Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1982
10/26/1982US4356504 MOS Integrated circuit structure for discretionary interconnection
10/26/1982US4356374 Electronics circuit device and method of making the same
10/26/1982US4356223 Semiconductor device having a registration mark for use in an exposure technique for micro-fine working
10/26/1982US4356047 Method of making ceramic lid assembly for hermetic sealing of a semiconductor chip
10/26/1982US4355719 Mechanical shock and impact resistant ceramic semiconductor package and method of making the same
10/26/1982US4355463 Process for hermetically encapsulating semiconductor devices
10/26/1982US4355454 Method for fabricating a metal oxide semiconductor
10/20/1982EP0063070A1 Packages with flat terminals for medium-power semiconductor components, and method for their manufacture
10/20/1982EP0062806A1 Molding composition, method for preparing same and its use for semi-conductor encapsulation
10/20/1982EP0062778A1 System carrier
10/20/1982EP0062763A2 Pinned ceramic substrate and method of making such
10/19/1982US4355344 Protective device electronic semiconductor component
10/19/1982CA1134096A1 Sealing of integrated circuit modules
10/19/1982CA1134057A1 Glass-sealed power thyristor
10/14/1982WO1982003495A1 Process for fabricating a self-aligned buried channel and the product thereof
10/13/1982EP0062167A2 Electrical component centered and adjusted in a casing
10/12/1982US4354217 Automatic power disconnect system for wafer scale integrated circuits
10/12/1982US4354198 Zinc-sulphide capping layer for gallium-arsenide device
10/12/1982US4353935 Method of manufacturing a device having a conductor pattern
10/06/1982EP0061939A2 The provision of conductors in electronic devices
10/06/1982EP0061863A1 Method of connecting metal leads with electrodes of semiconductor device and metal lead
10/06/1982EP0061593A2 Solder support pad for semiconductor devices
10/06/1982EP0061592A2 Electronic package
10/06/1982EP0061536A1 Method of manufacturing a semiconductor device having improved alignment marks and alignment marks for said method
10/06/1982EP0061518A1 Heat dissipation device for electronic circuits mounted without a casing
10/05/1982US4353085 Integrated semiconductor device having insulated gate field effect transistors with a buried insulating film
10/05/1982US4353047 Also containing a manganese and zirconium component
10/05/1982US4353040 Multi-layer module with constant characteristic impedance
10/05/1982US4352449 Fabrication of circuit packages
10/05/1982US4352239 Process for suppressing electromigration in conducting lines formed on integrated circuits by control of crystalline boundary orientation
10/05/1982CA1133147A1 Semiconductor speech path switch
10/05/1982CA1133146A1 Master image chip organization technique or method
10/05/1982CA1133135A1 Vmos field aligned dynamic ram cell
10/05/1982CA1132857A1 Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern
10/05/1982CA1132830A1 Blank and process for the formation of beam leads for ic chip bonding
09/1982
09/30/1982WO1982003294A1 Semiconductor device including plateless package
09/29/1982EP0061388A2 Binary germanium-silicon interconnect structure for integrated circuits
09/29/1982EP0061376A1 Planar field-effect transistor having elektrodes comprising metallised holes, and process for manufacturing the transistor
09/28/1982US4352125 Recognition apparatus
09/28/1982US4352120 Said supporter including alumina, aluminum, iron or silicon
09/28/1982US4352119 Having a particle getter of a cured polysiloxane
09/28/1982US4352028 Circuit arrangement for reducing the recovery time of a thyristor comprising R-C-D network between auxiliary and main emitters
09/28/1982US4351892 Alignment target for electron-beam write system
09/28/1982US4351580 Carrier socket for leadless integrated circuit devices
09/28/1982US4351101 Semiconductor device processing for readily and reliably forming electrical interconnects to contact pads
09/22/1982EP0060784A1 Low melting temperature glass for use over aluminium interconnects of an integrated circuit structure
09/22/1982EP0060591A1 Device for applying blot-shaped coverings by electro-plating
09/22/1982EP0060253A1 Integrated circuit power distribution network
09/21/1982US4350743 Structure for multilayer circuits
09/21/1982US4350618 Gold, palladium, platinum, zinc oxide, bismuth oxide, glass frit
09/21/1982US4350026 Cooling device for electrical and/or electronic component elements producing lost heat and a procedure for operating such
09/15/1982EP0060205A2 Low temperature melting binary glasses for leveling surfaces of integrated circuits containing isolation grooves
09/15/1982EP0059926A1 A method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
09/14/1982US4349862 Capacitive chip carrier and multilayer ceramic capacitors
09/14/1982US4349831 Semiconductor device having glass and metal package
09/14/1982US4349692 For an electrical device
09/14/1982US4349635 Lower temperature glass and hermetic seal means and method
09/14/1982US4349609 Cured coating of ladder-type silsesquioxane polymer
09/14/1982US4349585 Gold-plated electronic components and process for production thereof
09/14/1982US4349394 Method of making a zener diode utilizing gas-phase epitaxial deposition
09/14/1982US4348804 Method of fabricating an integrated circuit device utilizing electron beam irradiation and selective oxidation
09/14/1982US4348803 Process for producing a semiconductor device having an identification mark in an insulating substrate
09/14/1982US4348802 Process for producing a semiconductor device
09/14/1982US4348795 Method of manufacturing cooling blocks for semiconductor lasers
09/14/1982CA1131796A1 Method for fabricating mos device with self-aligned contacts
09/14/1982CA1131793A1 Fluid cooled semiconductor device
09/09/1982EP0020477A4 Dynamic random access memory.
09/08/1982EP0059337A2 High density connecting system and method for semi-conductor devices
09/08/1982EP0059187A1 Single layer burn-in tape for integrated circuit
09/07/1982US4348746 Semiconductor integrated circuit device having a plurality of insulated gate field effect transistors
09/07/1982US4348687 Clamping assembly for thyristor column
09/07/1982US4348451 Method for making custom integrated circuits and metallization artwork therefor
09/07/1982US4348267 Plating means
09/07/1982US4348253 Method for fabricating via holes in a semiconductor wafer
09/07/1982US4347964 Wire bonding apparatus
09/02/1982WO1982002980A1 High current package with multi-level leads
09/01/1982EP0059092A1 Printed circuit lead carrier tape
09/01/1982EP0058852A2 Semiconductor device with connections formed from sheet metal
09/01/1982EP0058835A2 Semiconductor device and method of producing it
09/01/1982EP0058761A2 Lead frame for resin-encapsulated electrical devices
09/01/1982EP0058757A1 Method of sealing an electrical unit, in particular a relay
08/1982
08/31/1982US4347543 Rectifier circuit diode array and circuit protector
08/31/1982US4347479 Test methods and structures for semiconductor integrated circuits for electrically determining certain tolerances during the photolithographic steps
08/31/1982US4347306 Method of manufacturing electronic device having multilayer wiring structure
08/31/1982US4346516 Method of forming a ceramic circuit substrate
08/31/1982CA1130906A1 Micro helix thermo capsule
08/31/1982CA1130905A1 Water cooling apparatus for electric circuit elements
08/24/1982US4346396 Electronic device assembly and methods of making same
08/24/1982US4346291 Thermally isolated monolithic semiconductor die
08/24/1982US4345364 Method of making a dynamic memory array
08/24/1982CA1130474A1 Epitaxial tunnels
08/24/1982CA1130466A1 Heat sink mounting
08/24/1982CA1130431A1 Heat sink for electrical components
08/19/1982WO1982002798A1 Button rectifier package for non-planar die
08/19/1982WO1982002797A1 Button rectifier package
08/18/1982EP0058124A1 Polycrystalline silicon Schottky diode array and method of manufacturing
08/18/1982EP0058068A2 Integrated circuit chip carrier
08/18/1982EP0057842A2 Printing wiring board substrates for ceramic chip carriers
08/17/1982US4345267 Active device substrate connector having a heat sink
08/17/1982US4345108 Case for a semiconductor component
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