Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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01/05/1983 | EP0068058A1 Electrically programmable read-only memory |
01/05/1983 | EP0067993A1 Die attachment exhibiting enhanced quality and reliability |
01/04/1983 | US4367119 Planar multi-level metal process with built-in etch stop |
01/04/1983 | US4366925 Device for non-destructive desoldering and removal of a modular electronic component from a substrate |
01/04/1983 | CA1139018A1 Fine line repair technique |
01/04/1983 | CA1139013A1 Structured copper strain buffer |
01/04/1983 | CA1139009A1 Thin film metal package for lsi chips |
01/04/1983 | CA1139008A1 Method of forming an improved solder interconnection between a semiconductor device and a supporting substrate |
12/28/1982 | US4366497 Cooling capsule for disc-shaped semiconductor components |
12/28/1982 | US4366342 Conductively coated embossed articles |
12/28/1982 | US4366187 Immersion curing of encapsulating material |
12/28/1982 | US4366117 Copper alloy for use as lead material for semiconductor devices |
12/28/1982 | US4365666 Heat exchanger |
12/28/1982 | US4365665 Heat sink |
12/28/1982 | CA1138562A1 Cooling apparatus for semiconductor elements |
12/22/1982 | EP0067752A1 Thermal coupling cell and temperature-regulated space using such a cell |
12/22/1982 | EP0067677A2 Chip-array-constructed semiconductor device |
12/22/1982 | EP0067660A1 Signal propagating device |
12/22/1982 | EP0067575A2 Power semiconductor device |
12/22/1982 | EP0067304A2 Processing array and method for the physical design of very large scale integrated circuits |
12/22/1982 | EP0006444B1 Multi-layer dielectric substrate |
12/21/1982 | US4365264 Semiconductor device with high density low temperature deposited Siw Nx Hy Oz passivating layer |
12/21/1982 | US4364779 Heat treatment in hydrogen, cooling, reheating |
12/21/1982 | US4364166 Semiconductor integrated circuit interconnections |
12/21/1982 | CA1138129A1 Borehole logging tool cryostat |
12/21/1982 | CA1138128A1 Borehole logging tool cryostat |
12/21/1982 | CA1138127A1 Borehole logging tool cryostat |
12/15/1982 | EP0066883A2 Exposure method with electron beam exposure apparatus |
12/15/1982 | EP0066836A2 Method of marking semiconductor chips, and marked semiconductor chip |
12/15/1982 | EP0066835A2 Method of marking semiconductor chips, and marked semiconductor chip |
12/15/1982 | EP0066808A2 Water-cooled high voltage device |
12/15/1982 | EP0066706A2 Semiconductor module circuit interconnection system |
12/14/1982 | US4364100 Multi-layered metallized silicon matrix substrate |
12/14/1982 | US4364086 Alignment and recognition apparatus |
12/14/1982 | US4364078 Edge barrier of polysilicon and metal for integrated circuit chips |
12/14/1982 | US4364075 CMOS Dynamic RAM cell and method of fabrication |
12/14/1982 | US4364044 Semiconductor speech path switch |
12/14/1982 | US4364010 Semiconductor device with monitor pattern, and a method of monitoring device parameters |
12/14/1982 | CA1137647A1 Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices |
12/14/1982 | CA1137646A1 Chip package with high capacitance, stacked vlsi/power sheets extending through slots in substrate |
12/08/1982 | EP0066334A1 Circuit arrangement with an integrated circuit |
12/08/1982 | EP0066188A1 Plastic encapsulated semiconductor device and method for manufacturing the same |
12/08/1982 | EP0066069A2 Method for forming dense multilevel metal interconnection systems for integrated circuit devices |
12/08/1982 | EP0066065A1 Radiation tolerant semiconductor device and method of making such a device |
12/07/1982 | US4363076 Integrated circuit package |
12/07/1982 | US4362902 Ceramic chip carrier |
12/07/1982 | US4362766 Method for preparing a protective amorphous silicon passivating film on a semiconductor device |
12/07/1982 | US4361949 Process for making a memory device |
12/07/1982 | CA1137220A1 Charge coupled memory device |
12/01/1982 | EP0065686A2 Power device module |
11/30/1982 | US4361756 Personal card comprising a safety switch |
11/30/1982 | US4361720 Dielectric, thermoconductive material welded to metal with higher expansion coefficient |
11/30/1982 | US4360965 Bonding to heat sink using gold alloy |
11/30/1982 | CA1136771A1 Integrated semiconductor circuit structure and method for making it |
11/25/1982 | WO1982004161A1 Device for preventing a computer program from being copied |
11/24/1982 | EP0065449A2 Alignment target for electron-beam write system |
11/24/1982 | EP0065443A1 Encapsulating housing for a power semiconductor functioning in a 2 to 20 GHz frequency range |
11/24/1982 | EP0065437A1 Device for protecting electronic circuits such as integrated circuits from electrostatic charges |
11/24/1982 | EP0065425A2 Hybrid integrated circuit component and printed circuit board mounting said component |
11/24/1982 | EP0065350A1 Offset-gate chemical-sensitive field-effect transistors (OG-CHEMFETs) |
11/24/1982 | EP0065299A2 Automatic component mounting and removal apparatus |
11/24/1982 | EP0065083A1 Identitity card incorporating an IC chip |
11/23/1982 | US4360823 Semiconductor device having an improved multilayer wiring system |
11/23/1982 | US4360289 Pin for brazing to a substrate and improved package resulting therefrom |
11/23/1982 | US4360142 Depositing layers of chromium, copper-chromium, copper,and copper-chromium on a wettable pad; heat resistance |
11/23/1982 | US4359817 Method for making late programmable read-only memory devices |
11/23/1982 | US4359816 Self-aligned metal process for field effect transistor integrated circuits |
11/23/1982 | CA1136289A1 Prefabricated composite metallic heat-transmitting plate unit |
11/17/1982 | EP0064872A2 Ceramic wiring boards |
11/17/1982 | EP0064854A1 Component assembly including a rigid substrate |
11/17/1982 | EP0064611A2 Electrically insulating encapsulating substance for semiconductor devices |
11/17/1982 | EP0064558A1 Transparent coating composition for antistatic use |
11/17/1982 | EP0064496A1 Multiple terminal two conductor layer burn-in tape |
11/16/1982 | US4359754 Semiconductor device |
11/16/1982 | US4358889 Process for making a late programming enhanced contact ROM |
11/16/1982 | CA1135874A1 Semiconductor device passivation |
11/16/1982 | CA1135856A1 Semiconductor device having a fixed memory |
11/16/1982 | CA1135855A1 Programmable memory cell having semiconductor diodes |
11/16/1982 | CA1135854A1 Programmable read only memory cell |
11/11/1982 | WO1982003948A1 Low resistivity composite metallization for semiconductor devices and method therefor |
11/11/1982 | WO1982003947A1 A package for a semiconductor chip having a capacitor as an integral part thereof |
11/10/1982 | EP0064386A2 Silicon carbide electrical insulator material of low dielectric constant and manufacturing method therefor |
11/10/1982 | EP0064383A2 A semi-conductor package |
11/10/1982 | EP0064264A2 Silicon carbide powder mixture and process for producing sintered bodies therefrom |
11/10/1982 | EP0064231A2 Compression-type semiconductor device |
11/09/1982 | US4358785 Compression type semiconductor device |
11/09/1982 | US4358784 Clad molybdenum disks for alloyed diode |
11/09/1982 | US4358552 Epoxy resinous molding compositions having low coefficient of thermal expansion and high thermal conductivity |
11/09/1982 | US4358339 Method of fabrication of bubble domain device structures |
11/09/1982 | US4358044 Apparatus for soldering solder on ceramic substrate |
11/03/1982 | EP0063843A1 Hyperfrequency circuit |
11/03/1982 | EP0063811A1 A method for manufacturing a plastic encapsulated semiconductor device |
11/02/1982 | US4357162 Solder composition |
11/02/1982 | US4357069 Solder-bearing lead having solder-confining stop means |
10/28/1982 | WO1982003727A1 Method of making a semiconductor device having a projecting,plated electrode |
10/27/1982 | EP0063455A1 Method for the fabrication of encapsulated chemoresponsive microelectronic device arrays |
10/27/1982 | EP0063408A1 Semiconductor chip carrier |
10/27/1982 | EP0016768B1 Mounting semi-conductor elements with insulating envelope |
10/27/1982 | EP0015983B1 Process for manufacturing a filled casing for a disc shape semi-conductor body and presenting at least one pn jonction |
10/26/1982 | US4356505 Conductive adhesive system including a conductivity enhancer |