glass with a passive sealing silicon layer thereon
04/19/1983US4380113 Process for fabricating a high capacity memory cell
04/18/1983EP0042380A4 Method for achieving ideal impurity base profile in a transistor.
04/13/1983EP0076570A2 Method of making alloyed metal contact layers on integrated circuits
04/13/1983EP0076439A2 High voltage apparatus with three-dimensional structure
04/12/1983US4380042 Printed circuit lead carrier tape
04/12/1983US4380020 Active high frequency semiconductor device with integral waveguide
04/12/1983US4379505 Integrated circuit carrier
04/06/1983EP0076161A2 Process for manufacturing a multi-layer semiconductor device
04/06/1983EP0076104A2 Package for semicondutor device and method of manufacturing it
04/06/1983EP0076006A2 Semiconductor device comprising a field effect transistor
04/06/1983EP0075945A2 Stacked semiconductor device and method for manufacturing the device
04/06/1983EP0075926A2 Semiconductor integrated circuit device
04/06/1983EP0075892A2 Integrated semiconductor circuit with a semi-insulating semiconductor layer
04/06/1983EP0075588A1 Process for fabricating a self-aligned buried channel and the product thereof.
04/05/1983US4379307 Integrated circuit chip transmission line
04/05/1983US4378629 Semiconductor embedded layer technology including permeable base transistor, fabrication method
04/05/1983CA1144293A1 Conformal coating for electrical circuit assemblies
03/1983
03/31/1983WO1983001153A1 Integrated protection device against overvoltages in an electronic circuit and electronic circuit protected by such device
03/30/1983EP0075454A2 Semiconductor device having new conductive interconnection structure and method for manufacturing the same
03/30/1983EP0075351A1 Method of making an identity card, and identity card produced, for example, by means of this method
03/30/1983EP0075331A2 Device for compensating corrosion effects in integrated semiconductor circuits
03/30/1983EP0075320A1 Rectifying apparatus for automotive A.C. generator
03/30/1983EP0075200A2 Power semiconductor component for evaporation cooling
03/30/1983EP0075154A2 Power semiconductor component for evaporation cooling or liquid cooling
03/30/1983EP0075085A2 Method of fabricating a conductive metal silicide structure
03/30/1983EP0075036A1 Semiconductor power device with fluid cooling
03/29/1983US4378565 Integrated circuit and method of making same
03/29/1983US4378410 Appling aluminum-silicon dioxide glass to form dielectric layer
03/29/1983US4378139 Integrated circuit carrier connector
03/29/1983CA1143862A1 High performance semiconductor package assembly
03/23/1983EP0074845A2 Etching polyimide resin layers and method of manufacturing a semiconductor device having a layer of polyimide resin
03/23/1983EP0074825A2 Manufacture of integrated circuits by masterslice methods
03/23/1983EP0074817A2 Carrier for integrated circuit
03/23/1983EP0074816A2 High terminal count integrated circuit device package
03/23/1983EP0074805A2 Semiconductor integrated circuit comprising a semiconductor substrate and interconnecting layers
03/23/1983EP0074804A2 Semiconductor integrated circuit comprising a semiconductor substrate and interconnecting layers
03/23/1983EP0074605A2 Method for manufacturing multilayer circuit substrate
03/23/1983EP0074378A1 Semiconductor device including plateless package
03/22/1983US4377619 Prevention of surface mass migration by means of a polymeric surface coating
03/22/1983US4377316 High density interconnection means for chip carriers
03/22/1983US4377198 Passive, recyclable cooling system for missile electronics
03/22/1983CA1143463A1 Method of manufacturing cooling blocks for semiconductor lasers
03/17/1983WO1983000949A1 Improved glass bonding means and method
03/16/1983EP0074168A1 Device and method for packaging electronic devices
03/15/1983US4376984 Programmable read-only memory device
03/15/1983CA1143072A1 Method for fabricating igfet integrated circuits
03/09/1983EP0073731A2 Hermetic refrigeration terminal
03/09/1983EP0073721A2 Large scala integration semiconductor device having monitor element and method of manufacturing the same
03/09/1983EP0073509A2 Semiconductor integrated circuit device
03/09/1983EP0073487A2 Method for manufacturing three-dimensional semiconductor device
03/09/1983EP0073383A2 Semiconductor device having external electrodes bonded to electrodes on a semiconductor substrate and method of fabricating such a semiconductor device
03/08/1983US4376287 Microwave power circuit with an active device mounted on a heat dissipating substrate
03/08/1983US4376174 With polysiloxanes