Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1999
03/04/1999WO1999010923A1 Method for selective plasma etch
03/04/1999WO1999010922A1 Method for anisotropic etching of silicon
03/04/1999WO1999010921A1 Method of forming a barrier layer in a contact structure
03/04/1999WO1999010920A1 METHOD FOR THERMAL SELF-HEALING OF AN SiC SEMICONDUCTOR AREA DOPED BY MEANS OF IMPLANTATION AND A SiC BASED SEMICONDUCTOR COMPONENT
03/04/1999WO1999010919A1 Silicon carbide substrate, process for producing the same, and semiconductor element containing silicon carbide substrate
03/04/1999WO1999010918A1 Process of isolation in integrated circuit fabrication, using an antireflective coating
03/04/1999WO1999010916A2 Copper electroless deposition on a titanium-containing surface
03/04/1999WO1999010915A1 Device for intermediate storage of wafers
03/04/1999WO1999010913A1 An apparatus and method for allowing a stable power transmission into a plasma processing chamber
03/04/1999WO1999010734A1 Method and device for determining a parameter for a metallization bath
03/04/1999WO1999010718A1 Method and apparatus for improved temperature control in rapid thermal processing (rtp) systems
03/04/1999WO1999010566A2 Process chamber and method for depositing and/or removing material on a substrate
03/04/1999WO1999010558A1 Vertically-stacked process reactor and cluster tool system for atomic layer deposition
03/04/1999WO1999010257A1 Wafer handler for multi-station tool
03/04/1999WO1999010108A1 Method for constructing heat resistant electrode structures on silicon substrates
03/04/1999WO1998056020A3 Method for arrangement of a buried capacitor, and a buried capacitor arranged according to said method
03/04/1999WO1998055669A3 Conductor track structures arranged on a nonconductive support material, especially fine conductor track structures, and method for producing the same
03/04/1999WO1998054755A3 A method of manufacturing an electronic device whereby a conductive layer is provided on an electrically insulating substrate, from which layer a conductor pattern is formed
03/04/1999DE3745134C2 Semiconductor wafer transfer between cassette and boat
03/04/1999DE19837336A1 Encapsulating integrated circuits assembled on a substrate
03/04/1999DE19832803A1 Gate dielectric for field effect transistor, especially MISFET
03/04/1999DE19819438A1 Semiconductor device production by the salicide technique
03/04/1999DE19818436A1 Fluxless soldering especially of a chip to a ball grid array substrate
03/04/1999DE19817128A1 Conductive base plate for semiconductor component lead frame
03/04/1999DE19747996C1 Ruthenium-doped semi-insulating III-V compound semiconductor epitaxy
03/04/1999DE19746418C1 CMOS circuit production process involves self-aligned oxide mask formation
03/04/1999DE19740905C1 Oxygen impurity removal from crucible-grown silicon@ wafer
03/04/1999DE19738399A1 Verfahren zur Verbindung von elektronischen Bauelementen mit einem Trägersubstrat A method for connection of electronic components to a carrier substrate
03/04/1999DE19738147A1 Verfahren zum Behandeln von Substraten A method for treating substrates
03/04/1999DE19737548A1 Tiltable, rotatable and tempering substrate holder for ion irradiation etching
03/04/1999DE19736370A1 Verfahren zum anisotropen Ätzen von Silizium A method for anisotropic etching of silicon
03/04/1999DE19736197C1 IC has supply voltage smoothing capacitors
03/04/1999DE19736186A1 Fuse production on a semiconductor body e.g. a memory circuit
03/04/1999DE19736184A1 Fuse production on a semiconductor body e.g. a memory circuit
03/04/1999DE19736090A1 Bauelement mit Schutzschicht und Verfahren zur Herstellung des Bauelements Component with a protective layer, and method for manufacturing the component
03/04/1999DE19735826A1 Implanting nitride to produce gate oxide with different-thickness in hybrid and insertion ULSI
03/04/1999DE19733350C1 MOSFET production process uses only three photolithography or masking steps
03/04/1999CA2269912A1 Silicon carbide substrate, process for producing the same, and semiconductor element containing silicon carbide substrate
03/03/1999EP0899835A1 Semiconductor Laser Device
03/03/1999EP0899794A2 High frequency diode and method for fabricating it
03/03/1999EP0899793A2 Transistor having localized source and drain extensions and method
03/03/1999EP0899792A2 Transistor with structured sidewalls and method
03/03/1999EP0899791A2 Trench-gated MOSFET with bidirectional voltage clamping
03/03/1999EP0899790A2 DRAM cell array and method of producing the same
03/03/1999EP0899789A1 Overvoltage protection element
03/03/1999EP0899788A2 Semiconductor device and method with improved flat surface
03/03/1999EP0899787A2 Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structurs formed thereby
03/03/1999EP0899786A2 Silicon semiconductor device with an electrode structure and circuit board having the device mounted thereon
03/03/1999EP0899785A2 Fabrication method for DRAM cell array
03/03/1999EP0899784A2 Semiconductor device and method of fabricating thereof
03/03/1999EP0899783A2 Circuit arrangement with at least four transistors and method of fabrication
03/03/1999EP0899782A2 Method of manufacturing a field effect transistor
03/03/1999EP0899781A2 Corrosion protection in the fabrication of optoelectronic assemblies
03/03/1999EP0899780A2 Method for forming insulating thin films
03/03/1999EP0899779A2 Method for fabricating thermally stable contacts
03/03/1999EP0899778A2 Apparatus and method for pressing two substrates together
03/03/1999EP0899776A1 Apparatus for the intermediate storage of wafers
03/03/1999EP0899745A2 Fuse arrangement for semiconductor memory device.
03/03/1999EP0899554A1 Method for observing a reaction process by transmission electron microscopy
03/03/1999EP0899538A1 A probe tip configuration, a method of fabricating probe tips and use thereof
03/03/1999EP0899358A2 Silicon carbide fabrication
03/03/1999EP0899316A1 Energy beam curable hydrophilic pressure sensitive adhesive composition and use thereof
03/03/1999EP0899202A1 A shipping container
03/03/1999EP0898808A1 Three-terminal power mosfet switch for use as synchronous rectifier or voltage clamp
03/03/1999EP0898787A1 Current controlled oscillator with voltage independent capacitance
03/03/1999EP0898785A1 Active matrix displays and method of making
03/03/1999EP0898733A2 Method of producing a stencil mask
03/03/1999EP0898731A1 Furnace for rapid thermal processing
03/03/1999EP0898712A2 Wafer-level burn-in and test
03/03/1999EP0898703A1 Method and apparatus for analysing optical parameters
03/03/1999EP0866742A4 Wide wrist articulated arm transfer device
03/03/1999EP0708918B1 Multiple angle spectroscopic analyzer
03/03/1999EP0702806B1 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material
03/03/1999EP0698290B1 Power semiconductor device with stress buffer layer
03/03/1999CN1209908A Semiconductor manufacturing apparatus
03/03/1999CN1209885A Apparatus for press-bonding liquid crystal panel and method of producing liquid crystal device
03/03/1999CN1209658A Method for producing film and apparatus for implementing same
03/03/1999CN1209657A Semiconductor device and mfg. method therefor
03/03/1999CN1209655A Lead frame for multiple chips packing and mfg. method therefor
03/03/1999CN1209654A Semiconductor device having alternative long soldering plate and short soldering plate
03/03/1999CN1209653A Mfg. method for semiconductor device
03/03/1999CN1209652A Dynamic random-access storage device structure and mfg. method therefor
03/03/1999CN1209651A Structure formation method
03/03/1999CN1209650A Semiconductor device and mfg. method therefor
03/03/1999CN1209649A Winding automatic-welding spherical-array type integrated circuit packing method
03/03/1999CN1209648A Method for mfg. of semiconductor device
03/03/1999CN1209647A Method for mfg. of dual-polar state induction transistor
03/03/1999CN1209646A Mfg. method for semiconductor device
03/03/1999CN1209645A High-speed deepth-variable etching method and apparatus thereof
03/03/1999CN1209644A Substrate treatment device, substrate supporting device, and method for treatingand mfg. of substrate therefor
03/03/1999CN1209643A Alignment method
03/03/1999CN1209642A Wet treatment device for semiconductor crystal plate
03/03/1999CN1209641A Antistatic method for using conductive needle to photomask
03/03/1999CN1209609A Method for simulating collision ionization phenomenon in semiconductor device
03/03/1999CN1209606A Device analog method
03/03/1999CN1209570A Negative photo slushing compound composition for short-wave long light and method for forming image
03/03/1999CN1209472A Process and apparatus for production of polycrystalline semiconductor crystal ingot
03/03/1999CN1042375C Method for mfg. of semiconductor substrate material
03/03/1999CN1042374C Method for producing semiconductor wafer
03/02/1999US5878322 Heat-dissipating substrate for micro-electronic devices and fabrication method
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