Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1982
05/25/1982US4331709 Process of reducing density of fast surface states in MOS devices
05/25/1982US4331258 Sealing cover for an hermetically sealed container
05/25/1982US4331253 Lid assembly for hermetic sealing of a semiconductor chip
05/25/1982US4331077 Printing element with shock absorber feature
05/25/1982CA1124407A1 Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices
05/19/1982EP0052054A1 Packaged semiconductor device which provides for enhanced power dissipation
05/19/1982EP0051666A1 Integrated circuit package with multi-contact pins
05/18/1982US4330790 Tape operated semiconductor device packaging
05/18/1982US4330683 Encapsulation for semiconductor device
05/18/1982US4330637 Encapsulated electronic devices and encapsulating compositions
05/18/1982US4330631 Dielectric ceramics
05/18/1982US4330329 Gold bonding wire for semiconductor elements and the semiconductor element
05/18/1982CA1123966A1 Technique for controlling emitter ballast resistance
05/12/1982EP0051459A2 A semiconductor device having electrodes and conducting members bonded to the electrodes, and a method of manufacturing the same
05/12/1982EP0051397A2 Thin film transistor array manufacture
05/12/1982EP0051315A2 Semiconductor assembly
05/12/1982EP0051165A1 Repairable IC package with thermoplastic chip attach
05/11/1982US4329707 Glass-sealed power thyristor
05/11/1982US4329706 Doped polysilicon silicide semiconductor integrated circuit interconnections
05/11/1982US4329701 Semiconductor package
05/11/1982US4329571 Counting with plural electric fields
05/11/1982US4328610 Method of reducing alpha-particle induced errors in an integrated circuit
05/11/1982CA1123522A1 Glass encapsulated diode
05/05/1982EP0050774A1 Cooling member for liquid-cooling of semiconductor components
05/04/1982US4328530 Multiple layer, ceramic carrier for high switching speed VLSI chips
05/04/1982US4328512 Two-element semiconductor diode rectifier assembly structure
05/04/1982US4328510 High density read/write memory cell
05/04/1982US4328263 Harden and shrink liquid glass film
05/04/1982US4328262 Method of manufacturing semiconductor devices having photoresist film as a permanent layer
05/04/1982US4328150 Curable epoxy resin compositions
05/04/1982CA1123116A1 Multi-layered glass-ceramic substrate for mounting of semiconductor device
05/04/1982CA1123115A1 Multi-layered glass-ceramic structures having an internal distribution of copper-based conductors
05/04/1982CA1122856A1 Process for in-situ modification of solder composition
04/1982
04/28/1982EP0050512A1 Method of forming electrical interconnections on contact pads of semi-conductor devices
04/27/1982US4327399 Heat pipe cooling arrangement for integrated circuit chips
04/27/1982US4327370 Resilient contact ring for providing a low impedance connection to the base region of a semiconductor device
04/27/1982US4327369 Encapsulating moisture-proof coating
04/27/1982US4326329 Method of making a contact programmable double level polysilicon MOS read only memory
04/22/1982EP0020665A4 Three-dimensionally structured microelectronic device.
04/21/1982EP0049791A2 Semiconductor device with a heat dissipating substrate
04/20/1982US4326238 Electronic circuit packages
04/20/1982US4326215 Encapsulated semiconductor device with a metallic base plate
04/20/1982US4326213 Semiconductor device and process for producing the same
04/20/1982US4326180 Microwave backdiode microcircuits and method of making
04/20/1982US4326095 Casing comprising a barrier for intercepting alpha particles from a sealing layer
04/20/1982US4325169 Method of making CMOS device allowing three-level interconnects
04/20/1982CA1122312A1 Display device for use with strong illumination
04/15/1982WO1982001295A1 Method of mounting interrelated components
04/14/1982EP0049512A2 Semiconductor memory device
04/13/1982US4325097 Four terminal pulse suppressor
04/13/1982US4325073 Field effect devices and their fabrication
04/07/1982EP0048768A1 A semiconductor device with a semiconductor element soldered on a metal substrate
04/06/1982US4323914 Heat transfer structure for integrated circuit package
04/06/1982US4323405 Casing having a layer for protecting a semiconductor memory to be sealed therein against alpha particles and a method of manufacturing same
04/06/1982US4323293 Terminal lead with labyrinthine clip
04/06/1982US4323155 Integrated circuit carrier
04/06/1982US4322980 Semiconductor pressure sensor having plural pressure sensitive diaphragms and method
04/06/1982CA1121479A1 Dip carrier and socket
04/01/1982WO1982001102A1 Integrated circuit power distribution network
03/1982
03/31/1982EP0048610A2 Semiconductor device and its manufacture
03/30/1982US4322822 High density VMOS electrically programmable ROM
03/30/1982US4322778 High performance semiconductor package assembly
03/30/1982US4322737 Integrated circuit micropackaging
03/30/1982US4322736 Short-resistant connection of polysilicon to diffusion
03/30/1982US4322453 Conductivity WSi2 (tungsten silicide) films by Pt preanneal layering
03/30/1982US4322452 Process for passivating semiconductor members
03/30/1982CA1121070A1 Method for forming semiconductor contacts
03/24/1982EP0047886A2 Semiconductor device
03/23/1982US4321664 Rectifier assembly with heat sink
03/23/1982US4321613 Field effect devices and their fabrication
03/23/1982US4321423 Heat sink fastenings
03/23/1982US4321284 Manufacturing method for semiconductor device
03/23/1982US4320571 Stencil mask process for high power, high speed controlled rectifiers
03/23/1982CA1120611A1 Forming interconnections for multilevel interconnection metallurgy systems
03/23/1982CA1120608A1 Method for forming an insulator between layers of conductive material
03/23/1982CA1120606A1 Lsi semiconductor device and fabrication thereof
03/23/1982CA1120604A1 Micro bellows thermo capsule
03/23/1982CA1120601A1 Thin film lossy line package
03/18/1982WO1982000937A1 Single layer burn-in tape for integrated circuit
03/17/1982EP0047690A1 Monolithic ampliflier comprising a power dividing and combining system containing a plurality of transistors
03/17/1982EP0047655A1 Boiling/cooling system
03/16/1982US4320438 Multi-layer ceramic package
03/16/1982US4320412 Composite material for mounting electronic devices
03/16/1982US4320192 Adjusting successive steps for making carrier tape
03/16/1982US4319396 Method for fabricating IGFET integrated circuits
03/10/1982EP0047195A2 Plastics housing for integrated circuits
03/10/1982EP0047133A1 High density semiconductor memory device and process for producing the same
03/10/1982EP0047099A2 Full wave rectifier assembly
03/10/1982EP0046825A1 Method of producing an assembly of electrical elements clamped between cooling members, and assembly made by such method
03/09/1982US4319342 One device field effect transistor (FET) AC stable random access memory (RAM) array
03/09/1982US4319265 Monolithically interconnected series-parallel avalanche diodes
03/09/1982US4319264 Nickel-gold-nickel conductors for solid state devices
03/09/1982US4319262 Integrated-circuit structure including lateral PNP transistor with polysilicon layer bridging gap in collector field relief electrode
03/09/1982US4319260 Multilevel interconnect system for high density silicon gate field effect transistors
03/09/1982US4318954 Printed wiring board substrates for ceramic chip carriers
03/09/1982US4318830 Thick film conductors having improved aged adhesion
03/09/1982US4318740 Low alloy lead frame
03/09/1982CA1119682A1 Precolation cooled transformers
03/03/1982EP0046629A2 Semi-conductor memory device having an insulated gate field effect transistor as a fundamental element
03/03/1982EP0046605A2 Arrangement for potential-independent heat dissipation
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