Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1981
12/08/1981US4305087 Stud-mounted pressure assembled semiconductor device
12/08/1981CA1114071A1 Stabilization process for aluminum microcircuits which have been reactive-ion etched
12/02/1981EP0040905A1 The manufacture of ceramic circuit substrates
12/01/1981US4303935 Semiconductor apparatus with electrically insulated heat sink
12/01/1981US4303934 Molded lead frame dual in line package including a hybrid circuit
12/01/1981US4303297 Socket structure for electrical components
12/01/1981CA1113597A1 Static electrical convertor
12/01/1981CA1113560A1 Leaded mounting and connector unit for an electronic device
11/1981
11/26/1981WO1981003396A1 Integrated circuit package with multi-contact pins
11/25/1981EP0040552A1 Heat sinks
11/25/1981EP0040251A1 Semiconductor memory device
11/24/1981US4302792 Transistor protection circuit
11/24/1981US4302767 Controlled power-semiconductor component having an annular cage
11/24/1981US4302765 Geometry for fabricating enhancement and depletion-type, pull-up field effect transistor devices
11/24/1981US4302625 Multi-layer ceramic substrate
11/24/1981US4302498 Metallization by vacuum deposition of aluminum and aluminum oxide; photolithography
11/17/1981US4301465 Cover mounted multi-columnar semiconductor assembly
11/17/1981US4301464 Lead frame and semiconductor device employing the same with improved arrangement of supporting leads for securing the semiconductor supporting member
11/17/1981US4301324 Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
11/17/1981US4301233 Beam lead Schottky barrier diode for operation at millimeter and submillimeter wave frequencies
11/17/1981US4301191 Deposition through narrow mask 'portions' between apertures
11/17/1981US4301040 Electrically conductive foam and method of preparation and use
11/11/1981EP0039507A1 A process of packaging a semiconductor and a packaging structure for containing semiconductive elements
11/10/1981US4300184 Conformal coating for electrical circuit assemblies
11/10/1981US4300153 Flat shaped semiconductor encapsulation
11/10/1981US4300149 Gold-tantalum-titanium/tungsten alloy contact for semiconductor devices and having a gold/tantalum intermetallic barrier region intermediate the gold and alloy elements
11/10/1981US4299876 Gold dispersed in inorganic binder of cuprous oxide, lead fluoride, and cadmium oxide
11/10/1981US4299866 Rupturing polymer surface and applying a second polymer
11/10/1981US4299024 Fabrication of complementary bipolar transistors and CMOS devices with poly gates
11/10/1981CA1112314A1 Electrical socket connector construction
11/10/1981CA1112312A1 Carrier strip for round lead pins and method for making same
11/04/1981EP0039174A1 Gold metallisation in semiconductor devices
11/04/1981EP0039160A2 Methods for bonding conductive bumps to electronic circuitry
11/04/1981EP0038931A2 Substrate and integrated circuit module with this substrate
11/03/1981US4298883 Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet
11/03/1981US4298881 Semiconductor device with double moat and double channel stoppers
11/03/1981US4298846 Semiconductor device
11/03/1981US4298769 Hermetic plastic dual-in-line package for a semiconductor integrated circuit
11/03/1981US4298446 Apparatus for plating
10/1981
10/29/1981WO1981003093A1 High-voltage rectifier
10/28/1981EP0038510A1 Power semiconductor assembly with transformers and with starting and protection circuits
10/27/1981US4297722 Ceramic package for semiconductor devices having metalized lead patterns formed like a floating island
10/27/1981US4297721 Extremely low current load device for integrated circuit
10/27/1981US4297718 Vertical type field effect transistor
10/27/1981US4297647 Hybrid integrated circuit and a method for producing the same
10/27/1981EP0025057A4 Thermo-compression bonding a semiconductor to strain buffer.
10/27/1981CA1111570A1 Tantalum semiconductor contacts and method for fabricating same
10/21/1981EP0038133A1 Method of manufacturing semiconductor devices with submicron lines
10/21/1981EP0037930A1 Semiconductor memory device
10/21/1981EP0037893A2 Method of sealing an electronic module
10/21/1981EP0037852A1 Connection for superconductive circuitry
10/20/1981US4296456 Electronic package for high density integrated circuits
10/20/1981US4296455 Slotted heat sinks for high powered air cooled modules
10/20/1981US4296372 Techniques for impressing a voltage with an electron beam
10/20/1981US4296336 Switching circuit and method for avoiding secondary breakdown
10/20/1981US4296272 Composite substrate
10/20/1981US4295441 Apparatus for applying solder to the connections of integrated circuit components
10/20/1981US4295371 Temperature detecting device
10/20/1981CA1111149A1 Passivation of semiconductor elements
10/14/1981EP0037760A1 Memory card comprising an integrated circuit and means for protection against electrostatic charges
10/13/1981US4295183 Thin film metal package for LSI chips
10/13/1981US4295182 Interconnection arrangements for testing microelectronic circuit chips on a wafer
10/13/1981US4295149 Master image chip organization technique or method
10/13/1981CA1110778A1 Hybrid circuit having a semiconductor circuit
10/13/1981CA1110718A1 Photocoupler device
10/13/1981CA1110574A1 Metallic hermetic sealing cover for a container and the method of fabricating the same
10/07/1981EP0037301A2 Encapsulating housing for hybrid circuit power module
10/07/1981EP0037005A1 Non rectifying low resistance contact on a III-V compound-semiconductor and method of manufacturing it
10/07/1981EP0036907A1 Multi-lead plug-in type package for circuit element
10/07/1981EP0036867A1 Double cavity semiconductor chip carrier.
10/06/1981US4293451 Screenable contact structure and method for semiconductor devices
10/06/1981US4293175 Connector for integrated circuit packages
10/06/1981US4292844 Temperature detecting device
10/06/1981US4292730 Method of fabricating mesa bipolar memory cell utilizing epitaxial deposition, substrate removal and special metallization
10/01/1981WO1981002703A1 Socket for an electrical component
09/1981
09/30/1981EP0036764A2 A semiconductor device with a V-groove insulating isolation structure and a method of manufacturing such a device
09/30/1981EP0036671A1 Container for electrical devices, groups of devices or integrated circuits
09/29/1981US4292647 Semiconductor package and electronic array having improved heat dissipation
09/29/1981US4292643 High cut-off frequency planar Schottky diode having a plurality of finger-like projections arranged in parallel in a transmission line
09/29/1981US4292576 Mask-slice alignment method
09/29/1981US4292464 Glass pass through with an additional insulator for lengthening leakage path
09/29/1981US4291815 Ceramic lid assembly for hermetic sealing of a semiconductor chip
09/29/1981US4291758 Preparation of boiling heat transfer surface
09/29/1981CA1109664A1 Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
09/23/1981EP0036113A1 Solution for dissolving noble metal alloys which include tin and re-work method of removing said alloys from a substrate
09/22/1981US4291328 Semiconductors
09/22/1981US4291326 Semiconductor device
09/22/1981US4291293 Semiconductor absolute pressure transducer assembly and method
09/22/1981US4290185 Method of making an extremely low current load device for integrated circuit
09/22/1981CA1109531A1 Low frequency power amplifier using mos fet's
09/16/1981EP0035793A1 Semiconductor integrated circuit device
09/16/1981EP0035767A1 Semiconductor device
09/15/1981US4290080 Copper, vacuum deposition
09/15/1981US4290079 Improved solder interconnection between a semiconductor device and a supporting substrate
09/15/1981US4289922 Integrated circuit package and lead frame
09/15/1981US4289834 Dense dry etched multi-level metallurgy with non-overlapped vias
09/15/1981US4289719 Method of making a multi-layer ceramic substrate
09/15/1981US4288910 Method of manufacturing a semiconductor device
09/15/1981CA1109165A1 Semiconductor device and process for producing the same
09/15/1981CA1108899A1 Light detector housing for fiber optic applications
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